Top Page > Component List > 20UPGM23610026 > QC Result / MODULE/WIREBONDING / VISUAL_INSPECTION

20UPGM23610026
Outer-Quad-Module/ITkPix_v2
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGM23610026
Production DB Component ID d3325dc2e385155027623f41e5c03215
LocalDB Component ID 66fc950aef991c0043c4acde
Component Type module
Super-Component No match.
Sub-Components •  20UPGB43320008   Bare Module
•  20UPGPQ4610026   PCB
•  20UPGFC0134521   FE Chip
•  20UPGFC0134502   FE Chip
•  20UPGFC0134493   FE Chip
•  20UPGFC0134484   FE Chip
Flags

Properties

Item Data Type Value
FE chip version codeTable 3
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
IREF Trim Bit FE1 integer None
IREF Trim Bit FE2 integer None
IREF Trim Bit FE3 integer None
IREF Trim Bit FE4 integer None
Alternative ID string None

Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/WIREBONDING)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-10-03 18:19:31 PDT(-0700)
component ObjectId 66fc950aef991c0043c4acde
Stage MODULE/WIREBONDING
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66ff4179c447bfb7e2138d87
ObjectId of RAW record 66ff4178c447bfb7e2138d86

Results

Key Data
ANALYSIS_VERSION mqat v1.0.14
FE_CHIP_CONDITION_PASSED_QC 1
GLUE_DISTRIBUTION_PASSED_QC 1
OBSERVATION -
PARYLENE_COATING_PASSED_QC 1
SENSOR_CONDITION_PASSED_QC 1
SMD_COMPONENTS_PASSED_QC 2
WIREBONDING_PASSED_QC 1

Visual Inspection Defects

Download front_image
Filename Contents Defects Comment

front_tile0

Download front_tile0
iref=10

front_tile15

Download front_tile15
  • Dusts_PCB

front_tile17

Download front_tile17
iref=13

front_tile18

Download front_tile18
iref=9

front_tile35

Download front_tile35
iref=14

RAW Results Record

Download RAW
serialNumber20UPGM23610026
testTypeVISUAL_INSPECTION
subtestTypeNone
results
property
ANALYSIS_VERSIONNone
OPERATORitkqc
INSTRUMENT
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGM23610026
front_defects
15
  • Yellow.Dusts_PCB
front_comments
0iref=10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17iref=13
18iref=9
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35iref=14
front_image670eb4c551efdba6c5f3d845
front_defect_images
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15670eb4c451efdba6c5f3d804
17670eb4c351efdba6c5f3d7e8
18670eb4c351efdba6c5f3d7e5
35670eb4c451efdba6c5f3d80a
Metadata
Measurements
DEFECTSNone
SMD_COMPONENTS_PASSED_QCNone
SENSOR_CONDITION_PASSED_QCNone
FE_CHIP_CONDITION_PASSED_QCNone
GLUE_DISTRIBUTION_PASSED_QCNone
WIREBONDING_PASSED_QCNone
PARYLENE_COATING_PASSED_QCNone
OBSERVATIONNone
stageMODULE/WIREBONDING
component66fc950aef991c0043c4acde
dbVersion1.01
address64657cef8d79bac1f3f005d9
sys
mts2024-10-04 01:14:32.395000
cts2024-10-04 01:14:32.395000
rev0

