Database for ITk Pixel Module

Serial Number	20UPGM24810360
ProdDB ID	f5162f…2b3ac6
LocalDB ID	699437d99e0bed6d7da4768b
Component Type	MODULE
Parents	No match.
Children	20UPGB43000504 Bare Module 20UPGFC0224845 FE Chip 20UPGFC0224819 FE Chip 20UPGFC0224821 FE Chip 20UPGFC0224820 FE Chip 20UPGPQ4810360 PCB
Flags	• BAD_DURING_ASSEMBLY

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	3
Wirebond protection roof presence	False
Alternative ID	Paris1164
Is preproduction module	False
Rank	None

Key	Data
QC Passed	True
Date	a month ago
component ObjectId	699437d99e0bed6d7da4768b
Stage	MODULE/ASSEMBLY
Test Type	MASS_MEASUREMENT
Institute ObjectId
User Name	ReisaburoTanaka
ObjectId of this record	699438f4fdfa7d87232b2726
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat vNone
MEASUREMENT_DATE	2026-02-16T23:00:00.000Z
OPERATOR_IDENTITY	None
SCALE_ACCURACY	0.1
MASS	3123

Expand ProductionDB Record

69944b2d9e0bed6d7da53a05

state

ready

stateTs

2026-02-17T11:04:13.252Z

stateUserIdentity

8846-6844-1

date

2026-02-17T09:46:00.000Z

testType

id	63fb5fdb6b1f270036833ce0
code	MASS_MEASUREMENT
name	Mass Measurement
state	active

institution

id	5d372a3becb4750009835557
code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

user

id	61e962d9875a70000a9fab6a
userIdentity	8846-6844-1
firstName	Reisaburo
middleName
lastName	Tanaka

runNumber

699438f4fdfa7d87232b2726

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2026-02-16T23:00:00.000Z	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	None	None	None
SCALE_ACCURACY	Scale Accuracy [mg]	float	single	False	0.1	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
MASS	Mass [mg]	float	single	None	False	3123	None

cts

2026-02-17T11:04:13.252Z

sys

cts	2026-02-17T11:04:13.252Z
mts	2026-02-17T11:04:13.252Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

699437d99e0bed6d7da4768b

f5162f512b8be24e7a0105270b2b3ac6

ready

2026-02-17T09:41:45.483Z

8769-4020-1

False

None

False

None

20UPGM24810360

Paris1164

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value Paris1164
code IS_PREPRODUCTION_MODULE
name Is preproduction module
dataType boolean
required False
default False
value False

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Ranking of the module (MODULE/QC_STATUS)

Test	Local Result	ProdDB Record
Module ranking (RANKING)	No result	N/A

Final flatness measurement (MODULE/FINAL_METROLOGY)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Cold (MODULE/FINAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Warm (MODULE/FINAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Longterm stability DCS (LONG_TERM_STABILITY_DCS)	No result	N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Thermal Cycling (THERMAL_CYCLING)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A
Wirebonding Information (WIREBONDING)	No result	N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
699438…2b263b	MODULE/ASSEMBLY	VISUAL_INSPECTION	ReisaburoTanaka	N/A	a month ago	No tags	Selected
699439…2b296b	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	ReisaburoTanaka	N/A	a month ago	No tags	Selected
699438…2b2726	MODULE/ASSEMBLY	MASS_MEASUREMENT	ReisaburoTanaka	N/A	a month ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24810360 (Paris1164)

MODULE/GRAVEYARD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: MASS_MEASUREMENT QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Module graveyard - damaged, impossible to recover

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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