20UPGM23610026

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Serial Number 20UPGM23610026
ProdDB ID  d3325d…c03215
LocalDB ID 66fc950aef991c0043c4acde
Component Type MODULE
Parents No match.
Children 20UPGB43320008 Bare Module 20UPGPQ4610026 PCB 20UPGFC0134521 FE Chip 20UPGFC0134502 FE Chip 20UPGFC0134493 FE Chip 20UPGFC0134484 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal True
Wirebond protection roof presence None
IREF Trim Bit FE1 deleted None
IREF Trim Bit FE2 deleted None
IREF Trim Bit FE3 deleted None
IREF Trim Bit FE4 deleted None
Alternative ID None

 Comments


Test: E_SUMMARY QC Failed

(Stage: MODULE/INITIAL_COLD)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed False
Date a year ago
component ObjectId 66fc950aef991c0043c4acde
Stage MODULE/INITIAL_COLD
Test Type E_SUMMARY
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 6705eb3dc447bfb7e213e7d3
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION localdb-tools v2.2.23-rc5
MODULE_TEMPERATURE -15
QUAD-MODULE_ADC_CALIBRATION 1 2 3 4
QUAD-MODULE_ANALOG_READBACK 1 2 3 4
MODULE_BAD_PIXEL_NUMBER N/A
QUAD-MODULE_DATA_TRANSMISSION 1 2 3 4
MODULE_DISCONNECTED_PIXEL_NUMBER 2
MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER 4671
MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
QUAD-MODULE_INJECTION_CAPACITANCE 1 2 3 4
QUAD-MODULE_LP_MODE 1 2 3 4
QUAD-MODULE_MIN_HEALTH_TEST 1 2 3 4
MODULE_OVERVOLTAGE_PROTECTION -1
MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_1 N/A
MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_2 N/A
MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_3 N/A
MODULE_OVERVOLTAGE_PROTECTION_FE_LINK_4 N/A
QUAD-MODULE_PIXEL_FAILURE_ANALYSIS 1 2 3 4
QUAD-MODULE_SLDO 1 2 3 4
QUAD-MODULE_TUNING 1 2 3 4
MODULE_UNDERSHUNT_PROTECTION -1
MODULE_UNDERSHUNT_PROTECTION_FE_LINK_1 N/A
MODULE_UNDERSHUNT_PROTECTION_FE_LINK_2 N/A
MODULE_UNDERSHUNT_PROTECTION_FE_LINK_3 N/A
MODULE_UNDERSHUNT_PROTECTION_FE_LINK_4 N/A
QUAD-MODULE_VCAL_CALIBRATION 1 2 3 4

Key Data
BAD_PIXEL_NUMBER N/A
DISCONNECTED_PIXEL_NUMBER 1
ELECTRICALLY_BAD_PIXEL_NUMBER 284
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER N/A
DISCONNECTED_PIXEL_NUMBER 0
ELECTRICALLY_BAD_PIXEL_NUMBER 324
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER N/A
DISCONNECTED_PIXEL_NUMBER 1
ELECTRICALLY_BAD_PIXEL_NUMBER 359
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER N/A
DISCONNECTED_PIXEL_NUMBER 0
ELECTRICALLY_BAD_PIXEL_NUMBER 3704
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A

ProductionDB Record

{}

 Current Stage: Insertion of pigtail and strain relief glueing

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Test Local Result ProdDB Record
Module PCB Tab Cutting Information
(CUTTER_PCB_TAB)
No result N/A
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Module reception (MODULE/RECEPTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Module Complete (MODULE/COMPLETE)

Module graveyard - damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Final Warm (MODULE/FINAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Longterm stability DCS
(LONG_TERM_STABILITY_DCS)
No result N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Thermal Cycling
(THERMAL_CYCLING)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A
Wire bonding protection roof envelope
(WP_ENVELOPE)
No result N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test Local Result ProdDB Record
Parylene Properties
(PARYLENE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial Cold (MODULE/INITIAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Registered
Wirebonding Information
(WIREBONDING)
Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
Registered Registered
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Registered
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
670495…46106d MODULE/INITIAL_COLD IV_MEASURE KojiNakamura N/A a year ago No tags Selected
6705eb…13e7d3 MODULE/INITIAL_COLD E_SUMMARY KojiNakamura N/A a year ago No tags Selected
670342…13acac MODULE/INITIAL_WARM IV_MEASURE KojiNakamura N/A a year ago No tags Selected
6703aa…13bc25 MODULE/INITIAL_WARM E_SUMMARY KojiNakamura N/A a year ago No tags Selected
67026e…46100a MODULE/ASSEMBLY QUAD_MODULE_METROLOGY KojiNakamura N/A a year ago No tags Selected
670270…461032 MODULE/ASSEMBLY FLATNESS KojiNakamura N/A a year ago No tags Selected
66fe15…136551 MODULE/ASSEMBLY VISUAL_INSPECTION KojiNakamura N/A a year ago No tags Selected
66fdef…135dea MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH KojiNakamura N/A a year ago No tags Selected
66fdef…135de8 MODULE/ASSEMBLY MASS_MEASUREMENT KojiNakamura N/A a year ago No tags Selected
66ff41…138d87 MODULE/WIREBONDING VISUAL_INSPECTION KojiNakamura N/A a year ago No tags Selected
66ff40…138d85 MODULE/WIREBONDING WIREBOND_PULL_TEST KojiNakamura N/A a year ago No tags Selected
66ff40…122d22 MODULE/WIREBONDING WIREBONDING KojiNakamura N/A a year ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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