ProductionDB Record

id66ff427bef991c0043d1e489
stateready
stateTs2024-10-04T01:18:51.221Z
stateUserIdentity24-779-1
date2024-10-04T01:14:00.000Z
testType
id6418292ae43ca10038f30f84
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id64229fe1b8fd040036839f29
codeHR
nameHayashi-Repic Co.
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber66ff4179c447bfb7e2138d87
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0.14NoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalrangeMinrangeMaxvalueassociateChild
FE_CHIP_CONDITION_PASSED_QCFE chip condition passed QC (1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone1None
GLUE_DISTRIBUTION_PASSED_QCGlue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone1None
OBSERVATIONObservationstringsingleNoneFalseNoneNone-None
PARYLENE_COATING_PASSED_QCParylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone1None
SENSOR_CONDITION_PASSED_QCSensor condition passed QC (1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone1None
SMD_COMPONENTS_PASSED_QCSMD components passed QC (1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone2None
WIREBONDING_PASSED_QCWirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)integersingleNoneNoneNoneNone1None
cts2024-10-04T01:18:51.221Z
sys
cts2024-10-04T01:18:51.221Z
mts2024-10-04T01:19:31.098Z
rev9
defects
codenamedescriptionproperties
c5e4c4145f2f5148fa69f9c3front_tile15Yellow.Dusts_PCB
comments
codedateTimecommentuser
842d0fead808cc43ce22c2de2024-10-04T01:19:31.098Ztile_comment::front_tile0 : iref=10
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
5d28f758c271b404c490ca9c2024-10-04T01:19:31.098Ztile_comment::front_tile17 : iref=13
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
8c2237f76c4a020d694583432024-10-04T01:19:31.098Ztile_comment::front_tile18 : iref=9
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
f770b171b81b4fe32c46ea872024-10-04T01:19:31.098Ztile_comment::front_tile35 : iref=14
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
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components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
66fc950aef991c0043c4acded3325dc2e385155027623f41e5c03215ready2024-10-02T00:34:18.384Z3168-5516-1FalseFalseNoneNoneFalseNoneNone20UPGM23610026None
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
codeMODULE/WIREBONDING
nameWire Bonding
order1
initialFalse
finalFalse
codeHR
nameHayashi-Repic Co.

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

  Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

  Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

  Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

Test Local Result ProdDB Record
Module PCB Tab Cutting Information
(CUTTER_PCB_TAB)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Module reception (MODULE/RECEPTION) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

  Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

  Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

  Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

  Stage: Final Cold (MODULE/FINAL_COLD) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Final Warm (MODULE/FINAL_WARM) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Longterm stability DCS
(LONG_TERM_STABILITY_DCS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Thermal Cycling
(THERMAL_CYCLING)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wire bonding protection roof envelope
(WP_ENVELOPE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

Test Local Result ProdDB Record
Parylene Properties
(PARYLENE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
IV measurement
(IV_MEASURE)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
IV measurement
(IV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebonding Information
(WIREBONDING)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test Local Result ProdDB Record
Flatness
(FLATNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Mass Measurement
(MASS_MEASUREMENT)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
6704952985a860946946106d MODULE/INITIAL_COLD IV_MEASURE KojiNakamura 2024-10-08 20:21:44 PDT(-0700) Selected
6705eb3dc447bfb7e213e7d3 MODULE/INITIAL_COLD E_SUMMARY KojiNakamura 2024-10-08 20:21:35 PDT(-0700) Selected
67034254c447bfb7e213acac MODULE/INITIAL_WARM IV_MEASURE KojiNakamura 2024-10-07 02:52:04 PDT(-0700) Selected
6703aac3c447bfb7e213bc25 MODULE/INITIAL_WARM E_SUMMARY KojiNakamura 2024-10-07 02:51:55 PDT(-0700) Selected
67026ed285a860946946100a MODULE/ASSEMBLY QUAD_MODULE_METROLOGY KojiNakamura 2024-10-06 04:18:14 PDT(-0700) Selected
6702707585a8609469461032 MODULE/ASSEMBLY FLATNESS KojiNakamura 2024-10-06 04:18:08 PDT(-0700) Selected
66fe15d3c447bfb7e2136551 MODULE/ASSEMBLY VISUAL_INSPECTION KojiNakamura 2024-10-06 04:18:02 PDT(-0700) Selected
66fdef2ac447bfb7e2135dea MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH KojiNakamura 2024-10-06 04:17:04 PDT(-0700) Selected
66fdef03c447bfb7e2135de8 MODULE/ASSEMBLY MASS_MEASUREMENT KojiNakamura 2024-10-06 04:16:59 PDT(-0700) Selected
66ff4179c447bfb7e2138d87 MODULE/WIREBONDING VISUAL_INSPECTION KojiNakamura 2024-10-03 18:19:31 PDT(-0700) Selected
66ff40c2c447bfb7e2138d85 MODULE/WIREBONDING WIREBOND_PULL_TEST KojiNakamura 2024-10-03 18:18:47 PDT(-0700) Selected
66ff4042ed4e82ade5122d22 MODULE/WIREBONDING WIREBONDING KojiNakamura 2024-10-03 18:18:43 PDT(-0700) Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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