20UPGB43320008

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Serial Number	20UPGB43320008
ProdDB ID	aac38c…aa4b9a
LocalDB ID	66f0618ad7e818004374c6a5
Component Type	BARE_MODULE
Parents	20UPGM23610026
Children	20UPGFC0134521 FE Chip 20UPGFC0134502 FE Chip 20UPGFC0134493 FE Chip 20UPGFC0134484 FE Chip 20UPGS33300929 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	3
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66f0618ad7e818004374c6a5
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	66f26651f29e45c7cb92d099
ObjectId of RAW record	66f26651f29e45c7cb92d098
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
front_tile0 Download front_tile0		Scratches_Sensor
front_tile4 Download front_tile4		Contamination_Sensor
front_tile7 Download front_tile7		Scratches_Sensor
front_tile11 Download front_tile11		Scratches_Sensor
front_tile13 Download front_tile13		Dust_Sensor
front_tile16 Download front_tile16		Scratches_Sensor
front_tile17 Download front_tile17		Scratches_Sensor
front_tile19 Download front_tile19		Scratches_Sensor
front_tile22 Download front_tile22		Contamination_Sensor
front_tile25 Download front_tile25		Scratches_Sensor
front_tile30 Download front_tile30		Scratches_Sensor
front_tile31 Download front_tile31		Contamination_Sensor
back_tile15 Download back_tile15		Contamination_FE
back_tile16 Download back_tile16		Dust_FE

RAW Results Record

Download RAW

serialNumber

20UPGB43320008

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	4.0.dev1

comment

Metadata

QCHELPER_VERSION

4.0.dev1

ModuleSN

20UPGB43320008

front_defects

0	Yellow.Scratches_Sensor
4	Yellow.Contamination_Sensor
7	Yellow.Scratches_Sensor
11	Yellow.Scratches_Sensor
13	Yellow.Dust_Sensor
15	Yellow.Scratches_Sensor
16	Yellow.Scratches_Sensor
17	Yellow.Scratches_Sensor
19	Yellow.Scratches_Sensor
22	Yellow.Contamination_Sensor
25	Yellow.Scratches_Sensor
30	Yellow.Scratches_Sensor
31	Yellow.Contamination_Sensor

front_comments

0
1
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3
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14
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17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

66f26569381ce1bacda8fcf6

front_defect_images

0	670eb4c951efdba6c5f3d902
4	670eb4c951efdba6c5f3d905
7	670eb4ca51efdba6c5f3d93d
11	670eb4ca51efdba6c5f3d917
13	670eb4cb51efdba6c5f3d93f
15	66f26569381ce1bacda8fd13
16	670eb4cb51efdba6c5f3d977
17	670eb4cb51efdba6c5f3d973
19	670eb4cb51efdba6c5f3d948
22	670eb4cb51efdba6c5f3d975
25	670eb4cb51efdba6c5f3d979
30	670eb4cb51efdba6c5f3d96d
31	670eb4cb51efdba6c5f3d97a

back_defects

15	Yellow.Contamination_FE
16	Yellow.Dust_FE

back_comments

0
1
2
3
4
5
6
7
8
9
10
11
12
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14
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18
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33
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35

back_image

66f2664e381ce1bacda8fd23

back_defect_images

15	670eb4cc51efdba6c5f3d97f
16	670eb4cc51efdba6c5f3d9b8

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

stage

BAREMODULERECEPTION

component

66f0618ad7e818004374c6a5

dbVersion

1.01

address

64657cef8d79bac1f3f0057a

sys

mts	2024-09-24 07:12:17.258000
cts	2024-09-24 07:12:17.258000
rev	0

ProductionDB Record

Expand ProductionDB Record

66f94f9bdb67820043405f6e

state

ready

stateTs

2024-09-29T13:01:15.599Z

stateUserIdentity

24-779-1

date

2024-09-24T07:12:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

66f26651f29e45c7cb92d099

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.14	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2024-09-29T13:01:15.599Z

