Database for ITk Pixel Module

Serial Number	20UPGS33303700
ProdDB ID	871551…00bcc3
LocalDB ID	66f6ba7413e0b0004328ce27
Component Type	SENSOR_TILE
Parents	20UPGB43200013
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	production
Scratch id (to be used if not the same as agreed manufacturer ID)	7023
Alternative Identifier	V4-2-007023-3-003
Original Manufacturer ID	Q3
Breakdown Voltage (-999 if no breakdown occurred)	-999
Depletion Voltage (V)	58.53

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66f6ba7413e0b0004328ce27
Stage	sensor_manufacturer
Test Type	IV_MEASURE
Institute ObjectId
User Name	JörnGroße-Knetter
ObjectId of this record	66f6c716db6782004337cca9
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vf8b32ac5
HUM	0
TEMP	20
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'time': [0, 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80], 'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [6e-07, 0.0897, 0.07786, 0.08238, 0.08571000000000001, 0.08839999999999999, 0.09061, 0.09246, 0.09403, 0.09537, 0.09653, 0.09753, 0.09843, 0.09928, 0.10013, 0.10099000000000001, 0.10185, 0.10271, 0.10359, 0.10446, 0.10534, 0.1069, 0.10759, 0.10837, 0.10921, 0.11011, 0.11102999999999999, 0.11198999999999999, 0.11299, 0.11402, 0.11509, 0.1162, 0.11736, 0.11857999999999999, 0.11985, 0.12116, 0.12253, 0.12394000000000001, 0.1254, 0.12691, 0.12847999999999998], 'sigma current': [], 'temperature': [], 'humidity': []}
IV_IMG	[]
LEAK_CURRENT	0.1069
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Expand ProductionDB Record

66f6c716db6782004337cca9

state

ready

stateTs

2024-09-27T14:54:14.234Z

stateUserIdentity

20-8539-1

date

2024-09-27T14:54:13.992Z

testType

id	5b1a3abf130f5600054a42a8
code	IV_MEASURE
name	IV measurement
state	active

institution

id	6255976de668fe000ae6290a
code	HPK
name	Hamamatsu Photonics K.K (HPK)

user

id	5a47b13850a18c00057e81f4
userIdentity	20-8539-1
firstName	Jörn
middleName
lastName	Große-Knetter

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	f8b32ac5	None	None
HUM	Humidity [%]	float	single	True	0	None	None
TEMP	Temperature [°C]	float	single	True	20	None	None

results

code BREAKDOWN_VOLTAGE
name Breakdown voltage [V] (if no breakdown put -999)
dataType float
valueType single
arrayDimensions None
additional False
value -999
associateChild None

code

IV_ARRAY

name

IV data

dataType

object

valueType

single

arrayDimensions

additional

False

value

time	0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80
voltage	0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130 135 140 145 150 155 160 165 170 175 180 185 190 195 200
current	6e-07 0.0897 0.07786 0.08238 0.08571000000000001 0.08839999999999999 0.09061 0.09246 0.09403 0.09537 0.09653 0.09753 0.09843 0.09928 0.10013 0.10099000000000001 0.10185 0.10271 0.10359 0.10446 0.10534 0.1069 0.10759 0.10837 0.10921 0.11011 0.11102999999999999 0.11198999999999999 0.11299 0.11402 0.11509 0.1162 0.11736 0.11857999999999999 0.11985 0.12116 0.12253 0.12394000000000001 0.1254 0.12691 0.12847999999999998
sigma current
temperature
humidity

associateChild

None

code IV_IMG
name Plot of IV curves (not for bare modules and modules)
dataType image
valueType single
arrayDimensions None
additional False
value
associateChild None
code LEAK_CURRENT
name Leakage current at depletion voltage + 20 (50) V for 3D (planar) sensors [μA]
dataType float
valueType single
arrayDimensions None
additional False
value 0.1069
associateChild None
code MAXIMUM_VOLTAGE
name Maximum measured Voltage [V]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 200
associateChild None
code NO_BREAKDOWN_VOLTAGE_OBSERVED
name No breakdown voltage observed
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value True
associateChild None

cts

2024-09-27T14:54:14.234Z

sys

cts	2024-09-27T14:54:14.234Z
mts	2024-09-27T14:54:14.234Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66f6ba7413e0b0004328ce27

871551de745eb0c2ecf8cd32e900bcc3

ready

2024-09-27T14:00:19.986Z

20-8539-1

False

None

False

None

20UPGS33303700

V4-2-007023-3-003

code	P
name	Pixels

code	PG
name	Pixel general

code	SENSOR_TILE
name	Sensor Tile

code	OUTER_PIXEL_QUAD_SENSOR_TILE
name	Outer Pixel Quad Sensor Tile

code	name	dataType	required	default	value
MAIN_VENDOR	Main Vendor	integer	True	False	3
SENSOR_TYPE_OR_TEST_STRUCTURE	Sensor Type or Test Structure	integer	True	False	3
VERSION	Version of component	string	True	False	production
SENSOR_SCRATCHID	Scratch id (to be used if not the same as agreed manufacturer ID)	string	False	False	7023
MAN_SNO	Alternative Identifier	string	True	True	V4-2-007023-3-003
MAN_ID	Original Manufacturer ID	string	False	False	Q3
BREAKDOWN_VOLTAGE	Breakdown Voltage (-999 if no breakdown occurred)	float	True	False	-999
V_FULLDEPL	Depletion Voltage (V)	float	True	False	58.53

code	sensor_manufacturer
name	Sensor Manufacturer
order	0
initial	True
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Stage code OB_LOADED_MODULE_CELL/LLS_RECEPTION is not defined for this component type.

No tests are allocated for this stage.

Past QC Stages and Results

Insertion of pigtail and strain relief glueing (OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION)

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Module damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6721f2…5c8c26	BAREMODULERECEPTION	IV_MEASURE	FrancescoCrescioli	N/A	11 months ago	No tags	Selected
66f6c7…37cca9	sensor_manufacturer	IV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected
66f6c4…37af65	sensor_manufacturer	CV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33303700

OB_LOADED_MODULE_CELL/LLS_RECEPTION

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: sensor_manufacturer)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage:

Past QC Stages and Results

Insertion of pigtail and strain relief glueing (OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION)

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Module damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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