Database for ITk Pixel Module

Item	Value
Serial Number	20UPGM23211221
Production DB Component ID	8713574fc1feaefb8a051c3d58f416b0
LocalDB Component ID	67bdd3ab5cfcdd1447295317
Component Type	module
Super-Component	No match.
Sub-Components	• 20UPGB43200112 Bare Module • 20UPGPQ4211221 PCB • 20UPGFC0142690 FE Chip • 20UPGFC0142724 FE Chip • 20UPGFC0142714 FE Chip • 20UPGFC0142726 FE Chip
Flags

Key	Data
QC Passed	True
Date	2025-03-10 06:54:49 PDT(-0700)
component ObjectId	67bdd3ab5cfcdd1447295317
Stage	MODULE/WIREBONDING
Test Type	WIREBOND_PULL_TEST
Institute ObjectId
User Name	CyrilleVuillemin
ObjectId of this record	67ceed0963915f8c483f494c
ObjectId of RAW record	67ceed0663915f8c483f494b

Key	Data
ANALYSIS_VERSION	mqat v2.3.1rc4
INSTRUMENT	F&S Bondtec LT-101
MEASUREMENT_DATE	2025-03-10T13:45:16.000+00:00
MEASUREMENT_DURATION	-1
OPERATOR_IDENTITY	None
BOND_PEEL	36
DATA_UNAVAILABLE	False
HEEL_BREAKS_ON_FE_CHIP	32
HEEL_BREAKS_ON_PCB	0
LIFT_OFFS_LESS_THAN_7G	0
PULL_STRENGTH	8.61316
PULL_STRENGTH_DATA	[[[8.516], [2], [1]], [[9.286], [0], [1]], [[9.231], [0], [1]], [[8.516], [2], [1]], [[9.341], [0], [1]], [[8.462], [4], [1]], [[8.901], [4], [1]], [[9.231], [0], [1]], [[9.066], [0], [1]], [[8.297], [4], [1]], [[7.802], [2], [2]], [[9.78], [2], [2]], [[7.253], [4], [2]], [[8.681], [4], [2]], [[9.56], [4], [2]], [[7.857], [2], [3]], [[8.187], [4], [3]], [[8.516], [2], [3]], [[8.901], [0], [3]], [[8.956], [0], [3]], [[8.077], [4], [3]], [[9.341], [0], [3]], [[7.857], [2], [3]], [[7.802], [4], [3]], [[7.912], [2], [3]]]
PULL_STRENGTH_ERROR	0.6597974234566242
PULL_STRENGTH_MAX	9.78
PULL_STRENGTH_MIN	7.253
WIRE_BREAKS_5G	0
WIRE_PULLS	25

_id

67ceed0663915f8c483f494b

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGM23211221

WIREBOND_PULL_TEST

property

INSTRUMENT	F&S Bondtec LT-101
ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	None
OPERATOR	MSM

comment

Metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGM23211221

TimeStart

1741614316

pull_data

strength	break_mode
8.516	Heel break on chip
9.286	Midspan break
9.231	Midspan break
8.516	Heel break on chip
9.341	Midspan break
8.462	Bond peel on chip
8.901	Bond peel on chip
9.231	Midspan break
9.066	Midspan break
8.297	Bond peel on chip
7.802	Heel break on chip
9.78	Heel break on chip
7.253	Bond peel on chip
8.681	Bond peel on chip
9.56	Bond peel on chip
7.857	Heel break on chip
8.187	Bond peel on chip
8.516	Heel break on chip
8.901	Midspan break
8.956	Midspan break
8.077	Bond peel on chip
9.341	Midspan break
7.857	Heel break on chip
7.802	Bond peel on chip
7.912	Heel break on chip

