[
    {
        "serialNumber": "20UPGPQ3602155",
        "testType": "VISUAL_INSPECTION",
        "results": {
            "property": {
                "OPERATOR": "Burhani Taher Saifuddin",
                "INSTRUMENT": "",
                "ANALYSIS_VERSION": null
            },
            "comment": "",
            "metadata": {
                "QCHELPER_VERSION": "4.0.dev1",
                "MODULE_SN": "20UPGPQ3602155",
                "front_defects": {
                    "7": [
                        "Yellow.Scratches_PCB"
                    ],
                    "23": [
                        "Yellow.Scratches_Wirebonding_pad"
                    ],
                    "27": [
                        "Yellow.Dusts"
                    ]
                },
                "front_comments": {
                    "0": "",
                    "1": "",
                    "2": "",
                    "3": "",
                    "4": "",
                    "5": "",
                    "6": "ink overflow onto the wire bond pads",
                    "7": "a scratch on the probe pads",
                    "8": "",
                    "9": "",
                    "10": "",
                    "11": "ink overflow onto the wire bond pads",
                    "12": "",
                    "13": "",
                    "14": "",
                    "15": "",
                    "16": "",
                    "17": "",
                    "18": "",
                    "19": "",
                    "20": "",
                    "21": "",
                    "22": "",
                    "23": "",
                    "24": "",
                    "25": "ink overflow onto the probe pads",
                    "26": "",
                    "27": "",
                    "28": "",
                    "29": "",
                    "30": "",
                    "31": "",
                    "32": "",
                    "33": "",
                    "34": "",
                    "35": ""
                },
                "front_image": "66fec3cdffccb2c5135a2eeb",
                "front_defect_images": {
                    "6": "66fec3bdffccb2c5135a2af0",
                    "7": "66fec3bdffccb2c5135a2ad8",
                    "11": "66fec3beffccb2c5135a2af5",
                    "23": "66fec3bdffccb2c5135a2aeb",
                    "25": "66fec3bcffccb2c5135a2aaf",
                    "27": "66fec3c0ffccb2c5135a2b08"
                }
            },
            "Metadata": {},
            "Measurements": {},
            "WIREBOND_PADS_CONTAMINATION_GRADE": null,
            "PARTICULATE_CONTAMINATION_GRADE": null,
            "WATERMARKS_GRADE": null,
            "SCRATCHES_GRADE": null,
            "TRACES_GRADE": null,
            "SOLDERMASK_IRREGULARITIES_GRADE": null,
            "HV_LV_CONNECTOR_ASSEMBLY_GRADE": null,
            "DATA_CONNECTOR_ASSEMBLY_GRADE": null,
            "SOLDER_SPILLS_GRADE": null,
            "COMPONENT_MISALIGNMENT_GRADE": null,
            "SHORTS_OR_CLOSE_PROXIMITY_GRADE": null,
            "OPENS_TOMBSTONING_GRADE": null,
            "OVERALL_GRADE": null,
            "OBSERVATION": null
        },
        "stage": "PCB_POPULATION",
        "dbVersion": 1.01
    }
]