sys

cts	2024-09-29T13:01:15.599Z
mts	2024-09-29T13:02:54.178Z
rev	35

defects

code	name	description
8b6397f4a615a977d00b3230	front_tile0	Yellow.Scratches_Sensor
404a90e9883bc0b628aa63cd	front_tile4	Yellow.Contamination_Sensor
89a752264f369d2fe64d9399	front_tile7	Yellow.Scratches_Sensor
623eac9ec19649999e550b90	front_tile11	Yellow.Scratches_Sensor
6541308f7b46a613d21e5f6a	front_tile13	Yellow.Dust_Sensor
33af0b54384bd8200a319059	front_tile15	Yellow.Scratches_Sensor
4e31e2a16cbf206daae36953	front_tile16	Yellow.Scratches_Sensor
9819cabcc2d380a6af2629c9	front_tile17	Yellow.Scratches_Sensor
2ed6c2110c99fbe30bc23f3d	front_tile19	Yellow.Scratches_Sensor
3a0ddfcef84f7e1b31f44688	front_tile22	Yellow.Contamination_Sensor
3b1a669b646f11db0c322292	front_tile25	Yellow.Scratches_Sensor
ad035eecf43867a8a7fd0264	front_tile30	Yellow.Scratches_Sensor
964b6f94efcdfc419b6ee2ab	front_tile31	Yellow.Contamination_Sensor
c621a5b0ae4294f80237a96e	back_tile15	Yellow.Contamination_FE
7bb2d1d58c4e3028f966477d	back_tile16	Yellow.Dust_FE

comments

None

attachments

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Visual Inspection Image

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Visual Inspection Image

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code

ad277bc661336987358a9ad29a46569e

dateTime

2024-09-29T13:02:15.662Z

title

front_tile16

description

Visual Inspection Image

contentType

None

type

eos

url

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code

e09f476ad795bf76f7047401de9b5a71

dateTime

2024-09-29T13:02:19.587Z

title

front_tile17

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/e/0/9/e09f476ad795bf76f7047401de9b5a71?authz=zteos64:MDAwMDAyOWN4nO1QvUrDUBi1BRU6iWNB-BAHHZLcnyRNLgjOLoKIUEKGm9ybNNTmhuQGpM8gzqX4Bm4OVlxFRBCcHd2cfIOisTg4ODl7ho_D4TuHw-nM2p1WuTZ9v71Z6S5neliIzfa42G4RaklVWVyf8O8byzJPS1UXIquGlpDaaN6tolTCEJElLWT5-1teTG0eo9jwIkINjGViRJT7BrejBOGe7wjiH961gqNawkGsATtAEKOIEbchxA6hzgTDNnY9HCzqhJB-KRT1gnERgs6EzDUrldImJR51qdvYHWcvYCxpwBxsYuyavmdiFELOR5ItckDkDJq2mg3LyAFeFAwGqtLsd6NQI57l7IeSSsWQgylUtWjYOiyd9s-zi41o_vGYXF_C2WBWTufHaf_q6Xn3Re88dP-3_eO28PY6uV_9BGFR0Qg%3d

urlCernbox

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code

f117f39fe49ec8d645bcb45429c2d424

dateTime

2024-09-29T13:02:23.473Z

title

front_tile19

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/f/1/1/f117f39fe49ec8d645bcb45429c2d424?authz=zteos64:MDAwMDAyOWN4nO1QvUrEQBgkJ1pcpWJ1cLCIhU2yf5dc8oEgiI0IgqiFIcUmuznDedmQbEAOrKztrtLCJ7BWDjsLCwufwMreJ7AwHhYWVtZ-xTAMMx_DtO9abatcvHqf3i905jMzLORqa1ysW4xjpSsszKn4xkSV-aDUdSGzaoilMnZjx0WppS1jnGKK6c6an3icCKlsP2bcplSlts-YtEUvTgntB65kwf6jFR7UCu0lBlEXMQKcAPMawnoRqjMJtEc9n4azOhEafCmc9MNxESGTSZUbKLU2Dmc-9wIPmM_czRAgbQ5c6lDqOYHvUBKhXIwUzP4gmQNq2hoYlrGLRFEAOtGVgd-DUo9ElsMPZaA0EJdyVNWyYcvoYfu5mh5eLOW70dHrZXdjMtc5e3nbWmHB8aT7EZ53_rf947bo9ubp2voERa7MrQ%3d%3d

