Top Page > Component List > 20UPGPQ3602155 > QC Result / PCB_POPULATION / VISUAL_INSPECTION


20UPGPQ3602155
Quad-PCB/Inner Pre-prod./Yamashita-Mat-75um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ3602155
Production DB Component ID 564c205835c8ce456772875374a4fe97
LocalDB Component ID 6495f3796a25bf0042c772c0
Component Type module_pcb
Super-Component 20UPIM13602155
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string Yamashita
PCB design version codeTable 3
PCB vendor technology codeTable 6
SMD population vendor string None

Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_POPULATION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-03-10 03:44:34 PDT(-0700)
component ObjectId 6495f3796a25bf0042c772c0
Stage PCB_POPULATION
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name Burhani Taher Saifuddin
ObjectId of this record 65ed8e7930d4aef6251df8dd
ObjectId of RAW record 65ed8e7930d4aef6251df8dc

Results

Key Data
ANALYSIS_VERSION mqat v1.0.11
INSTRUMENT
OPERATOR Burhani Taher Saifuddin
COMPONENT_MISALIGNMENT_GRADE 1
DATA_CONNECTOR_ASSEMBLY_GRADE 1
HV_LV_CONNECTOR_ASSEMBLY_GRADE 1
OBSERVATION -
OVERALL_GRADE 2
PARTICULATE_CONTAMINATION_GRADE 2
SCRATCHES_GRADE 2
SHORTS_OR_CLOSE_PROXIMITY_GRADE 1
SOLDERMASK_IRREGULARITIES_GRADE 1
SOLDER_SPILLS_GRADE 1
WATERMARKS_GRADE 1
WIREBOND_PADS_CONTAMINATION_GRADE 1

Visual Inspection Defects

Download front_image
Filename Contents Defects Comment

front_tile6

Download front_tile6
ink overflow onto the wire bond pads

front_tile7

Download front_tile7
  • Scratches_PCB
a scratch on the probe pads

front_tile11

Download front_tile11
ink overflow onto the wire bond pads

front_tile23

Download front_tile23
  • Scratches_Wirebonding_pad

front_tile25

Download front_tile25
ink overflow onto the probe pads

front_tile27

Download front_tile27
  • Dusts

RAW Results Record

Download RAW
serialNumber20UPGPQ3602155
testTypeVISUAL_INSPECTION
results
property
OPERATORBurhani Taher Saifuddin
INSTRUMENT
ANALYSIS_VERSIONNone
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGPQ3602155
front_defects
7
  • Yellow.Scratches_PCB
23
  • Yellow.Scratches_Wirebonding_pad
27
  • Yellow.Dusts
front_comments
0
1
2
3
4
5
6ink overflow onto the wire bond pads
7a scratch on the probe pads
8
9
10
11ink overflow onto the wire bond pads
12
13
14
15
16
17
18
19
20
21
22
23
24
25ink overflow onto the probe pads
26
27
28
29
30
31
32
33
34
35
front_image66fec3cdffccb2c5135a2eeb
front_defect_images
666fec3bdffccb2c5135a2af0
766fec3bdffccb2c5135a2ad8
1166fec3beffccb2c5135a2af5
2366fec3bdffccb2c5135a2aeb
2566fec3bcffccb2c5135a2aaf
2766fec3c0ffccb2c5135a2b08
Metadata
Measurements
WIREBOND_PADS_CONTAMINATION_GRADENone
PARTICULATE_CONTAMINATION_GRADENone
WATERMARKS_GRADENone
SCRATCHES_GRADENone
TRACES_GRADENone
SOLDERMASK_IRREGULARITIES_GRADENone
HV_LV_CONNECTOR_ASSEMBLY_GRADENone
DATA_CONNECTOR_ASSEMBLY_GRADENone
SOLDER_SPILLS_GRADENone
COMPONENT_MISALIGNMENT_GRADENone
SHORTS_OR_CLOSE_PROXIMITY_GRADENone
OPENS_TOMBSTONING_GRADENone
OVERALL_GRADENone
OBSERVATIONNone
stagePCB_POPULATION
component6495f3796a25bf0042c772c0
dbVersion1.01
address64657cef8d79bac1f3f00582
sys
mts2024-03-10 10:42:01.131000
cts2024-03-10 10:42:01.131000
rev0

