20UPGM23211221 (Paris1002)

MODULE/INITIAL_WARM

View QC Summary

Component Information

Serial Number 20UPGM23211221
ProdDB ID  871357…f416b0
LocalDB ID 67bdd3ab5cfcdd1447295317
Component Type MODULE
Parents No match.
Children 20UPGB43200112 Bare Module 20UPGPQ4211221 PCB 20UPGFC0142690 FE Chip 20UPGFC0142724 FE Chip 20UPGFC0142714 FE Chip 20UPGFC0142726 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
PCB-Bare Orientation isNormal True
FE chip version 3
Wirebond protection roof presence False
Alternative ID Paris1002
Rank None

 Comments


Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)


Result of Wirebond Pull Test

Scan

Key Data
component id 67bdd3ab5cfcdd1447295317
Stage MODULE/WIREBONDING
test Type WIREBOND_PULL_TEST
institute 64657cef8d79bac1f3f005b2
user CyrilleVuillemin

Result

Key Data
properties {'ANALYSIS_VERSION': '2.3.1rc4', 'INSTRUMENT': 'F&S Bondtec LT-101', 'MEASUREMENT_DATE': '2025-03-10T13:45:16.000+00:00', 'MEASUREMENT_DURATION': -1, 'OPERATOR_IDENTITY': None} g
BOND_PEEL 36 g
DATA_UNAVAILABLE False g
HEEL_BREAKS_ON_FE_CHIP 32 g
HEEL_BREAKS_ON_PCB 0 g
LIFT_OFFS_LESS_THAN_7G 0 g
PULL_STRENGTH 8.61316 g
PULL_STRENGTH_DATA [[[8.516], [2], [1]], [[9.286], [0], [1]], [[9.231], [0], [1]], [[8.516], [2], [1]], [[9.341], [0], [1]], [[8.462], [4], [1]], [[8.901], [4], [1]], [[9.231], [0], [1]], [[9.066], [0], [1]], [[8.297], [4], [1]], [[7.802], [2], [2]], [[9.78], [2], [2]], [[7.253], [4], [2]], [[8.681], [4], [2]], [[9.56], [4], [2]], [[7.857], [2], [3]], [[8.187], [4], [3]], [[8.516], [2], [3]], [[8.901], [0], [3]], [[8.956], [0], [3]], [[8.077], [4], [3]], [[9.341], [0], [3]], [[7.857], [2], [3]], [[7.802], [4], [3]], [[7.912], [2], [3]]] g
PULL_STRENGTH_ERROR 0.6597974234566242 g
PULL_STRENGTH_MAX 9.78 g
PULL_STRENGTH_MIN 7.253 g
WIRE_BREAKS_5G 0 g
WIRE_PULLS 25 g

RAW Results Record

Download RAW
_id67ceed0663915f8c483f494b
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGM23211221WIREBOND_PULL_TEST
property
INSTRUMENTF&S Bondtec LT-101
ANALYSIS_VERSIONNone
MEASUREMENT_DATENone
MEASUREMENT_DURATIONNone
OPERATOR_IDENTITYNone
OPERATORMSM
comment
Metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGM23211221
TimeStart1741614316
pull_data
strengthbreak_mode
8.516Heel break on chip
9.286Midspan break
9.231Midspan break
8.516Heel break on chip
9.341Midspan break
8.462Bond peel on chip
8.901Bond peel on chip
9.231Midspan break
9.066Midspan break
8.297Bond peel on chip
7.802Heel break on chip
9.78Heel break on chip
7.253Bond peel on chip
8.681Bond peel on chip
9.56Bond peel on chip
7.857Heel break on chip
8.187Bond peel on chip
8.516Heel break on chip
8.901Midspan break
8.956Midspan break
8.077Bond peel on chip
9.341Midspan break
7.857Heel break on chip
7.802Bond peel on chip
7.912Heel break on chip
Measurements
WIRE_PULLSNone
PULL_STRENGTHNone
PULL_STRENGTH_ERRORNone
WIRE_BREAKS_5GNone
PULL_STRENGTH_MINNone
PULL_STRENGTH_MAXNone
HEEL_BREAKS_ON_FE_CHIPNone
HEEL_BREAKS_ON_PCBNone
BOND_PEELNone
LIFT_OFFS_LESS_THAN_7GNone
DATA_UNAVAILABLENone
PULL_STRENGTH_DATANone
MODULE/WIREBONDING67bdd3ab5cfcdd14472953171.0164657cef8d79bac1f3f005b2
mts2025-03-10 13:45:42.881000
cts2025-03-10 13:45:42.881000
rev0
rawHash166e6eeceb3153465aa6eea50e1a057e
stageMODULE/WIREBONDING

