Database for ITk Pixel Module

Serial Number	20UPGM24221188
ProdDB ID	d2dbe3…76794e
LocalDB ID	69021b7bb5f1d1f55a3fd8ec
Component Type	MODULE
Parents	No match.
Children	20UPGB43000308 Bare Module 20UPGFC0223078 FE Chip 20UPGFC0223079 FE Chip 20UPGFC0223081 FE Chip 20UPGFC0223080 FE Chip 20UPGPQ4221188 PCB
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
component id	69021b7bb5f1d1f55a3fd8ec
Stage	MODULE/WIREBONDING
test Type	WIREBONDING
institute	64657cef8d79bac1f3f00581
user	AnnaRaquel Petri

Key	Data
properties	{'BOND_PROGRAM': 'QuadL2', 'BOND_WIRE_BATCH': '0', 'MACHINE': 'Delvotec', 'MEASUREMENT_DATE': '2025-11-12T15:44:00.000Z', 'OPERATOR_IDENTITY': 'F Sabatini'}
HUMIDITY	40
IREF_TRIM_BIT_1	8
IREF_TRIM_BIT_2	14
IREF_TRIM_BIT_3	11
IREF_TRIM_BIT_4	10
REWORKED_WIRE_BONDS	3
TEMPERATURE	20

Expand ProductionDB Record

6914af2107e8852b92d43c7f

state

ready

stateTs

2025-11-12T16:00:33.422Z

stateUserIdentity

3182-7646-1

date

2025-11-12T15:44:00.000Z

testType

id	5d13255102c38f00090aab47
code	WIREBONDING
name	Wirebonding Information
state	active

institution

id	5d41d8ddf6e07b000a559aee
code	INFN_MILANO
name	INFN Milano

user

id	60e59f40049e18000a3aec94
userIdentity	3182-7646-1
firstName	Anna
middleName	Raquel
lastName	Petri

runNumber

passed

True

problems

False

properties

code BOND_PROGRAM
name Bond Program
dataType string
valueType single
required False
value QuadL2
code BOND_WIRE_BATCH
name Bond wire batch
dataType string
valueType single
required False
value 0
code MACHINE
name Machine Used
dataType string
valueType single
required False
value Delvotec
rangeMin None
rangeMax None
code MEASUREMENT_DATE
name Date wirebonding performed
dataType datetime
valueType None
required False
value 2025-11-12T15:44:00.000Z
rangeMin None
rangeMax None
code OPERATOR_IDENTITY
name Operator Name
dataType string
valueType single
required False
value F Sabatini
rangeMin None
rangeMax None

results

code HUMIDITY
name Humidity (%)
dataType float
valueType single
arrayDimensions None
additional False
value 40
associateChild None
code IREF_TRIM_BIT_1
name IREF Trim Bit FE1 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 8
associateChild None
code IREF_TRIM_BIT_2
name IREF Trim Bit FE2 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 14
associateChild None
code IREF_TRIM_BIT_3
name IREF Trim Bit FE3 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 11
associateChild None
code IREF_TRIM_BIT_4
name IREF Trim Bit FE4 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 10
associateChild None
code REWORKED_WIRE_BONDS
name Number of reworked wirebonds
dataType codeTable
valueType single
arrayDimensions None
additional False
value 3
associateChild None
codeTable
code value
1 none
2 few (1-5)
3 many (>5)
code TEMPERATURE
name Temperature (degC)
dataType float
valueType single
arrayDimensions None
additional False
value 20
associateChild None

cts

2025-11-12T16:00:33.422Z

sys

cts	2025-11-12T16:00:33.422Z
mts	2025-11-12T16:00:33.422Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

69021b7bb5f1d1f55a3fd8ec

d2dbe3eff1425a018b3518c50376794e

ready

2025-10-29T13:49:47.794Z

3182-7646-1

False

None

False

None

20UPGM24221188

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	INFN_MILANO
name	INFN Milano

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
692f02…95e00b	WIREBOND_PULL_TEST	Pass	AnnaRaquel Petri	N/A	4 months ago	in webApp	No tags	Selected
6914af…d43c7f	WIREBONDING	Pass	AnnaRaquel Petri	N/A	5 months ago		No tags	Selected

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
692f02…95e00b	MODULE/WIREBONDING	WIREBOND_PULL_TEST	AnnaRaquel Petri	N/A	4 months ago	No tags	Selected
69144d…86b95b	MODULE/INITIAL_WARM	IV_MEASURE	AnnaRaquel Petri	5 months ago	5 months ago	No tags	Selected
69271b…e48e27	MODULE/INITIAL_WARM	E_SUMMARY	AnnaRaquel Petri	N/A	5 months ago	No tags	Selected
6914af…d43c7f	MODULE/WIREBONDING	WIREBONDING	AnnaRaquel Petri	N/A	5 months ago	No tags	Selected
690b30…757735	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	BeatriceCervato	N/A	5 months ago	No tags	Selected
690b23…74aed9	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	BeatriceCervato	N/A	5 months ago	No tags	Selected
690b23…22eb69	MODULE/ASSEMBLY	MASS_MEASUREMENT	BeatriceCervato	N/A	5 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24221188

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBONDING QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebonding Information

Scan

Result

Property

ProductionDB Record

Current Stage: Post-Parylene Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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