Database for ITk Pixel Module

Serial Number	20UPIM04202229
ProdDB ID	07b4d9…f3a08c
LocalDB ID	6925727915280561fda3fdd6
Component Type	MODULE
Parents	No match.
Children	20UPGB13200124 Bare Module 20UPGFC0220551 FE Chip 20UPGB13200125 Bare Module 20UPGFC0220567 FE Chip 20UPGB13200126 Bare Module 20UPGFC0220583 FE Chip 20UPIP05252229 PCB
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
component id	6925727915280561fda3fdd6
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f0055a
user	RagnhildHallaraker

Key	Data
properties	{'ANALYSIS_VERSION': '1', 'INSTRUMENT': 'FK Delvotec 5600-C', 'MEASUREMENT_DATE': '2025-11-26T16:13:21.626Z', 'MEASUREMENT_DURATION': None, 'OPERATOR_IDENTITY': 'RSH'} g
BOND_PEEL	0 g
DATA_UNAVAILABLE	False g
HEEL_BREAKS_ON_FE_CHIP	100 g
HEEL_BREAKS_ON_PCB	0 g
LIFT_OFFS_LESS_THAN_7G	0 g
PULL_STRENGTH	11.53 g
PULL_STRENGTH_DATA	[[[11.51, 2, 3]], [[11.58, 2, 3]], [[12.35, 2, 3]], [[12.19, 2, 3]], [[10.99, 2, 3]], [[10.69, 2, 2]], [[11.3, 2, 2]], [[11.32, 2, 2]], [[11.58, 2, 2]], [[11.64, 2, 2]], [[11.07, 2, 1]], [[11.68, 2, 1]], [[11.42, 2, 1]], [[11.44, 2, 1]], [[12.16, 2, 1]]] g
PULL_STRENGTH_ERROR	0.45 g
PULL_STRENGTH_MAX	12.35 g
PULL_STRENGTH_MIN	10.69 g
WIRE_BREAKS_5G	0 g
WIRE_PULLS	15 g

Expand ProductionDB Record

694575b0443fc79a1e303eee

state

ready

stateTs

2025-12-19T15:56:32.392Z

stateUserIdentity

4287-3818-1

date

2025-12-19T16:56:18.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5a832050daf1a000052e3e98
code	UIO
name	University of Oslo, Department of Physics

user

id	61375da68fc62a000ab9a162
userIdentity	4287-3818-1
firstName	Ragnhild
middleName
lastName	Hallaraker

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1	None	None
INSTRUMENT	Instrument	string	single	False	FK Delvotec 5600-C	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-11-26T16:13:21.626Z	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	RSH	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 100
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 11.53
associateChild None

code	PULL_STRENGTH_DATA
name	Pull strength data
order	1
dataType	float
valueType	array
arrayDimensions	3
additional	False
rangeMin	None
rangeMax	None
value	11.51 2 3 11.58 2 3 12.35 2 3 12.19 2 3 10.99 2 3 10.69 2 2 11.3 2 2 11.32 2 2 11.58 2 2 11.64 2 2 11.07 2 1 11.68 2 1 11.42 2 1 11.44 2 1 12.16 2 1
associateChild	None

code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.45
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 12.35
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 10.69
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 15
associateChild None

cts

2025-12-19T15:56:32.392Z

sys

cts	2025-12-19T15:56:32.392Z
mts	2025-12-19T15:56:32.392Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6925727915280561fda3fdd6

07b4d9f556db8db7559ebe0b2af3a08c

ready

2025-11-25T09:10:17.219Z

5307-101-1

False

None

False

None

20UPIM04202229

None

code	P
name	Pixels

code	PI
name	Inner pixels

code	MODULE
name	Module

code	TRIPLET_L0_RING0_MODULE
name	Triplet L0 Ring0 module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	UIO
name	University of Oslo, Department of Physics

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
694575…303eee	WIREBOND_PULL_TEST	Pass	RagnhildHallaraker	N/A	6 months ago	1	No tags	Selected
694575…dc8547	WIREBONDING	Pass	RagnhildHallaraker	N/A	6 months ago		No tags	Selected

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Module Metrology (QUAD_MODULE_METROLOGY)	No result	N/A
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6932d3…45d42b	MODULE/INITIAL_WARM	IV_MEASURE	OleRohne	6 months ago	4 months ago	No tags	Selected
6992e4…da7e84	MODULE/INITIAL_WARM	E_SUMMARY	OleRohne	N/A	4 months ago	No tags	Selected
698c8f…d0a422	MODULE/FINAL_COLD	IV_MEASURE	SimenHellesund	4 months ago	4 months ago	No tags	Selected
698ca4…d0a798	MODULE/FINAL_COLD	E_SUMMARY	SimenHellesund	N/A	4 months ago	No tags	Selected
698c8d…760b6d	MODULE/THERMAL_CYCLES	THERMAL_CYCLING	SimenHellesund	N/A	4 months ago	No tags	Selected
698c84…d0a330	MODULE/FINAL_WARM	IV_MEASURE	SimenHellesund	4 months ago	4 months ago	No tags	Selected
698c8c…d0a3e8	MODULE/FINAL_WARM	E_SUMMARY	SimenHellesund	N/A	4 months ago	No tags	Selected
698b05…d09e89	MODULE/POST_PARYLENE_WARM	E_SUMMARY	SimenHellesund	N/A	4 months ago	No tags	Selected
694575…303eee	MODULE/WIREBONDING	WIREBOND_PULL_TEST	RagnhildHallaraker	N/A	6 months ago	No tags	Selected
694575…dc8547	MODULE/WIREBONDING	WIREBONDING	RagnhildHallaraker	N/A	6 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIM04202229

MODULE/INITIAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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