Database for ITk Pixel Module

Item	Value
Serial Number	20 U PG M2 3610026
Production DB Component ID	d3325dc2e385155027623f41e5c03215
LocalDB Component ID	66fc950aef991c0043c4acde
Component Type	module
Super-Component	No match.
Sub-Components	• 20 U PG B4 3320008 Bare Module • 20 U PG PQ 4610026 PCB • 20 U PG FC 0134521 FE Chip • 20 U PG FC 0134502 FE Chip • 20 U PG FC 0134493 FE Chip • 20 U PG FC 0134484 FE Chip
Flags

Key	Data
QC Passed	True
Date	2024-10-06 04:18:14 PDT(-0700)
component ObjectId	66fc950aef991c0043c4acde
Stage	MODULE/ASSEMBLY
Test Type	QUAD_MODULE_METROLOGY
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	67026ed285a860946946100a
ObjectId of RAW record	66fe1515c447bfb7e213654a

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
ANGLE_PCB_BM	0.022517983936933224
AVERAGE_THICKNESS	[583.4, 579.3, 587.7, 587.8]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT	[2222, 805]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT	[2194, 704]
HV_CAPACITOR_THICKNESS	2296
STD_DEVIATION_THICKNESS	[1.7, 1.6, 5.2, 5.9]
THICKNESS_INCLUDING_POWER_CONNECTOR	1928
THICKNESS_VARIATION_PICKUP_AREA	8

Expand ProductionDB Record

670271f5f081870042e1711c

state

ready

stateTs

2024-10-06T11:18:13.936Z

stateUserIdentity

24-779-1

date

2024-10-03T03:52:00.000Z

testType

id	627a356dba163f000ab63233
code	QUAD_MODULE_METROLOGY
name	Quad Module Metrology
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

67026ed285a860946946100a

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.14	None	None

results

code ANGLE_PCB_BM
name Angle between PCB and bare module [deg]
dataType float
valueType single
arrayDimensions None
additional False
value 0.022517983936933224
associateChild None
code AVERAGE_THICKNESS
name Average module thickness at FE chip pick-up areas, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
583.4
579.3
587.7
587.8
associateChild None

code	DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
name	Distance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2222 805
associateChild	None

code	DISTANCE_PCB_BARE_MODULE_TOP_LEFT
name	Distance of PCB fiducial to bare module fiducial top left (x and y) [µm]
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2194 704
associateChild	None

code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 2296
associateChild None
code STD_DEVIATION_THICKNESS
name Std deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
1.7
1.6
5.2
5.9
associateChild None

code	THICKNESS_INCLUDING_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [µm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1928
associateChild	None

code THICKNESS_VARIATION_PICKUP_AREA
name Thickness variation of the 4 pick-up areas [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 8
associateChild None

cts

2024-10-06T11:18:13.936Z

sys

cts	2024-10-06T11:18:13.936Z
mts	2024-10-06T11:18:14.742Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

6749917e2fb3fe528bdb512304527d82

2024-10-06T11:18:14.269Z

RAW

text/plain

file

True

20UPGM23610026_MODULE__ASSEMBLY_QUAD_MODULE_METROLOGY_670271f5f081870042e1711c_66fe1515c447bfb7e213654a.json

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66fc950aef991c0043c4acde

d3325dc2e385155027623f41e5c03215

ready

2024-10-02T00:34:18.384Z

3168-5516-1

False

None

False

None

20UPGM23610026

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	0
initial	True
final	False

code	HR
name	Hayashi-Repic Co.

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Results Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

Results Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

Results Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

Test	Local Result	ProdDB Record
Module PCB Tab Cutting Information (CUTTER_PCB_TAB)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Mass Measurement (MASS_MEASUREMENT)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Module reception (MODULE/RECEPTION) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

Results Stage: Final Cold (MODULE/FINAL_COLD) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Final Warm (MODULE/FINAL_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Longterm stability DCS (LONG_TERM_STABILITY_DCS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Flatness (FLATNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Thermal Cycling (THERMAL_CYCLING)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Mass Measurement (MASS_MEASUREMENT)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wire bonding protection roof envelope (WP_ENVELOPE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Flatness (FLATNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
IV measurement (IV_MEASURE)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!

Results Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
IV measurement (IV_MEASURE)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Wirebond pull test (WIREBOND_PULL_TEST)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Wirebonding Information (WIREBONDING)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Mass Measurement (MASS_MEASUREMENT)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology (TRIPLET_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
6704952985a860946946106d	MODULE/INITIAL_COLD	IV_MEASURE	KojiNakamura	2024-10-08 20:21:44 PDT(-0700)	Selected
6705eb3dc447bfb7e213e7d3	MODULE/INITIAL_COLD	E_SUMMARY	KojiNakamura	2024-10-08 20:21:35 PDT(-0700)	Selected
67034254c447bfb7e213acac	MODULE/INITIAL_WARM	IV_MEASURE	KojiNakamura	2024-10-07 02:52:04 PDT(-0700)	Selected
6703aac3c447bfb7e213bc25	MODULE/INITIAL_WARM	E_SUMMARY	KojiNakamura	2024-10-07 02:51:55 PDT(-0700)	Selected
67026ed285a860946946100a	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	KojiNakamura	2024-10-06 04:18:14 PDT(-0700)	Selected
6702707585a8609469461032	MODULE/ASSEMBLY	FLATNESS	KojiNakamura	2024-10-06 04:18:08 PDT(-0700)	Selected
66fe15d3c447bfb7e2136551	MODULE/ASSEMBLY	VISUAL_INSPECTION	KojiNakamura	2024-10-06 04:18:02 PDT(-0700)	Selected
66fdef2ac447bfb7e2135dea	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	KojiNakamura	2024-10-06 04:17:04 PDT(-0700)	Selected
66fdef03c447bfb7e2135de8	MODULE/ASSEMBLY	MASS_MEASUREMENT	KojiNakamura	2024-10-06 04:16:59 PDT(-0700)	Selected
66ff4179c447bfb7e2138d87	MODULE/WIREBONDING	VISUAL_INSPECTION	KojiNakamura	2024-10-03 18:19:31 PDT(-0700)	Selected
66ff40c2c447bfb7e2138d85	MODULE/WIREBONDING	WIREBOND_PULL_TEST	KojiNakamura	2024-10-03 18:18:47 PDT(-0700)	Selected
66ff4042ed4e82ade5122d22	MODULE/WIREBONDING	WIREBONDING	KojiNakamura	2024-10-03 18:18:43 PDT(-0700)	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Item	Data Type	Value
FE chip version	codeTable	3
PCB-Bare Orientation isNormal	boolean	True
Wirebond protection roof presence	boolean	None
IREF Trim Bit FE1	integer	None
IREF Trim Bit FE2	integer	None
IREF Trim Bit FE3	integer	None
IREF Trim Bit FE4	integer	None
Alternative ID	string	None

20 U PG M2 3610026 Outer-Quad-Module/ITkPix_v2 ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Results Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

Results Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

Results Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

Results Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

Results Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

Results Stage: Module reception (MODULE/RECEPTION) Complete

Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

Results Stage: Final Cold (MODULE/FINAL_COLD) Complete

Results Stage: Final Warm (MODULE/FINAL_WARM) Complete

Results Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

Results Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

Results Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

Results Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

Results Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

Results Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

Results Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

Results Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

Results Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

Results Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Results Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

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20 U PG M2 3610026
Outer-Quad-Module/ITkPix_v2

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