20UPGB43347167

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGB43347167
ProdDB ID	bfe11a…fd94f8
LocalDB ID	68e8b5a6b5f1d1f55a4e220c
Component Type	BARE_MODULE
Parents	20UPGM23622030
Children	20UPGFC0230282 FE Chip 20UPGFC0230281 FE Chip 20UPGFC0230279 FE Chip 20UPGFC0230280 FE Chip 20UPGS33302092 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	3
Thickness of FE chips (RD53A)	None

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	6 months ago
component ObjectId	68e8b5a6b5f1d1f55a4e220c
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	YujiEnari
ObjectId of this record	68fb30b78bc3fa9c0b9f0c20
ObjectId of RAW record	68fb30b68bc3fa9c0b9f0c1f
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.3.1.dev27
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	None
BARE_MODULE_THICKNESS	329
BARE_MODULE_THICKNESS_STD_DEVIATION	3.4
FECHIPS_X	42.2
FECHIPS_Y	40.3
FECHIP_THICKNESS	158.1
FECHIP_THICKNESS_STD_DEVIATION	1.7
SENSOR_THICKNESS	158.5
SENSOR_THICKNESS_STD_DEVIATION	4
SENSOR_X	39.5
SENSOR_Y	41.1

RAW Results Record

Download RAW

_id

68fb30b68bc3fa9c0b9f0c1f

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGB43347167

QUAD_BARE_MODULE_METROLOGY

property

ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	None
QUAD_BARE_MODULE_METROLOGY_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGB43347167

TimeStart

1761292318

Institution

KEK

component

20UPGB43347167

componentType

BARE_MODULE

stage

BAREMODULERECEPTION

testType

QUAD_BARE_MODULE_METROLOGY

date

2025-10-24T16:54:20.726+09:00

results

SENSOR_X	39.514
SENSOR_Y	41.103
FECHIPS_X	42.197
FECHIPS_Y	40.295
FECHIP_THICKNESS	158.1
FECHIP_THICKNESS_STD_DEVIATION	1.7
BARE_MODULE_THICKNESS	329.0
BARE_MODULE_THICKNESS_STD_DEVIATION	3.4
SENSOR_THICKNESS	158.5
SENSOR_THICKNESS_STD_DEVIATION	4.0

passed

True

problems

False

runNumber

comment

Measurements

SENSOR_X

X	False
Unit	mm
Values	39.5

SENSOR_Y

X	False
Unit	mm
Values	41.1

FECHIPS_X

X	False
Unit	mm
Values	42.2

FECHIPS_Y

X	False
Unit	mm
Values	40.3

FECHIP_THICKNESS

X	False
Unit	um
Values	158.1

FECHIP_THICKNESS_STD_DEVIATION

X	False
Unit	um
Values	1.7

BARE_MODULE_THICKNESS

X	False
Unit	um
Values	329.0

BARE_MODULE_THICKNESS_STD_DEVIATION

X	False
Unit	um
Values	3.4

SENSOR_THICKNESS

X	False
Unit	um
Values	158.5

SENSOR_THICKNESS_STD_DEVIATION

X	False
Unit	um
Values	4.0

SENSOR_X

None

SENSOR_Y

None

SENSOR_THICKNESS

None

SENSOR_THICKNESS_STD_DEVIATION

None

FECHIPS_X

None

FECHIPS_Y

None

FECHIP_THICKNESS

None

FECHIP_THICKNESS_STD_DEVIATION

None

BARE_MODULE_THICKNESS

None

BARE_MODULE_THICKNESS_STD_DEVIATION

None

BAREMODULERECEPTION

68e8b5a6b5f1d1f55a4e220c

1.01

64657cef8d79bac1f3f0057a

mts	2025-10-24 07:54:30.815000
cts	2025-10-24 07:54:30.815000
rev	0

rawHash

278c812524c94a3d76956858fa6b2c86

stage

BAREMODULERECEPTION

ProductionDB Record

Expand ProductionDB Record

68fbc16b46c81c946f64e177

state

ready

stateTs

2025-10-24T18:11:55.095Z

stateUserIdentity

4940-829-1

date

2025-10-24T07:54:00.000Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	669834593510e900431bfe36
userIdentity	4940-829-1
firstName	Yuji
middleName
lastName	Enari

runNumber

68fb30b78bc3fa9c0b9f0c20

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.3.1.dev27	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	None	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	None	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
BARE_MODULE_THICKNESS	Average bare module thickness [µm]	float	single	None	False	329	None
BARE_MODULE_THICKNESS_STD_DEVIATION	Std deviation of bare module thickness [µm]	float	single	None	False	3.4	None
FECHIPS_X	FE chips x dimension [mm]	float	single	1	False	42.2	None
FECHIPS_Y	FE chips y dimension [mm]	float	single	1	False	40.3	None
FECHIP_THICKNESS	Average FE chip thickness [µm]	float	single	None	False	158.1	None
FECHIP_THICKNESS_STD_DEVIATION	Std deviation of FE chip thickness [µm]	float	single	None	False	1.7	None
SENSOR_THICKNESS	Average sensor thickness (if total height out of specifications) [µm]	float	single	None	False	158.5	None
SENSOR_THICKNESS_STD_DEVIATION	Std deviation of sensor thickness (if total height out of specifications) [µm]	float	single	None	False	4	None
SENSOR_X	Sensor dimension in x [mm]	float	single	None	False	39.5	None
SENSOR_Y	Sensor dimension in y [mm]	float	single	None	False	41.1	None

cts

2025-10-24T18:11:55.095Z

sys

cts	2025-10-24T18:11:55.095Z
mts	2025-10-24T18:11:55.733Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

597e226677cdc407e53549beb97400b8

2025-10-24T18:11:55.476Z

RAW

text/plain

file

True

20UPGB43347167_BAREMODULERECEPTION_QUAD_BARE_MODULE_METROLOGY_68fbc16b46c81c946f64e177_68fb30b68bc3fa9c0b9f0c1f.json

id	669834593510e900431bfe36
userIdentity	4940-829-1
firstName	Yuji
middleName
lastName	Enari

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68e8b5a6b5f1d1f55a4e220c

bfe11a3f77d0a8c6f01dd672c5fd94f8

ready

2025-10-10T07:28:38.245Z

24-779-1

False

None

False

None

20UPGB43347167

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68f5d8…9f0719	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	YujiEnari	6 months ago	6 months ago	No tags	Selected
68fb30…9f0c20	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	YujiEnari	6 months ago	6 months ago	No tags	Selected
68fb30…9f0c1e	BAREMODULERECEPTION	VISUAL_INSPECTION	YujiEnari	6 months ago	6 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43347167

MODULE/PARYLENE_UNMASKING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

Back to top page of this component