Database for ITk Pixel Module

Serial Number	20UPGM24810360
ProdDB ID	f5162f…2b3ac6
LocalDB ID	699437d99e0bed6d7da4768b
Component Type	MODULE
Parents	No match.
Children	20UPGB43000504 Bare Module 20UPGFC0224845 FE Chip 20UPGFC0224819 FE Chip 20UPGFC0224821 FE Chip 20UPGFC0224820 FE Chip 20UPGPQ4810360 PCB
Flags	• BAD_DURING_ASSEMBLY

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	3
Wirebond protection roof presence	False
Alternative ID	Paris1164
Is preproduction module	False
Rank	None

Key	Data
QC Passed	True
Date	a month ago
component ObjectId	699437d99e0bed6d7da4768b
Stage	MODULE/ASSEMBLY
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ReisaburoTanaka
ObjectId of this record	699438dbfdfa7d87232b263b
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat v1
MEASUREMENT_DATE	2026-02-16T23:00:00.000Z
MEASUREMENT_DURATION	4
DEFECTS	['5']
FE_CHIP_CONDITION_PASSED_QC	1
GLUE_DISTRIBUTION_PASSED_QC	1
OBSERVATION	Le coin du sensor en haut à droite est fissuré
SENSOR_CONDITION_PASSED_QC	3
SMD_COMPONENTS_PASSED_QC	1

Expand ProductionDB Record

69944b2ffdfa7d87232bdf08

state

ready

stateTs

2026-02-17T11:04:15.140Z

stateUserIdentity

8846-6844-1

date

2026-02-17T09:46:00.000Z

testType

id	6418292ae43ca10038f30f84
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d372a3becb4750009835557
code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

user

id	61e962d9875a70000a9fab6a
userIdentity	8846-6844-1
firstName	Reisaburo
middleName
lastName	Tanaka

runNumber

699438dbfdfa7d87232b263b

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2026-02-16T23:00:00.000Z	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	4	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code

FE_CHIP_CONDITION_PASSED_QC

name

FE chip condition passed QC (1: good, 2: issues, 3: bad)

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
1	Good
2	Issues
3	Bad

code

GLUE_DISTRIBUTION_PASSED_QC

name

Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)

order

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
1	Good
2	Issues
3	Bad

code OBSERVATION
name Observation
dataType string
valueType single
arrayDimensions None
additional False
value Le coin du sensor en haut à droite est fissuré
associateChild None

code

SENSOR_CONDITION_PASSED_QC

name

Sensor condition passed QC (1: good, 2: issues, 3: bad)

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

dateTime

2026-03-03T13:32:31.317Z

userIdentity

1410-4773-1

associateChild

None

codeTable

code	value
1	Good
2	Issues
3	Bad

code

SMD_COMPONENTS_PASSED_QC

name

SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
1	Good
2	Issues
3	Bad

cts

2026-02-17T11:04:15.140Z

sys

cts	2026-02-17T11:04:15.140Z
mts	2026-03-03T13:32:31.325Z
rev	1

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

699437d99e0bed6d7da4768b

f5162f512b8be24e7a0105270b2b3ac6

ready

2026-02-17T09:41:45.483Z

8769-4020-1

False

None

False

None

20UPGM24810360

Paris1164

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value Paris1164
code IS_PREPRODUCTION_MODULE
name Is preproduction module
dataType boolean
required False
default False
value False

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Ranking of the module (MODULE/QC_STATUS)

Test	Local Result	ProdDB Record
Module ranking (RANKING)	No result	N/A

Final flatness measurement (MODULE/FINAL_METROLOGY)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Cold (MODULE/FINAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Warm (MODULE/FINAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Longterm stability DCS (LONG_TERM_STABILITY_DCS)	No result	N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Thermal Cycling (THERMAL_CYCLING)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A
Wirebonding Information (WIREBONDING)	No result	N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
699438…2b263b	MODULE/ASSEMBLY	VISUAL_INSPECTION	ReisaburoTanaka	N/A	a month ago	No tags	Selected
699439…2b296b	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	ReisaburoTanaka	N/A	a month ago	No tags	Selected
699438…2b2726	MODULE/ASSEMBLY	MASS_MEASUREMENT	ReisaburoTanaka	N/A	a month ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24810360 (Paris1164)

MODULE/GRAVEYARD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Module graveyard - damaged, impossible to recover

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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