Top Page > Component List > 20UPGPQ4610026 > QC Result / PCB_RECEPTION_MODULE_SITE / METROLOGY

20UPGPQ4610026
Quad-PCB/Outer Prod./Yamashita-Mat-75um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ4610026
Production DB Component ID dd3895cac196616c94017df1f0241607
LocalDB Component ID 66a2880cebdf60004362e6f0
Component Type module_pcb
Super-Component 20UPGM23610026 
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string Yamashita Material
PCB design version codeTable 4
PCB vendor technology codeTable 6
SMD population vendor string Hayashi REPIC Co.

Comments


Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-09-26 23:58:55 PDT(-0700)
component ObjectId 66a2880cebdf60004362e6f0
Stage PCB_RECEPTION_MODULE_SITE
Test Type METROLOGY
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66f35ae4f29e45c7cb92d2b9
ObjectId of RAW record 66f35ae4f29e45c7cb92d2b8

Results

Key Data
ANALYSIS_VERSION mqat v1.0.14
INSTRUMENT None
OPERATOR None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS 0.214
AVERAGE_THICKNESS_POWER_CONNECTOR 1.546
DIAMETER_DOWEL_HOLE_A 3.064
HV_CAPACITOR_THICKNESS 1.925
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP True
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS 0.003
WIDTH_DOWEL_SLOT_B 3.055
X-Y_DIMENSION_WITHIN_ENVELOP True
X_DIMENSION 39.597
Y_DIMENSION 40.393

RAW Results Record

Download RAW
_id66f35ae4f29e45c7cb92d2b8
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGPQ4610026METROLOGY
property
OPERATORNone
INSTRUMENTNone
ANALYSIS_VERSIONNone
METROLOGY_MEASUREMENT_VERSION4.0.dev1
comment
Metadata
QCHELPER_VERSION4.0.dev1
ModuleSN20UPGPQ4610026
Measurements
X_DIMENSION39.597
Y_DIMENSION40.393
X-Y_DIMENSION_WITHIN_ENVELOPTrue
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS0.214
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS0.003
HV_CAPACITOR_THICKNESS1.925
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPTrue
AVERAGE_THICKNESS_POWER_CONNECTOR1.546
DIAMETER_DOWEL_HOLE_A3.064
WIDTH_DOWEL_SLOT_B3.055
X_DIMENSIONNone
Y_DIMENSIONNone
X-Y_DIMENSION_WITHIN_ENVELOPNone
DIAMETER_DOWEL_HOLE_ANone
WIDTH_DOWEL_SLOT_BNone
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASNone
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASNone
HV_CAPACITOR_THICKNESSNone
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPNone
AVERAGE_THICKNESS_POWER_CONNECTORNone
PCB_RECEPTION_MODULE_SITE66a2880cebdf60004362e6f01.0164657cef8d79bac1f3f0057a
mts2024-09-25 00:35:48.453000
cts2024-09-25 00:35:48.453000
rev0
rawHash535c57313b2d68b69777f069eb170669
stagePCB_RECEPTION_MODULE_SITE

ProductionDB Record

id66f657afdb67820043324073
stateready
stateTs2024-09-27T06:58:55.283Z
stateUserIdentity24-779-1
date2024-09-25T00:35:00.000Z
testType
id60255faf86dec3000ad0330d
codeMETROLOGY
nameMetrology
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber66f35ae4f29e45c7cb92d2b9
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0.14NoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNoneNone
OPERATOROperatorstringsingleFalseNoneNoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASAverage thickness of all pick-up areas [mm]floatsingle1False0.214None
AVERAGE_THICKNESS_POWER_CONNECTORThickness including the black body of power connector (excluding pins) [mm]floatsingleNoneFalse1.546None
DIAMETER_DOWEL_HOLE_ADiameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]floatsingleNoneFalse3.064None
HV_CAPACITOR_THICKNESSHV capacitor thickness [mm]floatsingleNoneFalse1.925None
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPHV capacitor thickness within envelopbooleansingleNoneFalseTrueNone
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASStd deviation of thickness of all pick-up area [mm]floatsingle1False0.003None
WIDTH_DOWEL_SLOT_BWidth of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]floatsingleNoneFalse3.055None
X-Y_DIMENSION_WITHIN_ENVELOPX-Y dimension within envelopebooleansingleNoneFalseTrueNone
X_DIMENSIONX dimension [mm]floatsingleNoneFalse39.597None
Y_DIMENSIONY dimension [mm]floatsingleNoneFalse40.393None
cts2024-09-27T06:58:55.283Z
sys
cts2024-09-27T06:58:55.283Z
mts2024-09-27T06:58:55.940Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypebinaryStoreg02filenameuser
e54c0b8ecedfa950c13b6e9d958c8f0d2024-09-27T06:58:55.653ZRAWRAWtext/plainfileTrue20UPGPQ4610026_PCB_RECEPTION_MODULE_SITE_METROLOGY_66f657afdb67820043324073_66f35ae4f29e45c7cb92d2b8.json
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
66a2880cebdf60004362e6f0dd3895cac196616c94017df1f0241607ready2024-07-25T17:14:52.959Z24-779-1FalseFalseNoneNoneFalseNoneNone20UPGPQ4610026None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita Material
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueProduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueHayashi REPIC Co.
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order11
initialFalse
finalFalse
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

  Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

  Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

  Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Complete (COMPLETE) Locally Signed Off

No tests are allocated for this stage.

  Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

  Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

  Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

  Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

  Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

  Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

  Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

  Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

  Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

  Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

  Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

  Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

  Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66a350bf6303b43c546a8c9c PCB_RECEPTION LAYER_THICKNESS YoichiIkegami 2024-10-06 23:45:53 PDT(-0700) Selected
66c2e8c7f94f575eb9fd9cd9 PCB_RECEPTION METROLOGY YoichiIkegami 2024-10-06 23:45:52 PDT(-0700) Selected
66a350986303b43c546a8c9a PCB_RECEPTION VISUAL_INSPECTION YoichiIkegami 2024-10-06 23:45:51 PDT(-0700) Selected
66f35ae4f29e45c7cb92d2b9 PCB_RECEPTION_MODULE_SITE METROLOGY KojiNakamura 2024-09-26 23:58:55 PDT(-0700) Selected
66f656fd62de602d4549a8e0 PCB_QC HV_LV_TEST KojiNakamura 2024-09-26 23:58:47 PDT(-0700) Selected
66f35abff29e45c7cb92d2b6 PCB_POPULATION VISUAL_INSPECTION KojiNakamura 2024-09-24 23:56:22 PDT(-0700) Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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