ProductionDB Record

id67ceef282717b3491d7e1a25
stateready
stateTs2025-03-10T13:54:48.864Z
stateUserIdentity3509-7968-1
date2025-03-10T13:45:00.000Z
testType
id63fb635d4069b50036d3faac
codeWIREBOND_PULL_TEST
nameWirebond pull test
stateactive
institution
id5ecf2e2c93e5ee000a0e5b15
codeIRFU
nameIRFU, CEA, Université Paris-Saclay
user
id67a354aad7e33319cc743044
userIdentity3509-7968-1
firstNameCyrille
middleName
lastNameVuillemin
runNumber67ceed0963915f8c483f494c
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse2.3.1rc4NoneNone
INSTRUMENTInstrumentstringsingleFalseF&S Bondtec LT-101NoneNone
MEASUREMENT_DATEDate measurement performeddatetimeNoneFalse2025-03-10T13:45:16.000+00:00NoneNone
MEASUREMENT_DURATIONMeasurement durationintegerNoneFalse-1NoneNone
OPERATOR_IDENTITYOperator NamestringsingleFalseNoneNoneNone
results
  • codeBOND_PEEL
    namePercentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value36
    associateChildNone
  • codeDATA_UNAVAILABLE
    nameData unavailable
    dataTypeboolean
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueFalse
    associateChildNone
  • codeHEEL_BREAKS_ON_FE_CHIP
    namePercentage of heel breaks on FE chips [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value32
    associateChildNone
  • codeHEEL_BREAKS_ON_PCB
    namePercentage of heel breaks on PCB [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codeLIFT_OFFS_LESS_THAN_7G
    namePercentage of liftoffs < 7g [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codePULL_STRENGTH
    nameMean pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value8.61316
    associateChildNone
  • codePULL_STRENGTH_DATA
    namePull strength data
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions2
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
        • 8.516
        • 2
        • 1
        • 9.286
        • 0
        • 1
        • 9.231
        • 0
        • 1
        • 8.516
        • 2
        • 1
        • 9.341
        • 0
        • 1
        • 8.462
        • 4
        • 1
        • 8.901
        • 4
        • 1
        • 9.231
        • 0
        • 1
        • 9.066
        • 0
        • 1
        • 8.297
        • 4
        • 1
        • 7.802
        • 2
        • 2
        • 9.78
        • 2
        • 2
        • 7.253
        • 4
        • 2
        • 8.681
        • 4
        • 2
        • 9.56
        • 4
        • 2
        • 7.857
        • 2
        • 3
        • 8.187
        • 4
        • 3
        • 8.516
        • 2
        • 3
        • 8.901
        • 0
        • 3
        • 8.956
        • 0
        • 3
        • 8.077
        • 4
        • 3
        • 9.341
        • 0
        • 3
        • 7.857
        • 2
        • 3
        • 7.802
        • 4
        • 3
        • 7.912
        • 2
        • 3
    associateChildNone
  • codePULL_STRENGTH_ERROR
    nameStd deviation of pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0.6597974234566242
    associateChildNone
  • codePULL_STRENGTH_MAX
    nameMaximum pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value9.78
    associateChildNone
  • codePULL_STRENGTH_MIN
    nameMinimum pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value7.253
    associateChildNone
  • codeWIRE_BREAKS_5G
    nameNumber of wires breaking before 5g
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codeWIRE_PULLS
    nameNumber of wires pulled
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value25
    associateChildNone
cts2025-03-10T13:54:48.864Z
sys
cts2025-03-10T13:54:48.864Z
mts2025-03-10T13:54:49.544Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypebinaryStoreg02filenameuser
e981894a7be9936751c7a5fe76ceaf2c2025-03-10T13:54:49.010ZRAWRAWtext/plainfileTrue20UPGM23211221_MODULE__WIREBONDING_WIREBOND_PULL_TEST_67ceef282717b3491d7e1a25_67ceed0663915f8c483f494b.json
id67a354aad7e33319cc743044
userIdentity3509-7968-1
firstNameCyrille
middleName
lastNameVuillemin
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
67bdd3ab5cfcdd14472953178713574fc1feaefb8a051c3d58f416b0ready2025-02-25T14:28:59.398Z8769-4020-1FalseFalseNoneNoneFalseNoneNone20UPGM23211221Paris1002
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeROOF
    nameWirebond protection roof presence
    dataTypeboolean
    requiredFalse
    defaultFalse
    valueFalse
  • codeALTERNATIVE_IDENTIFIER
    nameAlternative ID
    dataTypestring
    requiredFalse
    defaultTrue
    valueParis1002
codeMODULE/WIREBONDING
nameWire Bonding
order2
initialFalse
finalFalse
codeIJCLAB
nameLaboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

 Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 TestRun Present
IV measurement
(IV_MEASURE)		 TestRun Present

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
67ceee…ad94a4 VISUAL_INSPECTION Pass CyrilleVuillemin 9 months ago 9 months ago 2.3.1rc4 No tags Selected
67ceed…3f494c WIREBOND_PULL_TEST Pass CyrilleVuillemin 9 months ago 9 months ago 2.3.1rc4 No tags Selected
67c882…75c216 WIREBONDING Pass CyrilleVuillemin 9 months ago 9 months ago No tags Selected

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)		 Registered Registered
Wirebonding Information
(WIREBONDING)		 Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)		 Registered Registered
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)		 Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
687ff3…14b7ff MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 5 months ago No tags
687ff0…cf0fd2 MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 5 months ago No tags
67f443…d28627 MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 8 months ago No tags
67f434…d28299 MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 8 months ago No tags
67ee53…bd4540 MODULE/INITIAL_COLD IV_MEASURE MatthiasSaimpert 9 months ago 8 months ago No tags Selected
67ee4e…84721c MODULE/INITIAL_COLD E_SUMMARY MatthiasSaimpert N/A 8 months ago No tags Selected
67ee52…f24c40 MODULE/INITIAL_WARM IV_MEASURE MatthiasSaimpert 9 months ago 8 months ago No tags Selected
67ee51…bd4537 MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 8 months ago No tags Selected
67dd3a…07d07a MODULE/INITIAL_COLD IV_MEASURE MatthiasSaimpert 9 months ago 9 months ago No tags
67dd7f…18b4a5 MODULE/INITIAL_COLD E_SUMMARY MatthiasSaimpert N/A 9 months ago No tags
67da84…f3f18b MODULE/INITIAL_WARM IV_MEASURE MatthiasSaimpert 9 months ago 9 months ago No tags
67dd37…3e16bf MODULE/INITIAL_WARM E_SUMMARY MatthiasSaimpert N/A 9 months ago No tags
67ceee…ad94a4 MODULE/WIREBONDING VISUAL_INSPECTION CyrilleVuillemin 9 months ago 9 months ago No tags Selected
67ceed…3f494c MODULE/WIREBONDING WIREBOND_PULL_TEST CyrilleVuillemin 9 months ago 9 months ago No tags Selected
67c882…75c216 MODULE/WIREBONDING WIREBONDING CyrilleVuillemin 9 months ago 9 months ago No tags Selected
67bde2…f8fbaf MODULE/ASSEMBLY QUAD_MODULE_METROLOGY ThomasNaquin N/A 10 months ago No tags Selected
67bde2…f8efbc MODULE/ASSEMBLY VISUAL_INSPECTION ThomasNaquin N/A 10 months ago No tags Selected
67bde2…2a2fbe MODULE/ASSEMBLY MASS_MEASUREMENT ThomasNaquin N/A 10 months ago No tags Selected
67bde1…baba53 MODULE/ASSEMBLY FLATNESS ThomasNaquin N/A 10 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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