ProductionDB Record

id65ed8ed557a6a40035a43e3c
stateready
stateTs2024-03-10T10:43:33.454Z
stateUserIdentity277-6873-1
date2024-03-10T10:42:00.000Z
testType
id5f644fba928ccc000ad1215f
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id5d428100f6e07b000a559e87
codeOKLAHOMA
nameUniversity of Oklahoma
user
id626da70bba163f000aa52801
userIdentity277-6873-1
firstNameBurhani Taher
middleName
lastNameSaifuddin
runNumber65ed8e7930d4aef6251df8dd
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis versionstringsingleFalse1.0.11NoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNone
OPERATOROperatorstringsingleFalseBurhani Taher SaifuddinNoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
COMPONENT_MISALIGNMENT_GRADEComponent misalignment (scale 1-3)integersingleNoneFalse1None
DATA_CONNECTOR_ASSEMBLY_GRADEData connector assembly issue (scale 1-3)integersingleNoneFalse1None
HV_LV_CONNECTOR_ASSEMBLY_GRADEHV LV connector assembly issue (scale 1-3)integersingleNoneFalse1None
OBSERVATIONObservationstringsingleNoneFalse-None
OVERALL_GRADEOverall grade (scale 1-3)integersingleNoneFalse2None
PARTICULATE_CONTAMINATION_GRADEParticulate contamination on the PCB including pick-up points (scale 1-3)integersingleNoneFalse2None
SCRATCHES_GRADEScratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)integersingleNoneFalse2None
SHORTS_OR_CLOSE_PROXIMITY_GRADEShorts/close proximity of components due to misalignment (scale 1-3)integersingleNoneFalse1None
SOLDERMASK_IRREGULARITIES_GRADESoldermask irregularity/cracks grade (scale 1-3)integersingleNoneFalse1None
SOLDER_SPILLS_GRADESolder spills as part of assembly process on wirebonding pads (scale 1-3)integersingleNoneFalse1None
WATERMARKS_GRADEWatermarks on the PCB (scale 1-3)integersingleNoneFalse1None
WIREBOND_PADS_CONTAMINATION_GRADEWirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)integersingleNoneFalse1None
cts2024-03-10T10:43:33.454Z
sys
cts2024-03-10T10:43:33.454Z
mts2024-03-10T10:44:34.589Z
rev12
defects
codenamedescriptionproperties
1c62900d21bc5218f9c6d27afront_tile7Yellow.Scratches_PCB
ee5ee47f49e76907e0920461front_tile23Yellow.Scratches_Wirebonding_pad
9dc2c32f268ff524ee126df8front_tile27Yellow.Dusts
comments
codedateTimecommentuser
143ae83d84d39a37ff58af6f2024-03-10T10:44:34.589Ztile_comment::front_tile6 : ink overflow onto the wire bond pads
id626da70bba163f000aa52801
userIdentity277-6873-1
firstNameBurhani Taher
middleName
lastNameSaifuddin
fc22334b499c6b3bc2f684d12024-03-10T10:44:34.589Ztile_comment::front_tile7 : a scratch on the probe pads
id626da70bba163f000aa52801
userIdentity277-6873-1
firstNameBurhani Taher
middleName
lastNameSaifuddin
a615cbbd95ef1996b20720132024-03-10T10:44:34.589Ztile_comment::front_tile11 : ink overflow onto the wire bond pads
id626da70bba163f000aa52801
userIdentity277-6873-1
firstNameBurhani Taher
middleName
lastNameSaifuddin
2a812d33d7792571642cf3292024-03-10T10:44:34.589Ztile_comment::front_tile25 : ink overflow onto the probe pads
id626da70bba163f000aa52801
userIdentity277-6873-1
firstNameBurhani Taher
middleName
lastNameSaifuddin
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components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6495f3796a25bf0042c772c0564c205835c8ce456772875374a4fe97ready2023-06-23T19:33:13.841Z6795-7859-1FalseFalseNoneNoneFalseNoneNone20UPGPQ3602155None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction IS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
codePCB_POPULATION
namePopulation
order1
initialFalse
finalFalse
codeOKLAHOMA
nameUniversity of Oklahoma

Current Stage: Initial Cold

No tests are allocated for this stage.


Past QC Stages and Results

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Alternative

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Locally Signed Off

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Alternative

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Alternative

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Alternative

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Alternative

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66a954df25a1bee822030d63 PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION Daniel 2024-08-14 15:59:07 PDT(-0700) Selected
66a9383dd19fe900438cb6e9 PCB_RECEPTION_MODULE_SITE METROLOGY Daniel 2024-07-30 12:00:13 PDT(-0700) Selected
65f0925f57a6a40035aa002d PCB_QC HV_LV_TEST AchmadAditya 2024-03-12 10:35:27 PDT(-0700) Selected
65ed8e7930d4aef6251df8dd PCB_POPULATION VISUAL_INSPECTION Burhani Taher Saifuddin 2024-03-10 03:44:34 PDT(-0700) Selected
6539713c9322f50042e749ac PCB_QC HV_LV_TEST AchmadAditya 2023-10-25 12:49:16 PDT(-0700)
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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