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code

25eb2a74e72da962d44eb345215448f3

dateTime

2024-09-29T13:02:27.661Z

title

front_tile22

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/2/5/e/25eb2a74e72da962d44eb345215448f3?authz=zteos64:MDAwMDAyOWN4nO1Qv0vDQBilhTp0Et06HeLQwST3o5em3-TiUgRBpAgxwyV3qaE2F5LLUnDp7FTo4iTi4OimCC4K_hfObjqKuBiLg4OTs9_weDze-3i85nW9WcuXT19ub5ZajcSMMrlWn2TtGmWO0oUjzJH4xkjl6TDXZSaTYuRIZazK7mS5lpYMHepwR_XXvciLYsmE5YWUWYSo2ApVFFmiE8aYdHtc0t7uQ83fKxXaiQwiHFEMDAN1K0I7ASoTCaRDXI_4izoBGn4pDHf9SRYgk0iVGsi1NjajHutyDtzFeNMHiKsDTmxCXLvn2QQHKBVjBYs_SKaAqrYGRnnIkcgyQIe6MPB7UOqxSFL4oQyVBswJQ0UpK7aCTgb-fnv74uPcvXqvH9-dbTSfXqerl_OBOnh82-rPWv_b_nFbNH--nzY-AYDi0Hw%3d

urlCernbox

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code

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dateTime

2024-09-29T13:02:31.561Z

title

front_tile25

description

Visual Inspection Image

contentType

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type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/3/5/a/35adfb5c2cdfb12a6a32188a847cea2f?authz=zteos64:MDAwMDAyOWN4nO1QO0vEQBjkDrziBBULi6sWsRAkyT7y_AqxsdBGOWyOECTJbs5wml2STeFV_gJrwcLOP-ATLf0FFoKFjb1YWxoPCwsra79iGIaZj2G6N-1uq5w7fb-77fSmcj1SfLE9VsstyiwhKyvW-_E3pqIshqWsFc-rkcWFNhq7pUrJDZ5YzHKseHPJT5PMdlJh-AllBiEiM4LETY3YTjJMvMDhNOg_tMKdWqCtVCPiIIqBYaBeQ6gdoTrnQGzi-iSc1InQ8Eth2AvHKkI656LQUEqpTUZ95mMPXM-210KArDlwiEmIawa-SXCEivhAwOQP4gWgpq2GUZk4KFYK0J6sNPwe5PIgzgv4oQyFBOwQhqqaN2werZ4fLvTd6e1it-Qv62dHMyvXxxuD6mTw9Hp_dfE42_vf9o_boue3y4_OJ6M3zzA%3d

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code

8f326ef3d0e3505468ad9bfa77722e63

dateTime

2024-09-29T13:02:35.577Z

title

front_tile30

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Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/f/3/8f326ef3d0e3505468ad9bfa77722e63?authz=zteos64:MDAwMDAyOWN4nO1QPUvEQBQkh1ocHIiFxYGwioUIyWZ387F5IKilzYHaSIiQZDdnPC8bkg3IgX9EG8HG0k6xUbD0F1jYWdvaGg8LCytrXzEMw8xjmO5tp2tU8xfv93dz_dlcj0qx0pmUawZlWKoax_ok_sZUVsWwUk0p8nqEhdRma8dlpYQpEsxxhtnOKk8lTzPhmDyhzCREZmbChDBjJ8ls4geuoMHukxHuNxINUo2Ii6gNzAbqt4Q6EWpyAcQhHifhtE6Ehl8Ks_1wUkZI50IWGiqltMUoZ9wj4LsB3QwBsvbAJRYhnhVwi9gRKuKxhOkfJApAbVsNoypxUVyWgI5UreH3oFDjOC_ghzKUCmyXMFQ3omULKDndevXWl_Xi3jYYvY3Dq7Ol3uTy-e1lcPBw3NTn_f9t_7gtuvm4fpz5BA1IzYI%3d

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dateTime

2024-09-29T13:02:38.793Z

title

front_tile31

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Visual Inspection Image

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type

eos

url

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2024-09-29T13:02:42.685Z

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Visual Inspection Image

contentType

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type

eos

url

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2024-09-29T13:02:45.837Z

title

back_tile16

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Visual Inspection Image

contentType

None

type

eos

url

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middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66f0618ad7e818004374c6a5

aac38c169adae40946a838fff6aa4b9a

ready

2024-09-22T18:27:22.771Z

24-779-1

False

None

False

None

20UPGB43320008

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66f650…49a878	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	KojiNakamura	N/A	a year ago	No tags	Selected
66f64f…49a83e	BAREMODULERECEPTION	FLATNESS	KojiNakamura	N/A	a year ago	No tags	Selected
66f4bf…cf768a	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	KojiNakamura	N/A	a year ago	No tags	Selected
66f266…92d099	BAREMODULERECEPTION	VISUAL_INSPECTION	KojiNakamura	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43320008

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Insertion of pigtail and strain relief glueing

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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