20UPGB43320008

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Serial Number	20UPGB43320008
ProdDB ID	aac38c…aa4b9a
LocalDB ID	66f0618ad7e818004374c6a5
Component Type	BARE_MODULE
Parents	20UPGM23610026
Children	20UPGFC0134521 FE Chip 20UPGFC0134502 FE Chip 20UPGFC0134493 FE Chip 20UPGFC0134484 FE Chip 20UPGS33300929 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	3
Thickness of FE chips (RD53A)	None

Comments

Test: FLATNESS QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66f0618ad7e818004374c6a5
Stage	BAREMODULERECEPTION
Test Type	FLATNESS
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	66f64fd362de602d4549a83e
ObjectId of RAW record	66f64fd362de602d4549a839
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.2.7rc2.dev16
BACKSIDE_FLATNESS	15.1

Attachments

Filename	Contents
output.log	Download
20UPGB43320008_summary.png

RAW Results Record

Download RAW

_id

66f64fd362de602d4549a839

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGB43320008

FLATNESS

property

ANALYSIS_VERSION	None
FLATNESS_MEASUREMENT_VERSION	4.0.dev1

comment

Metadata

QCHELPER_VERSION

4.0.dev1

ModuleSN

20UPGB43320008

Institution

KEK

component

20UPGB43320008

componentType

BARE_MODULE

stage

BAREMODULERECEPTION

testType

FLATNESS

date

2024-09-24T15:45:47.590+09:00

results

BACKSIDE_FLATNESS	15.1

Measurements

BACKSIDE_FLATNESS

X	False
Unit	um
Values	15.1

BACKSIDE_FLATNESS

None

ANGLES

None

BAREMODULERECEPTION

66f0618ad7e818004374c6a5

1.01

64657cef8d79bac1f3f0057a

mts	2024-09-27 06:25:23.487000
cts	2024-09-27 06:25:23.487000
rev	0

rawHash

60f27e624f51e9684c7e742b3e33f41b

stage

BAREMODULERECEPTION

ProductionDB Record

Expand ProductionDB Record

66f9500613e0b0004331e795

state

ready

stateTs

2024-09-29T13:03:02.520Z

stateUserIdentity

24-779-1

date

2024-09-27T06:25:00.000Z

testType

id	63492dee81b823001b1f9db6
code	FLATNESS
name	Flatness
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

66f64fd362de602d4549a83e

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.2.7rc2.dev16	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	rangeMin	rangeMax	value	associateChild
BACKSIDE_FLATNESS	Backside Flatness [µm]	float	single	None	False	None	None	15.1	None

cts

2024-09-29T13:03:02.520Z

sys

cts	2024-09-29T13:03:02.520Z
mts	2024-09-29T13:03:05.805Z
rev	2

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

b80cd71954ec349a1ebf770cf4c907ff

2024-09-29T13:03:03.782Z

TestRun_66f9500613e0b0004331e795_Attachment_Pack.zip

/nas/db/localdb-tools/viewer/static/cache/thumbnail/TestRun_66f9500613e0b0004331e795_Attachment_Pack.zip

application/zip

file

True

TestRun_66f9500613e0b0004331e795_Attachment_Pack.zip

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

90b70013fc46b8ac9c2f231e906729ef

2024-09-29T13:03:04.981Z

RAW

application/json

file

True

20UPGB43320008_BAREMODULERECEPTION_FLATNESS_66f9500613e0b0004331e795_66f64fd362de602d4549a839.json

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66f0618ad7e818004374c6a5

aac38c169adae40946a838fff6aa4b9a

ready

2024-09-22T18:27:22.771Z

24-779-1

False

None

False

None

20UPGB43320008

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66f650…49a878	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	KojiNakamura	N/A	a year ago	No tags	Selected
66f64f…49a83e	BAREMODULERECEPTION	FLATNESS	KojiNakamura	N/A	a year ago	No tags	Selected
66f4bf…cf768a	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	KojiNakamura	N/A	a year ago	No tags	Selected
66f266…92d099	BAREMODULERECEPTION	VISUAL_INSPECTION	KojiNakamura	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43320008

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Distribution of chips on wafer

Properties

Comments

Test: FLATNESS QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Attachments

RAW Results Record

ProductionDB Record

Current Stage: Insertion of pigtail and strain relief glueing

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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