20UPGPQ2210493

OB_LOADED_MODULE_CELL/LLS_RECEPTION

Component Information

Serial Number 20UPGPQ2210493
ProdDB ID  367ae0…77f5b3
LocalDB ID 65f0e4adbb920b0035f65fca
Component Type MODULE_PCB
Parents 20UPGM23210493 
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer NCAB
PCB design version readonly 2
PCB vendor technology readonly 2
SMD population vendor Garner Osborne Circuits
PCB BOM version 12

 Comments


Test: HV_LV_TEST QC Passed

(Stage: PCB_QC)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date a year ago
component ObjectId 65f0e4adbb920b0035f65fca
Stage PCB_QC
Test Type HV_LV_TEST
Institute ObjectId
User Name FuatUstuner
ObjectId of this record 66e12d3cc62de40043a3817d
ObjectId of RAW record None
Tags No tags

Results

Key Data
OPERATOR Bojan
EFFECTIVE_RESISTANCE 13.2
GND_DROP 0.32
HV_LEAKAGE 55
LEAKAGE_CURRENT 14
NTC_VALUE 7.907
NTC_VOLTAGE 1.29
R1_HV_RESISTOR -1
RELATIVE_HUMIDITY 0
TEMPERATURE 24.8
VIN_DROP 0.34

ProductionDB Record

id66e12d3cc62de40043a3817d
stateready
stateTs2024-09-11T05:40:12.497Z
stateUserIdentity2355-570-1
date2024-08-19T00:00:00.000Z
testType
id63ef7c67a1170e0037dc07eb
codeHV_LV_TEST
nameLV and HV Test
stateactive
institution
id5d318a7edf98f20009738a51
codeEDI
nameUniversity of Edinburgh
user
id6284fd0bba163f000ac270dd
userIdentity2355-570-1
firstNameFuat
middleName
lastNameUstuner
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvalue
OPERATOROperatorstringsingleFalseBojan
results
  • codeEFFECTIVE_RESISTANCE
    nameEffective resistance of the PCB [mΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value13.2
    associateChildNone
  • codeGND_DROP
    nameGND Drop [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0.32
    associateChildNone
  • codeHV_LEAKAGE
    nameHV (-975V) leakage value [mV]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMaxNone
    value55
    associateChildNone
  • codeLEAKAGE_CURRENT
    nameLeakage current [nA]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value14
    associateChildNone
  • codeNTC_VALUE
    nameNTC value [kΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value7.907
    associateChildNone
  • codeNTC_VOLTAGE
    nameNTC voltage [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1.29
    associateChildNone
  • codeR1_HV_RESISTOR
    nameR1 - HV resistor value [kΩ]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value-1
    associateChildNone
  • codeRELATIVE_HUMIDITY
    nameRelative Humidity [RH%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codeTEMPERATURE
    nameTemperature [°C]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value24.8
    associateChildNone
  • codeVIN_DROP
    nameVin Drop [V]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0.34
    associateChildNone
cts2024-09-11T05:40:12.497Z
sys
cts2024-09-11T05:40:12.497Z
mts2024-09-11T05:40:12.497Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
65f0e4adbb920b0035f65fca367ae031a4271c8ccb6a74a36377f5b3ready2024-03-12T23:26:37.408Z2355-570-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2210493None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueNCAB
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueNCAB (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueGarner Osborne Circuits
  • codePCB_BOM_VERSION
    namePCB BOM version
    dataTypecodeTable
    requiredFalse
    defaultFalse
    valueV1.1 L2
    codeTable
    codevalue
    10V1.1 L0
    11V1.1 L1
    12V1.1 L2
    20V2 L0
    21V2 L1
    22V2 L2
codePCB_QC
nameQC
order9
initialFalse
finalFalse
codeEDI
nameUniversity of Edinburgh

 Current Stage:

Past QC Stages and Results

Insertion of pigtail and strain relief glueing (OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION)

Module PCB tab cutting (in Combined Method) (OB_LOADED_MODULE_CELL/TAB_CUTTING)

Reception at Cell Integration Sites (OB_LOADED_MODULE_CELL/RECEPTION)

OB Loaded Module Cell Complete (OB_LOADED_MODULE_CELL/COMPLETE)

OB Loaded Module Cells failed test, needs investigation (OB_LOADED_MODULE_CELL/UNHAPPY)

Grading of OB Loaded Module Cells (OB_LOADED_MODULE_CELL/QC_STATUS)

Envelope Check (OB_LOADED_MODULE_CELL/ENVELOPE_CHECK)

Thermal Conductivity Test at Warm Temperature (OB_LOADED_MODULE_CELL/THERMAL_WARM)

Thermal Conductivity Test at Cold Temperature (OB_LOADED_MODULE_CELL/THERMAL_COLD)

Electrical Tests at Cold Temperature (OB_LOADED_MODULE_CELL/FINAL_COLD)

Electrical Tests at Warm Temperature (OB_LOADED_MODULE_CELL/FINAL_WARM)

Cold Cycle (OB_LOADED_MODULE_CELL/THERMAL_CYCLES)

Module to cell assembly (OB_LOADED_MODULE_CELL/ASSEMBLY)

Initial state to associate bare cell to module (OB_LOADED_MODULE_CELL/INIT)

Electrical testing at reception of LLS (LLS/RECEPTION)

Electrical testing on LLS at cold temperature (LLS/POST_TC_COLD)

Electrical testing on LLS at warm temperature (LLS/POST_TC_WARM)

Electrical testing before thermal cycling on LLS at cold temperature (LLS/PRE_TC_COLD)

Electrical testing before thermal cycling on LLS at warm temperature (LLS/PRE_TC_WARM)

Module PCB tab cutting (MODULE/TAB_CUTTING)

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
LV and HV Test
(HV_LV_TEST)		 Registered Registered
Tab cutting and gross defect inspection
(QUICK_TAB_CUTTING_INSPECTION)		 No result N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
67111a…ae7418 PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION PaulMickael Chabrillat N/A a year ago No tags Selected
66fc2c…c35e82 PCB_RECEPTION_MODULE_SITE METROLOGY PaulMickael Chabrillat N/A a year ago No tags Selected
66fc2c…c49d65 PCB_RECEPTION_MODULE_SITE MASS PaulMickael Chabrillat N/A a year ago No tags Selected
66e12d…a3817d PCB_QC HV_LV_TEST FuatUstuner N/A a year ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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