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20UPGS33303578
Outer-Quad-Sensor
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Component Information

Item Value
Serial Number 20UPGS33303578
Production DB Component ID 4c49fec03cdf13aca310a6cc5c1945ae
LocalDB Component ID 66f6b645db678200433738f2
Component Type sensor_tile
Super-Component 20UPGB43200080 
Sub-Components No match.
Flags

Properties

Item Data Type Value
Main Vendor integer 3
Sensor Type or Test Structure integer 3
Version of component string production
Scratch id (to be used if not the same as agreed manufacturer ID) string 7003
Alternative Identifier string V4-2-007003-3-001
Original Manufacturer ID string Q1
Breakdown Voltage (-999 if no breakdown occurred) float -999
Depletion Voltage (V) float 58.74

Comments

Current Stage: Wafer Processing (dicing, UBM, flip-chip)

Test Type Local Result
Visual inspection
(VISUAL_INSPECTION)
No TestRun! TestRun is missing in LocalDB.
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.
CV measurement
(CV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID TestRun Code QC Passed Inspector Date Analysis Version QC Registration

Past QC Stages and Results

  Stage: Sensor Manufacturer (sensor_manufacturer) Complete

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
IV measurement
(IV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
LocalDB Test ID Stage Test Name Inspector Date QC Registration
6790b1a04d1c6006c3fc1ae7 BAREMODULERECEPTION IV_MEASURE MarioJose 2025-01-22 00:51:44 PST(-0800) Selected
66f6c6ea13e0b00043294c5a sensor_manufacturer IV_MEASURE JörnGroße-Knetter 2024-09-27 07:53:30 PDT(-0700) Selected
66f6c422db6782004337aa8b sensor_manufacturer CV_MEASURE JörnGroße-Knetter 2024-09-27 07:41:38 PDT(-0700) Selected
Stage Tests
sensor_manufacturer
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
WAFER_PROCESSING
  • Visual inspection  (VISUAL_INSPECTION)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
QA
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
  • IT measurement  (IT_MEASURE)
  • Inter-pixel capacitance  (INTER-PIXEL_CAPACITANCE)
  • Inter-pixel resistance  (INTER-PIXEL_RESISTANCE)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
POST_IRRAD
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION
  • IV measurement  (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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