Database for ITk Pixel Module

Serial Number	20UPGM24810067
ProdDB ID	e071f3…a89c0c
LocalDB ID	698478609e0bed6d7d4964ce
Component Type	MODULE
Parents	No match.
Children	20UPGB43200802 Bare Module 20UPGFC0152600 FE Chip 20UPGFC0152633 FE Chip 20UPGFC0152715 FE Chip 20UPGFC0152666 FE Chip 20UPGPQ4810067 PCB
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
QC Passed	True
Date	a month ago
component ObjectId	698478609e0bed6d7d4964ce
Stage	MODULE/ASSEMBLY
Test Type	GLUE_MODULE_FLEX_ATTACH
Institute ObjectId
User Name	MariaCecilia Queiroga Bazetto
ObjectId of this record	6984b9169e0bed6d7d4ab3d1
ObjectId of RAW record	None
Tags	No tags

Key	Data
BATCH_NUMBER	ADN0030300
CURE_TIME	None
GLUE_TYPE	Epoxy Resin
LOCATION_ASSEMBLY	LIV
MEASUREMENT_DATE	2026-02-05T11:50:00.000Z
OPERATOR_IDENTITY	MCQBazetto
RATIO	None
TOOL_ID	67
TOOL_TYPE	1
HUMIDITY	46.8
TEMP	18.9

Expand ProductionDB Record

6984b9169e0bed6d7d4ab3d1

state

ready

stateTs

2026-02-05T15:36:54.832Z

stateUserIdentity

7071-1560-1

date

2026-02-05T11:50:00.000Z

testType

id	5d13188702c38f00090aaad9
code	GLUE_MODULE_FLEX_ATTACH
name	Glue Information Module+Flex Attach
state	active

institution

id	59f1f092df054600056d35b2
code	LIV
name	University of Liverpool

user

id	67f3dc9969bd7fedf778ec07
userIdentity	7071-1560-1
firstName	Maria
middleName
lastName	Cecilia Queiroga Bazetto

runNumber

passed

True

problems

False

properties

code BATCH_NUMBER
name Glue Batch Number
dataType string
valueType single
required True
value ADN0030300
code CURE_TIME
name Cure time [h]
dataType float
valueType None
required False
value None
rangeMin None
rangeMax None
code GLUE_TYPE
name Glue type
dataType string
valueType single
required True
value Epoxy Resin
code LOCATION_ASSEMBLY
name Location of assembly
dataType string
valueType None
required False
value LIV
rangeMin None
rangeMax None
code MEASUREMENT_DATE
name Date of assembly
dataType datetime
valueType None
required False
value 2026-02-05T11:50:00.000Z
rangeMin None
rangeMax None
code OPERATOR_IDENTITY
name Operator identity
dataType string
valueType single
required False
value MCQBazetto
rangeMin None
rangeMax None
code RATIO
name Ratio of epoxy mixture
dataType float
valueType single
required False
value None
code TOOL_ID
name Tool ID
dataType integer
valueType single
required False
value 67
rangeMin None
rangeMax None
code TOOL_TYPE
name Tool type
dataType codeTable
valueType single
required False
value 1
codeTable
code value
1 Common
2 Japan
3 Oxford
4 triplet

results

code	name	order	dataType	valueType	additional	rangeMin	rangeMax	value	associateChild
HUMIDITY	Humidity (%)	1	float	single	False	None	None	46.8	None
TEMP	Room Temperature (C)	1	float	single	False	None	None	18.9	None

cts

2026-02-05T15:36:54.832Z

sys

cts	2026-02-05T15:36:54.832Z
mts	2026-02-05T15:36:54.832Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

698478609e0bed6d7d4964ce

e071f3b3750b0fe77ee3039e11a89c0c

ready

2026-02-05T11:00:48.894Z

24-7183-1

False

None

False

None

20UPGM24810067

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	LIV
name	University of Liverpool

Test Type	Local Result
Wirebonding Information (WIREBONDING)	No TestRun!
Wirebond pull test (WIREBOND_PULL_TEST)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
6984b9…4ab3d1	GLUE_MODULE_FLEX_ATTACH	Pass	MariaCecilia Queiroga Bazetto	N/A	a month ago		No tags	Selected

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Module Metrology (QUAD_MODULE_METROLOGY)	No result	N/A
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6984b9…4ab3d1	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	MariaCecilia Queiroga Bazetto	N/A	a month ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24810067

MODULE/WIREBONDING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: GLUE_MODULE_FLEX_ATTACH QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Wire Bonding

Candidate TestRuns of this Stage

Past QC Stages and Results

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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