Top Page > Component List > 20UPGS33300929 > QC Result / sensor_manufacturer / IV_MEASURE

20UPGS33300929
Outer-Quad-Sensor
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Component Information

Item Value
Serial Number 20UPGS33300929
Production DB Component ID 3b9dadacb3f2b200d894cc91718c72f4
LocalDB Component ID 66268795b345a200357e3dfe
Component Type sensor_tile
Super-Component 20UPGB43320008 
Sub-Components No match.
Flags

Properties

Item Data Type Value
Main Vendor integer 3
Sensor Type or Test Structure integer 3
Version of component string production
Scratch id (to be used if not the same as agreed manufacturer ID) string 50
Alternative Identifier string V4-2-000050-3-004
Original Manufacturer ID string Q4
Breakdown Voltage (-999 if no breakdown occurred) float -999
Depletion Voltage (V) float 64.52

Comments


Test: IV_MEASURE QC Passed

(Stage: sensor_manufacturer)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-09-20 21:04:53 PDT(-0700)
component ObjectId 66268795b345a200357e3dfe
Stage sensor_manufacturer
Test Type IV_MEASURE
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66ee45e5a2dfe0004211541a
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION mqat v450ffd4c
HUM 0
TEMP 20
BREAKDOWN_VOLTAGE -999
IV_ARRAY {'time': [0, 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80], 'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [1.0199999999999999e-05, 0.10092000000000001, 0.08704, 0.09158000000000001, 0.09445, 0.09665, 0.09845, 0.10006999999999999, 0.10158, 0.10293999999999999, 0.10365, 0.10421000000000001, 0.10463, 0.10521, 0.10583000000000001, 0.10652, 0.10728, 0.10804000000000001, 0.10882, 0.10962, 0.11043, 0.11293, 0.11342, 0.11402, 0.11472, 0.11549, 0.1163, 0.11714000000000001, 0.11805, 0.11896999999999999, 0.11997999999999999, 0.12102, 0.12219000000000001, 0.12333999999999999, 0.12458, 0.12587, 0.12721000000000002, 0.12861999999999998, 0.13008999999999998, 0.13162000000000001, 0.13322], 'sigma current': [], 'temperature': [], 'humidity': []}
IV_IMG []
LEAK_CURRENT 0.11402
MAXIMUM_VOLTAGE 200
NO_BREAKDOWN_VOLTAGE_OBSERVED True

ProductionDB Record

{}

Current Stage: Insertion of pigtail and strain relief glueing

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING) Alternative

No tests are allocated for this stage.

  Stage: Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION) Locally Signed Off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE) Not signed-off

No tests are allocated for this stage.

  Stage: OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS) Locally Signed Off

No tests are allocated for this stage.

  Stage: Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK) Complete

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM) Not signed-off

No tests are allocated for this stage.

  Stage: Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD) Not signed-off

No tests are allocated for this stage.

  Stage: Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT) Locally Signed Off

No tests are allocated for this stage.

  Stage: Module PCB tab cutting (MODULE/TAB_CUTTING) Complete

No tests are allocated for this stage.

  Stage: Module reception (MODULE/RECEPTION) Complete

No tests are allocated for this stage.

  Stage: Module Complete (MODULE/COMPLETE) Complete

No tests are allocated for this stage.

  Stage: Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS) Not signed-off

No tests are allocated for this stage.

  Stage: Modules failed test, needs investigation (MODULE/UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Ranking of the module (MODULE/QC_STATUS) Not signed-off

No tests are allocated for this stage.

  Stage: Final flatness measurement (MODULE/FINAL_METROLOGY) Not signed-off

No tests are allocated for this stage.

  Stage: Final Cold (MODULE/FINAL_COLD) Complete

No tests are allocated for this stage.

  Stage: Final Warm (MODULE/FINAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST) Complete

No tests are allocated for this stage.

  Stage: Thermal Cycles (MODULE/THERMAL_CYCLES) Complete

No tests are allocated for this stage.

  Stage: Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Cold (MODULE/POST_PARYLENE_COLD) Complete

No tests are allocated for this stage.

  Stage: Post-Parylene Warm (MODULE/POST_PARYLENE_WARM) Complete

No tests are allocated for this stage.

  Stage: Parylene Unmasking (MODULE/PARYLENE_UNMASKING) Complete

No tests are allocated for this stage.

  Stage: Parylene Coating (MODULE/PARYLENE_COATING) Complete

No tests are allocated for this stage.

  Stage: Parylene Masking (MODULE/PARYLENE_MASKING) Complete

No tests are allocated for this stage.

  Stage: Initial Cold (MODULE/INITIAL_COLD) Locally Signed Off

No tests are allocated for this stage.

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: Bare module reception at ITk institute (BAREMODULERECEPTION) Complete

Test Local Result ProdDB Record
IV measurement
(IV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare Module Assembly (BAREMODULEASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Not to be used for detector (NOT_USED) Complete

No tests are allocated for this stage.

  Stage: Post Irradiation (POST_IRRAD) Alternative

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA at Institutes (QA) Alternative

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Inter-pixel capacitance
(INTER-PIXEL_CAPACITANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Inter-pixel resistance
(INTER-PIXEL_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IT measurement
(IT_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING) Locally Signed Off

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Sensor Manufacturer (sensor_manufacturer) Complete

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
IV measurement
(IV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
LocalDB Test ID Stage Test Name Inspector Date QC Registration
66f650d162de602d4549a876 BAREMODULERECEPTION IV_MEASURE KojiNakamura 2024-09-29 06:01:11 PDT(-0700) Selected
66ee45e5a2dfe0004211541a sensor_manufacturer IV_MEASURE KojiNakamura 2024-09-20 21:04:53 PDT(-0700) Selected
66ee3e86d7e81800436bc309 sensor_manufacturer CV_MEASURE KojiNakamura 2024-09-20 20:33:26 PDT(-0700) Selected
Stage Tests
sensor_manufacturer
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
WAFER_PROCESSING
  • Visual inspection  (VISUAL_INSPECTION)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
QA
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
  • IT measurement  (IT_MEASURE)
  • Inter-pixel capacitance  (INTER-PIXEL_CAPACITANCE)
  • Inter-pixel resistance  (INTER-PIXEL_RESISTANCE)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
POST_IRRAD
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION
  • IV measurement  (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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