{"properties": {"ANALYSIS_VERSION": null, "MEASUREMENT_DATE": "2024-05-23T16:24:00.000Z"}, "DEFECTS": ["0"], "FE_CHIP_CONDITION_PASSED_QC": "1", "GLUE_DISTRIBUTION_PASSED_QC": "1", "OBSERVATION": "Parylene debris appears to be touching wirebonds near the bottom of chip 1; wirebonds near the middle of chip 3 that lead to different pads appear to be too close together", "PARYLENE_COATING_PASSED_QC": "1", "SENSOR_CONDITION_PASSED_QC": "1", "SMD_COMPONENTS_PASSED_QC": "1", "WIREBONDING_PASSED_QC": "1"}