20UPGM22601047

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number 20UPGM22601047
ProdDB ID  dd945a…4a61bf
LocalDB ID 64cb0574bd95c80042a65c0d
Component Type MODULE
Parents No match.
Children 20UPGB42307013 Bare Module 20UPGFC0082583 FE Chip 20UPGFC0082566 FE Chip 20UPGFC0082555 FE Chip 20UPGFC0082547 FE Chip 20UPGPQ2601047 PCB
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version ITkpix_v1.1
PCB-Bare Orientation isNormal True
Wirebond protection roof presence None
IREF Trim Bit FE1 deleted None
IREF Trim Bit FE2 deleted None
IREF Trim Bit FE3 deleted None
IREF Trim Bit FE4 deleted None

 Comments

 Current Stage: Post-Parylene Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun!
IV measurement
(IV_MEASURE)
No TestRun!

 Candidate TestRuns of this Stage

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A
Wire bonding protection roof envelope
(WP_ENVELOPE)
No result N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test Local Result ProdDB Record
Parylene Properties
(PARYLENE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial Cold (MODULE/INITIAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)
No result N/A
Wirebonding Information
(WIREBONDING)
No result N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
No result N/A
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
No result N/A
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial state to associate flex to bare module (MODULE/INIT)

Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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