20UPGM23610026

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

View QC Summary

Component Information

Serial Number 20UPGM23610026
ProdDB ID  d3325d…c03215
LocalDB ID 66fc950aef991c0043c4acde
Component Type MODULE
Parents No match.
Children 20UPGB43320008 Bare Module 20UPGPQ4610026 PCB 20UPGFC0134521 FE Chip 20UPGFC0134502 FE Chip 20UPGFC0134493 FE Chip 20UPGFC0134484 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal True
Wirebond protection roof presence None
IREF Trim Bit FE1 deleted None
IREF Trim Bit FE2 deleted None
IREF Trim Bit FE3 deleted None
IREF Trim Bit FE4 deleted None
Alternative ID None

 Comments


Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)


Result of Wirebond Pull Test

Scan

Key Data
component id 66fc950aef991c0043c4acde
Stage MODULE/WIREBONDING
test Type WIREBOND_PULL_TEST
institute 64657cef8d79bac1f3f005d9
user KojiNakamura

Result

Key Data
properties {'ANALYSIS_VERSION': '1.0.14', 'INSTRUMENT': 'DAGE 400', 'OPERATOR': 'suzuki'} g
BOND_PEEL 0 g
HEEL_BREAKS_ON_FE_CHIP 72 g
HEEL_BREAKS_ON_PCB 0 g
PULL_STRENGTH 9.0838 g
PULL_STRENGTH_ERROR 0.43864279317002364 g
PULL_STRENGTH_GRADING <span class="badge badge-warning">N/A</span> g
PULL_STRENGTH_MAX 9.46 g
PULL_STRENGTH_MIN 7.893 g
WIRE_BREAKS_5G 0 g
WIRE_PULLS 25 g

RAW Results Record

Download RAW
_id66ff40c1c447bfb7e2138d84
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGM23610026WIREBOND_PULL_TESTNone
property
OPERATORsuzuki
INSTRUMENTDAGE 400
ANALYSIS_VERSIONNone
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGM23610026
pull_data
strengthbreak_mode
9.412Midspan break
9.343Midspan break
9.345Heel break on chip
9.401Heel break on chip
9.305Heel break on chip
9.363Midspan break
9.428Midspan break
9.46Midspan break
9.224Heel break on chip
9.313Heel break on chip
9.127Heel break on chip
8.974Heel break on chip
9.4Heel break on chip
9.334Heel break on chip
9.12Heel break on chip
8.513Heel break on chip
7.893Heel break on chip
8.558Heel break on chip
8.256Heel break on chip
8.221Heel break on chip
9.057Heel break on chip
9.38Midspan break
9.242Heel break on chip
9.071Heel break on chip
9.355Midspan break
Metadata
Measurements
WIRE_PULLSNone
PULL_STRENGTHNone
PULL_STRENGTH_ERRORNone
WIRE_BREAKS_5GNone
PULL_STRENGTH_MINNone
PULL_STRENGTH_MAXNone
HEEL_BREAKS_ON_FE_CHIPNone
HEEL_BREAKS_ON_PCBNone
BOND_PEELNone
PULL_STRENGTH_GRADINGNone
MODULE/WIREBONDING66fc950aef991c0043c4acde1.0164657cef8d79bac1f3f005d9
mts2024-10-04 01:11:29.376000
cts2024-10-04 01:11:29.376000
rev0
rawHash8fbaf20ec7f78063d0ec015673878074
stageMODULE/WIREBONDING

