Database for ITk Pixel Module

Serial Number	20UPGM23622030
ProdDB ID	70b7c1…2d3f66
LocalDB ID	693066ade5445267087319d2
Component Type	MODULE
Parents	No match.
Children	20UPGB43347167 Bare Module 20UPGFC0230282 FE Chip 20UPGFC0230281 FE Chip 20UPGFC0230279 FE Chip 20UPGFC0230280 FE Chip 20UPGPQ4622030 PCB
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
QC Passed	True
Date	4 months ago
component ObjectId	693066ade5445267087319d2
Stage	MODULE/ASSEMBLY
Test Type	GLUE_MODULE_FLEX_ATTACH
Institute ObjectId
User Name	Shift-LeaderHayashi-REPIC-KEK
ObjectId of this record	6930d871768b5c00313b6064
ObjectId of RAW record	6930d86f768b5c00313b6063
Tags	No tags

Key	Data
BATCH_NUMBER	ADN0259300
CURE_TIME	23.5
GLUE_TYPE	Araldite 2011
LOCATION_ASSEMBLY	HR
MEASUREMENT_DATE	2025-12-04T00:40:05.000+00:00
OPERATOR_IDENTITY	Y.Ui
RATIO	0.5
TOOL_ID	2
TOOL_TYPE	2
HUMIDITY	40.981
TEMP	23.718

Expand ProductionDB Record

6930df1488b791b617a90ff0

state

ready

stateTs

2025-12-04T01:08:36.198Z

stateUserIdentity

9833-9995-1

date

2025-12-04T00:40:00.000Z

testType

id	5d13188702c38f00090aaad9
code	GLUE_MODULE_FLEX_ATTACH
name	Glue Information Module+Flex Attach
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

runNumber

6930d871768b5c00313b6064

passed

True

problems

False

properties

code BATCH_NUMBER
name Glue Batch Number
dataType string
valueType single
required True
value ADN0259300
code CURE_TIME
name Cure time [h]
dataType float
valueType None
required False
value 23.5
rangeMin None
rangeMax None
code GLUE_TYPE
name Glue type
dataType string
valueType single
required True
value Araldite 2011
code LOCATION_ASSEMBLY
name Location of assembly
dataType string
valueType None
required False
value HR
rangeMin None
rangeMax None
code MEASUREMENT_DATE
name Date of assembly
dataType datetime
valueType None
required False
value 2025-12-04T00:40:05.000+00:00
rangeMin None
rangeMax None
code OPERATOR_IDENTITY
name Operator identity
dataType string
valueType single
required False
value Y.Ui
rangeMin None
rangeMax None
code RATIO
name Ratio of epoxy mixture
dataType float
valueType single
required False
value 0.5
code TOOL_ID
name Tool ID
dataType integer
valueType single
required False
value 2
rangeMin None
rangeMax None
code TOOL_TYPE
name Tool type
dataType codeTable
valueType single
required False
value 2
codeTable
code value
1 Common
2 Japan
3 Oxford
4 triplet

results

code	name	order	dataType	valueType	additional	rangeMin	rangeMax	value	associateChild
HUMIDITY	Humidity (%)	1	float	single	False	None	None	40.981	None
TEMP	Room Temperature (C)	1	float	single	False	None	None	23.718	None

cts

2025-12-04T01:08:36.198Z

sys

cts	2025-12-04T01:08:36.198Z
mts	2025-12-04T01:08:37.032Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

13e7b94bdc80c70ad3a9dec8fcee4d28

2025-12-04T01:08:36.662Z

RAW

application/json

file

True

data

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

693066ade5445267087319d2

70b7c1bcddd2778f41278371ec2d3f66

ready

2025-12-03T16:34:53.434Z

9833-9995-1

False

None

False

None

20UPGM23622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	HR
name	Hayashi-Repic Co.

Test Type	Local Result
Flatness (FLATNESS)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
Parylene (de-)masking (DE_MASKING)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
6930dd…e13760	QUAD_MODULE_METROLOGY	Pass	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	2.7.1	No tags	Selected
6930dc…e1375c	VISUAL_INSPECTION	Pass	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	2.7.1	No tags	Selected
6930d8…3b6064	GLUE_MODULE_FLEX_ATTACH	Pass	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago		No tags	Selected
6930d8…3b6062	MASS_MEASUREMENT	Pass	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	2.6.2.dev49	No tags	Selected

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	Registered	Registered
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6940f5…3b66a9	MODULE/PARYLENE_MASKING	DE_MASKING	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
69410e…985b20	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
69363e…7f3c28	MODULE/INITIAL_WARM	IV_MEASURE	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
693666…3602c2	MODULE/INITIAL_WARM	E_SUMMARY	Shift-LeaderHayashi-REPIC-KEK	N/A	4 months ago	No tags	Selected
693632…7f3b75	MODULE/WIREBONDING	VISUAL_INSPECTION	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
69362e…3b6343	MODULE/WIREBONDING	WIREBONDING	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
6930dd…e13760	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
6930dc…e1375c	MODULE/ASSEMBLY	VISUAL_INSPECTION	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
6930d8…3b6064	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected
6930d8…3b6062	MODULE/ASSEMBLY	MASS_MEASUREMENT	Shift-LeaderHayashi-REPIC-KEK	4 months ago	4 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23622030

MODULE/PARYLENE_UNMASKING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: GLUE_MODULE_FLEX_ATTACH QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Candidate TestRuns of this Stage

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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