Measurements

WIRE_PULLS

None

PULL_STRENGTH

None

PULL_STRENGTH_ERROR

None

WIRE_BREAKS_5G

None

PULL_STRENGTH_MIN

None

PULL_STRENGTH_MAX

None

HEEL_BREAKS_ON_FE_CHIP

None

HEEL_BREAKS_ON_PCB

None

BOND_PEEL

None

LIFT_OFFS_LESS_THAN_7G

None

DATA_UNAVAILABLE

None

PULL_STRENGTH_DATA

None

MODULE/WIREBONDING

67bdd3ab5cfcdd1447295317

1.01

64657cef8d79bac1f3f005b2

mts	2025-03-10 13:45:42.881000
cts	2025-03-10 13:45:42.881000
rev	0

rawHash

166e6eeceb3153465aa6eea50e1a057e

stage

MODULE/WIREBONDING

ProductionDB Record

Expand ProductionDB Record

67ceef282717b3491d7e1a25

state

ready

stateTs

2025-03-10T13:54:48.864Z

stateUserIdentity

3509-7968-1

date

2025-03-10T13:45:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5ecf2e2c93e5ee000a0e5b15
code	IRFU
name	IRFU, CEA, Université Paris-Saclay

user

id	67a354aad7e33319cc743044
userIdentity	3509-7968-1
firstName	Cyrille
middleName
lastName	Vuillemin

runNumber

67ceed0963915f8c483f494c

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.3.1rc4	None	None
INSTRUMENT	Instrument	string	single	False	F&S Bondtec LT-101	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-03-10T13:45:16.000+00:00	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	-1	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	None	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 36
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 32
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.61316
associateChild None

code	PULL_STRENGTH_DATA
name	Pull strength data
order	1
dataType	float
valueType	array
arrayDimensions	2
additional	False
rangeMin	None
rangeMax	None
value	8.516 2 1 9.286 0 1 9.231 0 1 8.516 2 1 9.341 0 1 8.462 4 1 8.901 4 1 9.231 0 1 9.066 0 1 8.297 4 1 7.802 2 2 9.78 2 2 7.253 4 2 8.681 4 2 9.56 4 2 7.857 2 3 8.187 4 3 8.516 2 3 8.901 0 3 8.956 0 3 8.077 4 3 9.341 0 3 7.857 2 3 7.802 4 3 7.912 2 3
associateChild	None

code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.6597974234566242
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.78
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.253
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 25
associateChild None

cts

2025-03-10T13:54:48.864Z

sys

cts	2025-03-10T13:54:48.864Z
mts	2025-03-10T13:54:49.544Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

e981894a7be9936751c7a5fe76ceaf2c

2025-03-10T13:54:49.010Z

RAW

text/plain

file

True

20UPGM23211221_MODULE__WIREBONDING_WIREBOND_PULL_TEST_67ceef282717b3491d7e1a25_67ceed0663915f8c483f494b.json

id	67a354aad7e33319cc743044
userIdentity	3509-7968-1
firstName	Cyrille
middleName
lastName	Vuillemin

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67bdd3ab5cfcdd1447295317

8713574fc1feaefb8a051c3d58f416b0

ready

2025-02-25T14:28:59.398Z

8769-4020-1

False

None

False

None

20UPGM23211221

Paris1002

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value Paris1002

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

Current Stage: Initial Warm

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	TestRun Present At least one candidate TestRun is registered in LocalDB.
IV measurement (IV_MEASURE)	TestRun Present At least one candidate TestRun is registered in LocalDB.

LocalDB Object ID	TestRun Code	QC Passed	Inspector	Date	Analysis Version	QC Registration
67ceeebcb766a148ccad94a4	VISUAL_INSPECTION	Passed	CyrilleVuillemin	2025-03-10 06:55:05 PDT(-0700)	2.3.1rc4	Selected
67ceed0963915f8c483f494c	WIREBOND_PULL_TEST	Passed	CyrilleVuillemin	2025-03-10 06:54:49 PDT(-0700)	2.3.1rc4	Selected
67c882411236121a1675c216	WIREBONDING	Passed	CyrilleVuillemin	2025-03-10 06:54:48 PDT(-0700)		Selected

