HPK

ITkPD Component Page Jump to ITkPD component page

Component Information

Item	Value
Serial Number	20 U PG B4 3320008
Production DB Component ID	aac38c169adae40946a838fff6aa4b9a
LocalDB Component ID	66f0618ad7e818004374c6a5
Component Type	bare_module
Super-Component	20 U PG M2 3610026
Sub-Components	• 20 U PG FC 0134521 FE Chip • 20 U PG FC 0134502 FE Chip • 20 U PG FC 0134493 FE Chip • 20 U PG FC 0134484 FE Chip • 20 U PG S3 3300929 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Properties

Item	Data Type	Value
FE chip version	codeTable	3
Sensor Type	codeTable	5
Vendor code	codeTable	3
Thickness of FE chips (RD53A)	codeTable	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2024-09-29 06:02:54 PDT(-0700)
component ObjectId	66f0618ad7e818004374c6a5
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	66f26651f29e45c7cb92d099
ObjectId of RAW record	66f26651f29e45c7cb92d098

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
front_tile0 Download front_tile0		Scratches_Sensor
front_tile4 Download front_tile4		Contamination_Sensor
front_tile7 Download front_tile7		Scratches_Sensor
front_tile11 Download front_tile11		Scratches_Sensor
front_tile13 Download front_tile13		Dust_Sensor
front_tile16 Download front_tile16		Scratches_Sensor
front_tile17 Download front_tile17		Scratches_Sensor
front_tile19 Download front_tile19		Scratches_Sensor
front_tile22 Download front_tile22		Contamination_Sensor
front_tile25 Download front_tile25		Scratches_Sensor
front_tile30 Download front_tile30		Scratches_Sensor
front_tile31 Download front_tile31		Contamination_Sensor
back_tile15 Download back_tile15		Contamination_FE
back_tile16 Download back_tile16		Dust_FE

RAW Results Record

Download RAW

serialNumber

20UPGB43320008

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	4.0.dev1

comment

Metadata

QCHELPER_VERSION

4.0.dev1

ModuleSN

20UPGB43320008

front_defects

0	Yellow.Scratches_Sensor
4	Yellow.Contamination_Sensor
7	Yellow.Scratches_Sensor
11	Yellow.Scratches_Sensor
13	Yellow.Dust_Sensor
15	Yellow.Scratches_Sensor
16	Yellow.Scratches_Sensor
17	Yellow.Scratches_Sensor
19	Yellow.Scratches_Sensor
22	Yellow.Contamination_Sensor
25	Yellow.Scratches_Sensor
30	Yellow.Scratches_Sensor
31	Yellow.Contamination_Sensor

front_comments

0
1
2
3
4
5
6
7
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9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

66f26569381ce1bacda8fcf6

front_defect_images

0	670eb4c951efdba6c5f3d902
4	670eb4c951efdba6c5f3d905
7	670eb4ca51efdba6c5f3d93d
11	670eb4ca51efdba6c5f3d917
13	670eb4cb51efdba6c5f3d93f
15	66f26569381ce1bacda8fd13
16	670eb4cb51efdba6c5f3d977
17	670eb4cb51efdba6c5f3d973
19	670eb4cb51efdba6c5f3d948
22	670eb4cb51efdba6c5f3d975
25	670eb4cb51efdba6c5f3d979
30	670eb4cb51efdba6c5f3d96d
31	670eb4cb51efdba6c5f3d97a

back_defects

15	Yellow.Contamination_FE
16	Yellow.Dust_FE

back_comments

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

back_image

66f2664e381ce1bacda8fd23

back_defect_images

15	670eb4cc51efdba6c5f3d97f
16	670eb4cc51efdba6c5f3d9b8

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

stage

BAREMODULERECEPTION

component

66f0618ad7e818004374c6a5

dbVersion

1.01

address

64657cef8d79bac1f3f0057a

sys

mts	2024-09-24 07:12:17.258000
cts	2024-09-24 07:12:17.258000
rev	0

ProductionDB Record

Expand ProductionDB Record

66f94f9bdb67820043405f6e

state

ready

stateTs

2024-09-29T13:01:15.599Z

stateUserIdentity

24-779-1

date

2024-09-24T07:12:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

66f26651f29e45c7cb92d099

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.14	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2024-09-29T13:01:15.599Z

sys

cts	2024-09-29T13:01:15.599Z
mts	2024-09-29T13:02:54.178Z
rev	35

defects

code	name	description
8b6397f4a615a977d00b3230	front_tile0	Yellow.Scratches_Sensor
404a90e9883bc0b628aa63cd	front_tile4	Yellow.Contamination_Sensor
89a752264f369d2fe64d9399	front_tile7	Yellow.Scratches_Sensor
623eac9ec19649999e550b90	front_tile11	Yellow.Scratches_Sensor
6541308f7b46a613d21e5f6a	front_tile13	Yellow.Dust_Sensor
33af0b54384bd8200a319059	front_tile15	Yellow.Scratches_Sensor
4e31e2a16cbf206daae36953	front_tile16	Yellow.Scratches_Sensor
9819cabcc2d380a6af2629c9	front_tile17	Yellow.Scratches_Sensor
2ed6c2110c99fbe30bc23f3d	front_tile19	Yellow.Scratches_Sensor
3a0ddfcef84f7e1b31f44688	front_tile22	Yellow.Contamination_Sensor
3b1a669b646f11db0c322292	front_tile25	Yellow.Scratches_Sensor
ad035eecf43867a8a7fd0264	front_tile30	Yellow.Scratches_Sensor
964b6f94efcdfc419b6ee2ab	front_tile31	Yellow.Contamination_Sensor
c621a5b0ae4294f80237a96e	back_tile15	Yellow.Contamination_FE
7bb2d1d58c4e3028f966477d	back_tile16	Yellow.Dust_FE

comments

None

attachments

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description

RAW

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type

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user

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Visual Inspection Image

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dateTime

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title

front_tile4

description

Visual Inspection Image

contentType

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type

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title

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description

Visual Inspection Image

contentType

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eos

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Visual Inspection Image

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title

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description

Visual Inspection Image

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eos

url

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title

front_tile15

description

Visual Inspection Image

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stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

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trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66f0618ad7e818004374c6a5

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2024-09-22T18:27:22.771Z

24-779-1

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20UPGB43320008

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

Results Stage: Reception at ITk institute (BAREMODULERECEPTION) Complete

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Flatness (FLATNESS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Mass Measurement (MASS_MEASUREMENT)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: Not to be used for the detector (NOT_USED) Complete

No tests are allocated for this stage.

Stage: Bare module failed test, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Bare module assembly (BAREMODULEASSEMBLY) Complete

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
66f650d262de602d4549a878	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	KojiNakamura	2024-09-29 06:03:10 PDT(-0700)	Selected
66f64fd362de602d4549a83e	BAREMODULERECEPTION	FLATNESS	KojiNakamura	2024-09-29 06:03:05 PDT(-0700)	Selected
66f4bf18d7d71d0ad4cf768a	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	KojiNakamura	2024-09-29 06:02:59 PDT(-0700)	Selected
66f26651f29e45c7cb92d099	BAREMODULERECEPTION	VISUAL_INSPECTION	KojiNakamura	2024-09-29 06:02:54 PDT(-0700)	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20 U PG B4 3320008 Quad-BareModule/ITkPix_v2/HPK ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

20 U PG B4 3320008
Quad-BareModule/ITkPix_v2/HPK

ITkPD Component Page Jump to ITkPD component page