Database for ITk Pixel Module

Serial Number	20UPIMS4104211
ProdDB ID	4e6db9…f370cf
LocalDB ID	69b7b784f29e2a5bf9bfd177
Component Type	MODULE
Parents	No match.
Children	20UPGB13200171 Bare Module 20UPGFC0150357 FE Chip 20UPGB13200173 Bare Module 20UPGFC0150389 FE Chip 20UPGB13200178 Bare Module 20UPGFC0150469 FE Chip 20UPIPT5254211 PCB
Flags

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	3
Wirebond protection roof presence	False
Alternative ID	None
Is preproduction module	False
Rank	None

Key	Data
component id	69b7b784f29e2a5bf9bfd177
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f00596
user	KrishnanRama

Key	Data
properties	{'ANALYSIS_VERSION': None, 'INSTRUMENT': None, 'MEASUREMENT_DATE': None, 'MEASUREMENT_DURATION': None, 'OPERATOR_IDENTITY': None} g
BOND_PEEL	<span class="badge badge-warning">N/A</span> g
DATA_UNAVAILABLE	False g
HEEL_BREAKS_ON_FE_CHIP	<span class="badge badge-warning">N/A</span> g
HEEL_BREAKS_ON_PCB	<span class="badge badge-warning">N/A</span> g
LIFT_OFFS_LESS_THAN_7G	<span class="badge badge-warning">N/A</span> g
PULL_STRENGTH	8.4 g
PULL_STRENGTH_DATA	<span class="badge badge-warning">N/A</span> g
PULL_STRENGTH_ERROR	<span class="badge badge-warning">N/A</span> g
PULL_STRENGTH_MAX	9.1 g
PULL_STRENGTH_MIN	8 g
WIRE_BREAKS_5G	<span class="badge badge-warning">N/A</span> g
WIRE_PULLS	15 g

Expand ProductionDB Record

69b7bb6d8aae92e94d18aaf4

state

ready

stateTs

2026-03-16T08:12:29.748Z

stateUserIdentity

3667-3929-1

date

2026-03-16T08:11:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5ecf13a093e5ee000a0e5ac6
code	IFAE
name	Institut de Fisica d'Altes Energies (IFAE)

user

id	66fc07b1ef991c0043c2688a
userIdentity	3667-3929-1
firstName	Krishnan
middleName
lastName	Rama

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	None	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	None	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.4
associateChild None
code PULL_STRENGTH_DATA
name Pull strength data
order 1
dataType float
valueType array
arrayDimensions 3
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.1
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 15
associateChild None

cts

2026-03-16T08:12:29.748Z

sys

cts	2026-03-16T08:12:29.748Z
mts	2026-03-16T08:12:29.748Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

69b7b784f29e2a5bf9bfd177

4e6db905a8e7d24811c25446d8f370cf

ready

2026-03-16T07:55:48.616Z

3667-3929-1

False

None

False

None

20UPIMS4104211

None

code	P
name	Pixels

code	PI
name	Inner pixels

code	MODULE
name	Module

code	TRIPLET_L0_STAVE_MODULE
name	Triplet L0 stave module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value None
code IS_PREPRODUCTION_MODULE
name Is preproduction module
dataType boolean
required False
default False
value False

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	IFAE
name	Institut de Fisica d'Altes Energies (IFAE)

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
69b7bb…18aaf4	WIREBOND_PULL_TEST	Pass	KrishnanRama	N/A	3 months ago	None	No tags	Selected
69b7bb…0eedcc	VISUAL_INSPECTION	Pass	KrishnanRama	N/A	3 months ago	None	No tags	Selected

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Longterm stability DCS (LONG_TERM_STABILITY_DCS)	No result	N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Thermal Cycling (THERMAL_CYCLING)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	No result	N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	No result	N/A
Triplet Module Metrology (TRIPLET_METROLOGY)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
69c3a5…cc9e30	MODULE/FINAL_WARM	IV_MEASURE	NirajKakoty	3 months ago	3 months ago	No tags	Selected
69c3ec…cca59f	MODULE/FINAL_WARM	E_SUMMARY	NirajKakoty	N/A	3 months ago	No tags	Selected
69c3a4…cc9df3	MODULE/THERMAL_CYCLES	THERMAL_CYCLING	NirajKakoty	3 months ago	3 months ago	No tags	Selected
69bc05…1e6b2f	MODULE/INITIAL_WARM	IV_MEASURE	NirajKakoty	3 months ago	3 months ago	No tags	Selected
69c3a3…cc9dbb	MODULE/INITIAL_WARM	E_SUMMARY	NirajKakoty	N/A	3 months ago	No tags	Selected
69b7bb…18aaf4	MODULE/WIREBONDING	WIREBOND_PULL_TEST	KrishnanRama	N/A	3 months ago	No tags	Selected
69b7bb…0eedcc	MODULE/WIREBONDING	VISUAL_INSPECTION	KrishnanRama	N/A	3 months ago	No tags	Selected
69b7ba…18a6af	MODULE/ASSEMBLY	TRIPLET_METROLOGY	KrishnanRama	N/A	3 months ago	No tags	Selected
69b7b8…0ed80c	MODULE/ASSEMBLY	VISUAL_INSPECTION	KrishnanRama	N/A	3 months ago	No tags	Selected
69b7b8…bfd330	MODULE/ASSEMBLY	MASS_MEASUREMENT	KrishnanRama	N/A	3 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIMS4104211

MODULE/FINAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

ProductionDB Record

Current Stage: Final Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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