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebond pull test (WIREBOND_PULL_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebonding Information (WIREBONDING)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Mass Measurement (MASS_MEASUREMENT)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology (TRIPLET_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
67f44314d04bade272d28627	MODULE/INITIAL_WARM	E_SUMMARY	MatthiasSaimpert	2025-04-07 14:26:44 PDT(-0700)
67f43486d04bade272d28299	MODULE/INITIAL_WARM	E_SUMMARY	MatthiasSaimpert	2025-04-07 13:24:38 PDT(-0700)
67ee539cfe95716450bd4540	MODULE/INITIAL_COLD	IV_MEASURE	MatthiasSaimpert	2025-04-03 02:25:49 PDT(-0700)	Selected
67ee4ea95e51121eb284721c	MODULE/INITIAL_COLD	E_SUMMARY	MatthiasSaimpert	2025-04-03 02:25:45 PDT(-0700)	Selected
67ee52bcbe36143f1ef24c40	MODULE/INITIAL_WARM	IV_MEASURE	MatthiasSaimpert	2025-04-03 02:21:58 PDT(-0700)	Selected
67ee51f8fe95716450bd4537	MODULE/INITIAL_WARM	E_SUMMARY	MatthiasSaimpert	2025-04-03 02:21:53 PDT(-0700)	Selected
67dd3a61c425f6abc307d07a	MODULE/INITIAL_COLD	IV_MEASURE	MatthiasSaimpert	2025-03-24 09:13:32 PDT(-0700)
67dd7f4b757b36ded018b4a5	MODULE/INITIAL_COLD	E_SUMMARY	MatthiasSaimpert	2025-03-24 09:13:30 PDT(-0700)
67da84f55c8b48053bf3f18b	MODULE/INITIAL_WARM	IV_MEASURE	MatthiasSaimpert	2025-03-21 02:56:09 PDT(-0700)
67dd371893a8e7528c3e16bf	MODULE/INITIAL_WARM	E_SUMMARY	MatthiasSaimpert	2025-03-21 02:56:05 PDT(-0700)
67ceeebcb766a148ccad94a4	MODULE/WIREBONDING	VISUAL_INSPECTION	CyrilleVuillemin	2025-03-10 06:55:05 PDT(-0700)	Selected
67ceed0963915f8c483f494c	MODULE/WIREBONDING	WIREBOND_PULL_TEST	CyrilleVuillemin	2025-03-10 06:54:49 PDT(-0700)	Selected
67c882411236121a1675c216	MODULE/WIREBONDING	WIREBONDING	CyrilleVuillemin	2025-03-10 06:54:48 PDT(-0700)	Selected
67bde2edd89b87c79af8fbaf	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	ThomasNaquin	2025-02-25 07:34:05 PST(-0800)	Selected
67bde262d89b87c79af8efbc	MODULE/ASSEMBLY	VISUAL_INSPECTION	ThomasNaquin	2025-02-25 07:31:46 PST(-0800)	Selected
67bde2395cfcdd14472a2fbe	MODULE/ASSEMBLY	MASS_MEASUREMENT	ThomasNaquin	2025-02-25 07:31:05 PST(-0800)	Selected
67bde1f7ccae83c989baba53	MODULE/ASSEMBLY	FLATNESS	ThomasNaquin	2025-02-25 07:29:59 PST(-0800)	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23211221
Outer-Quad-Module/ITkPix_v2

ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

Item	Data Type	Value
PCB-Bare Orientation isNormal	boolean	True
FE chip version	codeTable	3
Wirebond protection roof presence	boolean	False
Alternative ID	string	Paris1002
Rank	codeTable	None

20UPGM23211221 Outer-Quad-Module/ITkPix_v2 ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20UPGM23211221
Outer-Quad-Module/ITkPix_v2

ITkPD Component Page Jump to ITkPD component page