Top Page > Component List > 20UPGPQ4610026 > QC Result / PCB_QC / HV_LV_TEST

20UPGPQ4610026
Quad-PCB/Outer Prod./Yamashita-Mat-75um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ4610026
Production DB Component ID dd3895cac196616c94017df1f0241607
LocalDB Component ID 66a2880cebdf60004362e6f0
Component Type module_pcb
Super-Component 20UPGM23610026 
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string Yamashita Material
PCB design version codeTable 4
PCB vendor technology codeTable 6
SMD population vendor string Hayashi REPIC Co.

Comments


Test: HV_LV_TEST QC Passed

(Stage: PCB_QC)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-09-26 23:58:47 PDT(-0700)
component ObjectId 66a2880cebdf60004362e6f0
Stage PCB_QC
Test Type HV_LV_TEST
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66f656fd62de602d4549a8e0
ObjectId of RAW record 66f656fc62de602d4549a8df

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT None
OPERATOR
TEST_DURATION 10
DAMAGE_COMMENT
EFFECTIVE_RESISTANCE 7.32
GND_DROP 0.288
HV_LEAKAGE 31
LEAKAGE_CURRENT 3.1
NTC_VALUE 6.962
NTC_VOLTAGE 1.465
R1_HV_RESISTOR -1
RELATIVE_HUMIDITY 5.6
TEMPERATURE 29.3
VIN_DROP 0.328

RAW Results Record

Download RAW
_id66f656fc62de602d4549a8df
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGPQ4610026HV_LV_TEST
property
OPERATORNone
INSTRUMENTNone
ANALYSIS_VERSIONNone
TEST_DURATIONNone
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGPQ4610026
Measurement
VIN_DROP[V]0.328
GND_DROP[V]0.288
EFFECTIVE_RESISTANCE[mOhm]7.32
HV_LEAKAGE[mV]31
LEAKAGE_CURRENT[nA]3.1
NTC_VOLTAGE[V]1.465
NTC_VALUE[kOhm]6.962
HUMIDITY[RH%]5.6
TEST_DURATION[min]10
TEMPERATURE29.3
R1_HV_RESISTOR-1
Metadata
Measurements
VIN_DROPNone
GND_DROPNone
EFFECTIVE_RESISTANCENone
HV_LEAKAGENone
LEAKAGE_CURRENTNone
NTC_VOLTAGENone
NTC_VALUENone
TEMPERATURENone
RELATIVE_HUMIDITYNone
R1_HV_RESISTORNone
DAMAGE_COMMENTNone
PCB_QC66a2880cebdf60004362e6f01.0164657cef8d79bac1f3f0057a
mts2024-09-27 06:55:56.812000
cts2024-09-27 06:55:56.812000
rev0
rawHashd71ac0c53313e492fdc8482005a05bfc
stagePCB_QC

ProductionDB Record

id66f657a713e0b0004323c2b3
stateready
stateTs2024-09-27T06:58:47.238Z
stateUserIdentity24-779-1
date2024-09-27T06:55:00.000Z
testType
id63ef7c67a1170e0037dc07eb
codeHV_LV_TEST
nameLV and HV Test
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber66f656fd62de602d4549a8e0
passedTrue
problemsFalse
properties
  • codeANALYSIS_VERSION
    nameAnalysis version
    dataTypestring
    valueTypesingle
    requiredFalse
    valueNone
  • codeINSTRUMENT
    nameInstrument
    dataTypestring
    valueTypesingle
    requiredFalse
    valueNone
  • codeOPERATOR
    nameOperator
    dataTypestring
    valueTypesingle
    requiredFalse
    value
  • codeTEST_DURATION
    nameDuration of test [min]
    dataTypefloat
    valueTypesingle
    requiredFalse
    value10
    rangeMinNone
    rangeMaxNone
results
  • codeDAMAGE_COMMENT
    nameDamage comment
    dataTypestring
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value
    associateChildNone
  • codeEFFECTIVE_RESISTANCE
    nameEffective resistance of the PCB [mΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value7.32
    associateChildNone
  • codeGND_DROP
    nameGND Drop [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0.288
    associateChildNone
  • codeHV_LEAKAGE
    nameHV (-975V) leakage value [mV]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMaxNone
    value31
    associateChildNone
  • codeLEAKAGE_CURRENT
    nameLeakage current [nA]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value3.1
    associateChildNone
  • codeNTC_VALUE
    nameNTC value [kΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value6.962
    associateChildNone
  • codeNTC_VOLTAGE
    nameNTC voltage [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1.465
    associateChildNone
  • codeR1_HV_RESISTOR
    nameR1 - HV resistor value [kΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value-1
    associateChildNone
  • codeRELATIVE_HUMIDITY
    nameRelative Humidity [RH%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value5.6
    associateChildNone
  • codeTEMPERATURE
    nameTemperature [°C]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value29.3
    associateChildNone
  • codeVIN_DROP
    nameVin Drop [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0.328
    associateChildNone
cts2024-09-27T06:58:47.238Z
sys
cts2024-09-27T06:58:47.238Z
mts2024-09-27T06:58:47.958Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypebinaryStoreg02filenameuser
8a15402a5ef455d58be0855b93d2efa52024-09-27T06:58:47.594ZRAWRAWtext/plainfileTrue20UPGPQ4610026_PCB_QC_HV_LV_TEST_66f657a713e0b0004323c2b3_66f656fc62de602d4549a8df.json
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
66a2880cebdf60004362e6f0dd3895cac196616c94017df1f0241607ready2024-07-25T17:14:52.959Z24-779-1FalseFalseNoneNoneFalseNoneNone20UPGPQ4610026None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita Material
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueProduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueHayashi REPIC Co.
codePCB_QC
nameQC
order8
initialFalse
finalFalse
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

  Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

  Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

  Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Complete (COMPLETE) Locally Signed Off

No tests are allocated for this stage.

  Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

  Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

  Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

  Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

  Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

  Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

  Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

  Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

  Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

  Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

  Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

  Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

  Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66a350bf6303b43c546a8c9c PCB_RECEPTION LAYER_THICKNESS YoichiIkegami 2024-10-06 23:45:53 PDT(-0700) Selected
66c2e8c7f94f575eb9fd9cd9 PCB_RECEPTION METROLOGY YoichiIkegami 2024-10-06 23:45:52 PDT(-0700) Selected
66a350986303b43c546a8c9a PCB_RECEPTION VISUAL_INSPECTION YoichiIkegami 2024-10-06 23:45:51 PDT(-0700) Selected
66f35ae4f29e45c7cb92d2b9 PCB_RECEPTION_MODULE_SITE METROLOGY KojiNakamura 2024-09-26 23:58:55 PDT(-0700) Selected
66f656fd62de602d4549a8e0 PCB_QC HV_LV_TEST KojiNakamura 2024-09-26 23:58:47 PDT(-0700) Selected
66f35abff29e45c7cb92d2b6 PCB_POPULATION VISUAL_INSPECTION KojiNakamura 2024-09-24 23:56:22 PDT(-0700) Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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