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20UPGB43320008
Quad-BareModule/ITkPix_v2/HPK
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Component Information

Item Value
Serial Number 20UPGB43320008
Production DB Component ID aac38c169adae40946a838fff6aa4b9a
LocalDB Component ID 66f0618ad7e818004374c6a5
Component Type bare_module
Super-Component 20UPGM23610026 
Sub-Components •  20UPGFC0134521   FE Chip
•  20UPGFC0134502   FE Chip
•  20UPGFC0134493   FE Chip
•  20UPGFC0134484   FE Chip
•  20UPGS33300929   Sensor Tile
Flags

Properties

Item Data Type Value
FE chip version codeTable 3
Sensor Type codeTable 5
Vendor code codeTable 3
Thickness of FE chips (RD53A) codeTable None

Comments

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

  Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

  Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

  Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

  Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

  Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

  Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

  Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

  Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

  Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

  Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

  Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

  Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

  Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

  Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

  Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: Reception at ITk institute (BAREMODULERECEPTION) Complete

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Flatness
(FLATNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Not to be used for the detector (NOT_USED) Complete

No tests are allocated for this stage.

  Stage: Bare module failed test, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Bare module assembly (BAREMODULEASSEMBLY) Complete

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66f650d262de602d4549a878 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV KojiNakamura 2024-09-29 06:03:10 PDT(-0700) Selected
66f64fd362de602d4549a83e BAREMODULERECEPTION FLATNESS KojiNakamura 2024-09-29 06:03:05 PDT(-0700) Selected
66f4bf18d7d71d0ad4cf768a BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY KojiNakamura 2024-09-29 06:02:59 PDT(-0700) Selected
66f26651f29e45c7cb92d099 BAREMODULERECEPTION VISUAL_INSPECTION KojiNakamura 2024-09-29 06:02:54 PDT(-0700) Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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