Database for ITk Pixel Module

Serial Number	20UPGM22110576
ProdDB ID	ed2e0f…10c439
LocalDB ID	64ef61e0c96c32004245fe1d
Component Type	MODULE
Parents	No match.
Children	No match.
Flags

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	2
Wirebond protection roof presence	False
IREF Trim Bit FE1 deleted	None
IREF Trim Bit FE2 deleted	None
IREF Trim Bit FE3 deleted	None
IREF Trim Bit FE4 deleted	None

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	64ef61e0c96c32004245fe1d
Stage	MODULE/PARYLENE_COATING
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	DoyeongKim
ObjectId of this record	6605a9a231eb120034d4992c
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat vVAZMVMDDRYTHXECNJDNKWTAVIKXWFE
DEFECTS	None
OBSERVATION	Parylene seeped in under the dicing tape at a corner
WIREBONDING_PASSED_QC	N/A

Expand ProductionDB Record

6622d7075e53800034338656

state

ready

stateTs

2024-04-19T20:41:43.419Z

stateUserIdentity

5718-8332-1

date

2024-03-28T17:32:00.000Z

testType

id	6418292ae43ca10038f30f84
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	63628636d213a00028c42a81
userIdentity	5718-8332-1
firstName	Doyeong
middleName
lastName	Kim

runNumber

6605a9a231eb120034d4992c

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	VAZMVMDDRYTHXECNJDNKWTAVIKXWFE	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

rangeMin

None

rangeMax

None

value

None

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code OBSERVATION
name Observation
order 8
dataType string
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value Parylene seeped in under the dicing tape at a corner
associateChild None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

cts

2024-04-19T20:41:43.419Z

sys

cts	2024-04-19T20:41:43.419Z
mts	2024-04-25T16:48:03.701Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

filename

user

540dcb42b7198ed90cc842925482146b

2024-04-25T16:48:03.701Z

20UPGM22110576_wirebonding

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/5/4/0/540dcb42b7198ed90cc842925482146b?authz=zteos64:MDAwMDAyOWF4nO2QsUvDQBTGaVGHTuIidHqIiCDJ3UtyTXKTOApdxC1ESHPXGmpzR3IZ7OhaOrvr4OAgLu7qP-DiPyAqdBXE1VgcHJycfcPH48f3Hh9f66bZahTL71ez66X2YmaGWqw1x3qz4bhEqpIk5ij51lQW-aBQlRZZOSRCGqu2E10oYYkeYcQjdHfd9Xw38Vlq0TSQFqLsW0GKfSvxen2KfsiEE-7dNaL9SkI3OQbwAQPuuJz54FDHi6HKBEcPOwFG8zgxDL6IS_1orGMwmZC54YVSxu6wMEDKPXTZdsR5vx7O0Ebs2GFgI40hT0aSz9-AyDnUYQ0fFj0GidYcDlVp-O-HQo2SLOc_yEAqThm6UFai3lZg9nz20H0tTifnGx-rl5Odi4O3e4xfbrG11dbxlLT_q_1btXDyOH1a-ATyu889

540dcb42b7198ed90cc842925482146b

id	63628636d213a00028c42a81
userIdentity	5718-8332-1
firstName	Doyeong
middleName
lastName	Kim

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

64ef61e0c96c32004245fe1d

ed2e0f097f8ade22e3e0a5ac6110c439

ready

2023-08-30T15:36:00.035Z

8341-478-1

False

None

False

None

20UPGM22110576

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False

code	MODULE/PARYLENE_COATING
name	Parylene Coating
order	6
initial	False
final	False

code	ANL
name	Argonne National Laboratory

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
6605a9…d4992c	VISUAL_INSPECTION	Fail	DoyeongKim	N/A	a year ago	VAZMVMDDRYTHXECNJDNKWTAVIKXWFE	No tags	Selected
66059f…2105bf	PARYLENE	Fail	DoyeongKim	N/A	a year ago		No tags	Selected

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered
Thermal Cycling (THERMAL_CYCLING)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
662a94…e4d21f	MODULE/THERMAL_CYCLES	IV_MEASURE	DoyeongKim	a year ago	a year ago	No tags	Selected
662965…cf0c9d	MODULE/THERMAL_CYCLES	VISUAL_INSPECTION	DoyeongKim	N/A	a year ago	No tags	Selected
661419…e650c3	MODULE/POST_PARYLENE_COLD	IV_MEASURE	DoyeongKim	a year ago	a year ago	No tags	Selected
663435…e4fab1	MODULE/POST_PARYLENE_COLD	E_SUMMARY	DoyeongKim	N/A	a year ago	No tags	Selected
66108b…e650ba	MODULE/POST_PARYLENE_WARM	IV_MEASURE	DoyeongKim	a year ago	a year ago	No tags	Selected
662ae2…e4db28	MODULE/POST_PARYLENE_WARM	E_SUMMARY	DoyeongKim	N/A	a year ago	No tags	Selected
6605ab…d49b24	MODULE/PARYLENE_UNMASKING	VISUAL_INSPECTION	DoyeongKim	N/A	a year ago	No tags	Selected
6605a9…d4992c	MODULE/PARYLENE_COATING	VISUAL_INSPECTION	DoyeongKim	N/A	a year ago	No tags	Selected
662965…1ef152	MODULE/WIREBONDING	VISUAL_INSPECTION	TanviWamorkar	N/A	a year ago	No tags	Selected
662964…cf0ae8	MODULE/ASSEMBLY	VISUAL_INSPECTION	TanviWamorkar	N/A	a year ago	No tags	Selected
66059f…2105bf	MODULE/PARYLENE_COATING	PARYLENE	DoyeongKim	N/A	a year ago	No tags	Selected
6605a6…d4979c	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	DoyeongKim	N/A	a year ago	No tags	Selected
65dcdf…168d3f	MODULE/INITIAL_COLD	E_SUMMARY	DoyeongKim	N/A	a year ago	No tags	Selected
65e0e3…3e8bdb	MODULE/INITIAL_WARM	IV_MEASURE	JD	N/A	a year ago	No tags	Selected
65c6b9…69e1d9	MODULE/INITIAL_WARM	E_SUMMARY	Matias	N/A	a year ago	No tags	Selected
64ef9b…4a65f5	MODULE/WIREBONDING	WIREBOND_PULL_TEST	DoyeongKim	N/A	a year ago	No tags	Selected
64ef87…4a0c5e	MODULE/WIREBONDING	WIREBONDING	DoyeongKim	N/A	a year ago	No tags	Selected
64ef64…bf316e	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	JD	N/A	2 years ago	No tags	Selected
64ef63…bf028f	MODULE/ASSEMBLY	MASS_MEASUREMENT	JD	N/A	2 years ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22110576

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: MODULE/PARYLENE_COATING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Long Term Stability Test

Candidate TestRuns of this Stage

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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