{"properties": {"ANALYSIS_VERSION": null, "MEASUREMENT_DATE": "2024-05-20T19:15:00.000Z"}, "DEFECTS": ["0"], "FE_CHIP_CONDITION_PASSED_QC": "1", "GLUE_DISTRIBUTION_PASSED_QC": "1", "OBSERVATION": "Odd debris on wirebond from pad 145 on chip 4; Odd area on flex-side of wirebond from pad 147 on chip 2; wirebonds from different flex-side pads very close together on chip 4; some debris near the top of chip 2", "PARYLENE_COATING_PASSED_QC": "1", "SENSOR_CONDITION_PASSED_QC": "1", "SMD_COMPONENTS_PASSED_QC": "1", "WIREBONDING_PASSED_QC": "1"}