20UPGS33300929

OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

Component Information

Serial Number 20UPGS33300929
ProdDB ID  3b9dad…8c72f4
LocalDB ID 66268795b345a200357e3dfe
Component Type SENSOR_TILE
Parents 20UPGB43320008 
Children No match.
Flags

 Properties

Item Value
Main Vendor readonly 3
Sensor Type or Test Structure readonly 3
Version of component production
Scratch id (to be used if not the same as agreed manufacturer ID) 50
Alternative Identifier V4-2-000050-3-004
Original Manufacturer ID Q4
Breakdown Voltage (-999 if no breakdown occurred) -999
Depletion Voltage (V) 64.52

 Comments


Test: IV_MEASURE QC Passed

(Stage: sensor_manufacturer)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date a year ago
component ObjectId 66268795b345a200357e3dfe
Stage sensor_manufacturer
Test Type IV_MEASURE
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66ee45e5a2dfe0004211541a
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat v450ffd4c
HUM 0
TEMP 20
BREAKDOWN_VOLTAGE -999
IV_ARRAY {'time': [0, 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80], 'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [1.0199999999999999e-05, 0.10092000000000001, 0.08704, 0.09158000000000001, 0.09445, 0.09665, 0.09845, 0.10006999999999999, 0.10158, 0.10293999999999999, 0.10365, 0.10421000000000001, 0.10463, 0.10521, 0.10583000000000001, 0.10652, 0.10728, 0.10804000000000001, 0.10882, 0.10962, 0.11043, 0.11293, 0.11342, 0.11402, 0.11472, 0.11549, 0.1163, 0.11714000000000001, 0.11805, 0.11896999999999999, 0.11997999999999999, 0.12102, 0.12219000000000001, 0.12333999999999999, 0.12458, 0.12587, 0.12721000000000002, 0.12861999999999998, 0.13008999999999998, 0.13162000000000001, 0.13322], 'sigma current': [], 'temperature': [], 'humidity': []}
IV_IMG []
LEAK_CURRENT 0.11402
MAXIMUM_VOLTAGE 200
NO_BREAKDOWN_VOLTAGE_OBSERVED True

ProductionDB Record

{}

 Current Stage: Insertion of pigtail and strain relief glueing

Past QC Stages and Results

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Module damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
IV measurement
(IV_MEASURE)		 Registered Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

QA at Institutes (QA)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)		 No result N/A
Inter-pixel capacitance
(INTER-PIXEL_CAPACITANCE)		 No result N/A
Inter-pixel resistance
(INTER-PIXEL_RESISTANCE)		 No result N/A
IT measurement
(IT_MEASURE)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)		 No result N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)		 No result N/A
Visual inspection
(VISUAL_INSPECTION)		 No result N/A

Sensor Manufacturer (sensor_manufacturer)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)		 Registered Registered
IV measurement
(IV_MEASURE)		 Registered Registered
LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
66f650…49a876 BAREMODULERECEPTION IV_MEASURE KojiNakamura N/A a year ago No tags Selected
66ee45…11541a sensor_manufacturer IV_MEASURE KojiNakamura N/A a year ago No tags Selected
66ee3e…6bc309 sensor_manufacturer CV_MEASURE KojiNakamura N/A a year ago No tags Selected
Stage Tests
sensor_manufacturer
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
WAFER_PROCESSING
  • Visual inspection  (VISUAL_INSPECTION)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
QA
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
  • IT measurement  (IT_MEASURE)
  • Inter-pixel capacitance  (INTER-PIXEL_CAPACITANCE)
  • Inter-pixel resistance  (INTER-PIXEL_RESISTANCE)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
POST_IRRAD
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION
  • IV measurement  (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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