ProductionDB Record

id66ff4277ef991c0043d1e470
stateready
stateTs2024-10-04T01:18:47.094Z
stateUserIdentity24-779-1
date2024-10-04T01:11:00.000Z
testType
id63fb635d4069b50036d3faac
codeWIREBOND_PULL_TEST
nameWirebond pull test
stateactive
institution
id64229fe1b8fd040036839f29
codeHR
nameHayashi-Repic Co.
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber66ff40c2c447bfb7e2138d85
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0.14NoneNone
INSTRUMENTInstrumentstringsingleFalseDAGE 400NoneNone
OPERATOROperatorstringsingleFalsesuzukiNoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalrangeMinrangeMaxvalueassociateChild
BOND_PEELPercentage of bond peel on FE chip or PCB [%]floatsingleNoneFalseNoneNone0None
HEEL_BREAKS_ON_FE_CHIPPercentage of heel breaks on FE chips [%]floatsingleNoneFalseNoneNone72None
HEEL_BREAKS_ON_PCBPercentage of heel breaks on PCB [%]floatsingleNoneFalseNoneNone0None
PULL_STRENGTHMean pull strength [g]floatsingleNoneFalseNoneNone9.0838None
PULL_STRENGTH_ERRORStd deviation of pull strength [g]floatsingleNoneFalseNoneNone0.43864279317002364None
PULL_STRENGTH_GRADINGPull strength grade data arrayfloatarrayNoneFalseNoneNoneNoneNone
PULL_STRENGTH_MAXMaximum pull strength [g]floatsingleNoneFalseNoneNone9.46None
PULL_STRENGTH_MINMinimum pull strength [g]floatsingleNoneFalseNoneNone7.893None
WIRE_BREAKS_5GNumber of wires breaking before 5gintegersingleNoneFalseNoneNone0None
WIRE_PULLSNumber of wires pulledintegersingleNoneFalseNoneNone25None
cts2024-10-04T01:18:47.094Z
sys
cts2024-10-04T01:18:47.094Z
mts2024-10-04T01:18:47.869Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypebinaryStoreg02filenameuser
f345c2f31aff9f72a22f9739bc62f9ad2024-10-04T01:18:47.534ZRAWRAWtext/plainfileTrue20UPGM23610026_MODULE__WIREBONDING_WIREBOND_PULL_TEST_66ff4277ef991c0043d1e470_66ff40c1c447bfb7e2138d84.json
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
66fc950aef991c0043c4acded3325dc2e385155027623f41e5c03215ready2024-10-02T00:34:18.384Z3168-5516-1FalseFalseNoneNoneFalseNoneNone20UPGM23610026None
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
codeMODULE/WIREBONDING
nameWire Bonding
order1
initialFalse
finalFalse
codeHR
nameHayashi-Repic Co.

 Current Stage: Insertion of pigtail and strain relief glueing

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Test Local Result ProdDB Record
Module PCB Tab Cutting Information
(CUTTER_PCB_TAB)		 No result N/A
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Module reception (MODULE/RECEPTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Module Complete (MODULE/COMPLETE)

Module graveyard - damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Final Warm (MODULE/FINAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Longterm stability DCS
(LONG_TERM_STABILITY_DCS)		 No result N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
Flatness
(FLATNESS)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Thermal Cycling
(THERMAL_CYCLING)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A
Wire bonding protection roof envelope
(WP_ENVELOPE)		 No result N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
Flatness
(FLATNESS)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test Local Result ProdDB Record
Parylene Properties
(PARYLENE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Initial Cold (MODULE/INITIAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 Registered Registered
IV measurement
(IV_MEASURE)		 Registered Registered

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 Registered Registered
IV measurement
(IV_MEASURE)		 Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)		 Registered Registered
Wirebonding Information
(WIREBONDING)		 Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)		 Registered Registered
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)		 Registered Registered
Mass Measurement
(MASS_MEASUREMENT)		 Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)		 Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
670495…46106d MODULE/INITIAL_COLD IV_MEASURE KojiNakamura N/A a year ago No tags Selected
6705eb…13e7d3 MODULE/INITIAL_COLD E_SUMMARY KojiNakamura N/A a year ago No tags Selected
670342…13acac MODULE/INITIAL_WARM IV_MEASURE KojiNakamura N/A a year ago No tags Selected
6703aa…13bc25 MODULE/INITIAL_WARM E_SUMMARY KojiNakamura N/A a year ago No tags Selected
67026e…46100a MODULE/ASSEMBLY QUAD_MODULE_METROLOGY KojiNakamura N/A a year ago No tags Selected
670270…461032 MODULE/ASSEMBLY FLATNESS KojiNakamura N/A a year ago No tags Selected
66fe15…136551 MODULE/ASSEMBLY VISUAL_INSPECTION KojiNakamura N/A a year ago No tags Selected
66fdef…135dea MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH KojiNakamura N/A a year ago No tags Selected
66fdef…135de8 MODULE/ASSEMBLY MASS_MEASUREMENT KojiNakamura N/A a year ago No tags Selected
66ff41…138d87 MODULE/WIREBONDING VISUAL_INSPECTION KojiNakamura N/A a year ago No tags Selected
66ff40…138d85 MODULE/WIREBONDING WIREBOND_PULL_TEST KojiNakamura N/A a year ago No tags Selected
66ff40…122d22 MODULE/WIREBONDING WIREBONDING KojiNakamura N/A a year ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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