[
    {
        "serialNumber": "20UPGM22001172",
        "testType": "VISUAL_INSPECTION",
        "subtestType": "",
        "results": {
            "property": {
                "ANALYSIS_VERSION": null,
                "MEASUREMENT_DATE": null,
                "MEASUREMENT_DURATION": null,
                "VISUAL_INSPECTION_MEASUREMENT_VERSION": "0.1.1.dev5"
            },
            "comment": "",
            "Metadata": {
                "QCHELPER_VERSION": "0.1.1.dev5",
                "ModuleSN": "20UPGM22001172",
                "TimeStart": 1763682398,
                "front_defects": {},
                "front_comments": {
                    "0": "The wirebond is bent",
                    "1": "wirebond issue",
                    "2": "chip rippped",
                    "3": "wirebond slightly bent"
                },
                "front_image": "691fa979adb2d9ad8c135c29",
                "front_defect_images": {
                    "0": "691fa979adb2d9ad8c135c46",
                    "1": "691fa979adb2d9ad8c135c4f",
                    "2": "691fa97aadb2d9ad8c135c58",
                    "3": "691fa97aadb2d9ad8c135c61"
                }
            },
            "Measurements": {},
            "DEFECTS": null,
            "SMD_COMPONENTS_PASSED_QC": null,
            "SENSOR_CONDITION_PASSED_QC": null,
            "FE_CHIP_CONDITION_PASSED_QC": null,
            "GLUE_DISTRIBUTION_PASSED_QC": null,
            "WIREBONDING_PASSED_QC": null,
            "PARYLENE_COATING_PASSED_QC": null,
            "OBWBP_ASSEMBLY_PASSED_QC": null,
            "STREIN_RELIEF_PASSED_QC": null,
            "OBSERVATION": null
        },
        "stage": "MODULE/POST_PARYLENE_WARM",
        "dbVersion": 1.01
    }
]