20UPGB43347167

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number 20UPGB43347167
ProdDB ID  bfe11a…fd94f8
LocalDB ID 68e8b5a6b5f1d1f55a4e220c
Component Type BARE_MODULE
Parents 20UPGM23622030 
Children 20UPGFC0230282 FE Chip 20UPGFC0230281 FE Chip 20UPGFC0230279 FE Chip 20UPGFC0230280 FE Chip 20UPGS33302092 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 3
Thickness of FE chips (RD53A) None

 Comments

 Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)		 Registered Registered
Flatness
(FLATNESS)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)		 Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
68f5d8…9f0719 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV YujiEnari 6 months ago 6 months ago No tags Selected
68fb30…9f0c20 BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY YujiEnari 6 months ago 6 months ago No tags Selected
68fb30…9f0c1e BAREMODULERECEPTION VISUAL_INSPECTION YujiEnari 6 months ago 6 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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