20UPGB43200442

MODULE/FINAL_COLD

Component Information

Serial Number	20UPGB43200442
ProdDB ID	2d6bc2…4b0130
LocalDB ID	683ecb8b9f4d7e6ede6d38fc
Component Type	BARE_MODULE
Parents	20UPGM24211762
Children	20UPGFC0145972 FE Chip 20UPGFC0145974 FE Chip 20UPGFC0146105 FE Chip 20UPGFC0146119 FE Chip 20UPGS33305155 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Date	Commented by	on which Component	Comment
5 days ago	pixel (Lawrence Berkeley National Lab - pixel modules)	MODULE 20UPGM24211762	sign-off at MODULE/QC_CROSSCHECK; appended flags: ['INFO_CORE_COLUMN', 'DISABLED_CC_BY_HAND']; next stage: MODULE/PARYLENE_MASKING; comment: Disabled cc 50 by-hand

Test: MASS_MEASUREMENT QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	10 months ago
component ObjectId	683ecb8b9f4d7e6ede6d38fc
Stage	BAREMODULERECEPTION
Test Type	MASS_MEASUREMENT
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	68afdcd8bf31877ce548987d
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vin webApp
MEASUREMENT_DATE	2025-06-30T05:00:00Z
OPERATOR_IDENTITY	Ruvimbo Gombera
SCALE_ACCURACY	0.003
MASS	1330.127

ProductionDB Record

Expand ProductionDB Record

68afdcd8bf31877ce548987d

state

ready

stateTs

2025-08-28T04:36:40.225Z

stateUserIdentity

1294-8027-1

date

2025-06-30T05:00:00.000Z

testType

id	5f87daff50d75e000a335805
code	MASS_MEASUREMENT
name	Mass Measurement
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	in webApp	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-06-30T05:00:00Z	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	Ruvimbo Gombera	None	None
SCALE_ACCURACY	Scale Accuracy [mg]	float	single	False	0.003	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
MASS	Mass [mg]	float	single	None	False	1330.127	None

cts

2025-08-28T04:36:40.226Z

sys

cts	2025-08-28T04:36:40.226Z
mts	2025-08-28T04:36:40.226Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

683ecb8b9f4d7e6ede6d38fc

2d6bc29367cb17cce312f9cfe54b0130

ready

2025-06-03T10:16:43.082Z

23-6780-1

False

None

False

None

20UPGB43200442

None

parent

component

689ce9ce328b0ce1c715de22

code

9523dcf85d1c821eaf50199355633ae9

state

ready

stateTs

2025-08-13T19:38:54.805Z

stateUserIdentity

1294-8027-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM24211762

alternativeIdentifier

ANL_ITkPix_141

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INIT
name	Initial state to associate flex to bare module

highestLevelParent

component

689ce9ce328b0ce1c715de22

code

9523dcf85d1c821eaf50199355633ae9

state

ready

stateTs

2025-08-13T19:38:54.805Z

stateUserIdentity

1294-8027-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM24211762

alternativeIdentifier

ANL_ITkPix_141

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INIT
name	Initial state to associate flex to bare module

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	4
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Final Cold

No tests are allocated for this stage.

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	No result	N/A
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	No result	N/A
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags
68afdc…48987d	BAREMODULERECEPTION	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	10 months ago	No tags
688bd1…b90cda	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	ElizaHoward	N/A	11 months ago	No tags
6887e8…535f7e	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	Simpson,Liana Rae	N/A	11 months ago	No tags

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULE/GRAVEYARD
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200442

MODULE/FINAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: MASS_MEASUREMENT QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final Cold

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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