20UPGB43000391

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number 20UPGB43000391
ProdDB ID  d2c0a8…346541
LocalDB ID 68f231dfecbbcc3f84727eb7
Component Type BARE_MODULE
Parents 20UPGM24220429
Children 20UPGFC0223325 FE Chip 20UPGFC0223298 FE Chip 20UPGFC0223300 FE Chip 20UPGFC0223283 FE Chip 20UPGS33304251 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 0
Thickness of FE chips (RD53A) None

 Comments


Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 3 months ago
component ObjectId 68f231dfecbbcc3f84727eb7
Stage BAREMODULERECEPTION
Test Type QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name ElizaHoward
ObjectId of this record 69c2e1a00b737d5b198bb5cd
ObjectId of RAW record None
Tags No tags

Results

Key Data
SENSOR_X 39.53237
SENSOR_Y 41.12364
FECHIPS_X 42.22554
FECHIPS_Y 40.2887
FECHIP_THICKNESS 163
FECHIP_THICKNESS_STD_DEVIATION 4
BARE_MODULE_THICKNESS 335.7
BARE_MODULE_THICKNESS_STD_DEVIATION 3.9

ProductionDB Record

id69c2e1a00b737d5b198bb5cd
stateready
stateTs2026-03-24T19:10:24.111Z
stateUserIdentity4561-2270-1
date2026-03-23T15:37:33.000Z
testType
id5f87e63950d75e000a335aac
codeQUAD_BARE_MODULE_METROLOGY
name Quad Bare Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id68755ce03942dab85ad88269
userIdentity4561-2270-1
firstNameEliza
middleName
lastNameHoward
runNumber1
passedTrue
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
SENSOR_XSensor dimension in x [mm]floatsingleNoneFalse39.53237None
SENSOR_YSensor dimension in y [mm]floatsingleNoneFalse41.12364None
FECHIPS_XFE chips x dimension [mm]floatsingle1False42.22554None
FECHIPS_YFE chips y dimension [mm]floatsingle1False40.2887None
FECHIP_THICKNESSAverage FE chip thickness [µm]floatsingleNoneFalse163None
FECHIP_THICKNESS_STD_DEVIATIONStd deviation of FE chip thickness [µm]floatsingleNoneFalse4None
BARE_MODULE_THICKNESSAverage bare module thickness [µm]floatsingleNoneFalse335.7None
BARE_MODULE_THICKNESS_STD_DEVIATIONStd deviation of bare module thickness [µm]floatsingleNoneFalse3.9None
cts2026-03-24T19:10:24.111Z
sys
cts2026-03-24T19:10:24.111Z
mts2026-03-24T19:10:24.111Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
68f231dfecbbcc3f84727eb7d2c0a80c4c7e2dcc5dc6d62902346541ready2025-10-17T12:09:03.026Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB43000391None
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v2
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseAdvacam
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order4
initialFalse
finalFalse
codeADVACAM
nameAdvacam Oy

 Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Registered
Flatness
(FLATNESS)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
69dfc2…c64ebf BAREMODULERECEPTION BARE_MODULE_SENSOR_IV Simpson,Liana Rae N/A a month ago No tags Selected
69c2e3…8bbce1 BAREMODULERECEPTION MASS_MEASUREMENT ElizaHoward N/A 3 months ago No tags Selected
69c2e1…8bb5cd BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY ElizaHoward N/A 3 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULE/GRAVEYARD
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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