20UPGB43200013

OB_LOADED_MODULE_CELL/LLS_RECEPTION

Component Information

Serial Number	20UPGB43200013
ProdDB ID	79ce5a…24ab30
LocalDB ID	66fbb1b913e0b000433e019c
Component Type	BARE_MODULE
Parents	20UPGM23210493
Children	20UPGFC0132758 FE Chip 20UPGFC0132790 FE Chip 20UPGFC0132807 FE Chip 20UPGFC0132743 FE Chip 20UPGS33303700 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66fbb1b913e0b000433e019c
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ThomasNaquin
ObjectId of this record	670f714a07e8e500432616e5
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
DEFECTS	[]
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	N/A
PARYLENE_COATING_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A

ProductionDB Record

Expand ProductionDB Record

670f714a07e8e500432616e5

state

ready

stateTs

2024-10-16T07:54:50.150Z

stateUserIdentity

8769-4020-1

date

2024-10-16T07:53:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d372a3becb4750009835557
code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

user

id	66e9329c0fc5b30042e7f088
userIdentity	8769-4020-1
firstName	Thomas
middleName
lastName	Naquin

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code FE_CHIP_CONDITION_PASSED_QC
name FE chip condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code SENSOR_CONDITION_PASSED_QC
name Sensor condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None

code	SMD_COMPONENTS_PASSED_QC
name	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

cts

2024-10-16T07:54:50.150Z

sys

cts	2024-10-16T07:54:50.150Z
mts	2024-10-16T07:54:50.150Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66fbb1b913e0b000433e019c

79ce5a990327bcb634ee3a3efd24ab30

ready

2024-10-01T08:24:25.915Z

23-6780-1

False

None

False

None

20UPGB43200013

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Stage code OB_LOADED_MODULE_CELL/LLS_RECEPTION is not defined for this component type.

Current Stage:

No tests are allocated for this stage.

Past QC Stages and Results

Insertion of pigtail and strain relief glueing (OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION)

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
671114…ae5981	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	PaulMickael Chabrillat	N/A	a year ago	No tags	Selected
670f72…a6f382	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	ThomasNaquin	N/A	a year ago	No tags	Selected
670f71…2616e5	BAREMODULERECEPTION	VISUAL_INSPECTION	ThomasNaquin	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200013

OB_LOADED_MODULE_CELL/LLS_RECEPTION

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage:

Past QC Stages and Results

Insertion of pigtail and strain relief glueing (OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION)

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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