{"properties": {"ANALYSIS_VERSION": "1", "INSTRUMENT": "Olympus Microscope", "OPERATOR": "Chris"}, "COMPONENT_MISALIGNMENT_GRADE": 1, "DATA_CONNECTOR_ASSEMBLY_GRADE": 1, "HV_LV_CONNECTOR_ASSEMBLY_GRADE": 1, "OBSERVATION": "scratches on all bondpad sections, soldermask issues section 1,8, 13, 16 exposed vias on sections 8, 12, 13, 16 contamination section 1,5,13,16 Watermarks section 2, 4, 16, ", "OPENS_TOMBSTONING_GRADE": 1, "OVERALL_GRADE": 2, "PARTICULATE_CONTAMINATION_GRADE": 1, "SCRATCHES_GRADE": 2, "SHORTS_OR_CLOSE_PROXIMITY_GRADE": 1, "SOLDERMASK_IRREGULARITIES_GRADE": 2, "SOLDER_SPILLS_GRADE": 1, "TRACES_GRADE": 2, "WATERMARKS_GRADE": 2, "WIREBOND_PADS_CONTAMINATION_GRADE": 1}