20UPGBQ2101015

BAREMODULEASSEMBLY

Component Information

Serial Number 20UPGBQ2101015
ProdDB ID  20d967…3c7b9d
LocalDB ID 652488b8d2e4250042262889
Component Type BARE_MODULE
Parents No match.
Children 20UPGFC0090789 FE Chip 20UPGFC0090757 FE Chip 20UPGFC0090821 FE Chip 20UPGFC0090807 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly ITkpix_v1.1
Sensor Type No sensor
Vendor code readonly ITk institute
Thickness of FE chips (RD53A) None

 Comments

 Current Stage: Bare module assembly

Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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