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20UPGBQ2101015
Quad-Digital-BareModule/ITkPix_v1.1/Leonardo
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Component Information

Item Value
Serial Number 20UPGBQ2101015
Production DB Component ID 20d9676cd3fe88987f777252363c7b9d
LocalDB Component ID 652488b8d2e4250042262889
Component Type bare_module
Super-Component No match.
Sub-Components •  20UPGFC0090789   FE Chip
•  20UPGFC0090757   FE Chip
•  20UPGFC0090821   FE Chip
•  20UPGFC0090807   FE Chip
Flags

Properties

Item Data Type Value
FE chip version codeTable ITkpix_v1.1
Sensor Type codeTable No sensor
Vendor code codeTable ITk institute
Thickness of FE chips (RD53A) codeTable None

Comments

Current Stage: Bare module assembly

No tests are allocated for this stage.

Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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