20UPGB43000292

MODULE/POST_PARYLENE_COLD

Component Information

Serial Number	20UPGB43000292
ProdDB ID	d6d322…b44fb9
LocalDB ID	68d2c40aecbbcc3f84460799
Component Type	BARE_MODULE
Parents	20UPGM24830013
Children	20UPGFC0222756 FE Chip 20UPGFC0222757 FE Chip 20UPGFC0222744 FE Chip 20UPGFC0222763 FE Chip 20UPGS33304327 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	0
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	7 months ago
component ObjectId	68d2c40aecbbcc3f84460799
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ElizaHoward
ObjectId of this record	6909224f963d030a15da24da
ObjectId of RAW record	6909224e963d030a15da24d9
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.6.4
MEASUREMENT_DATE	2025-11-03T21:31:55.000+00:00
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
back_tile2 Download back_tile2		Scratches_Sensor
back_tile5 Download back_tile5		Bond_pad_contamination_FE	piece of debris on the electrical pad area

RAW Results Record

Download RAW

serialNumber

20UPGB43000292

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGB43000292

TimeStart

1762205515

front_defects

front_comments

0
1
2
3
4
5
6
7
8

front_image

690920fbd13d01d9d78791b5

front_defect_images

back_defects

2	Yellow.Scratches_Sensor
5	Yellow.Bond_pad_contamination_FE

back_comments

0
1
2
3
4
5	piece of debris on the electrical pad area
6
7
8

back_image

69092228d13d01d9d7879570

back_defect_images

2	6a15dac708544d4de2d8c494
5	6a15db1e08544d4de2d8c921

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

OBWBP_ASSEMBLY_PASSED_QC

None

STRAIN_RELIEF_PASSED_QC

None

stage

BAREMODULERECEPTION

component

68d2c40aecbbcc3f84460799

dbVersion

1.01

address

64657cef8d79bac1f3f00578

sys

mts	2025-11-03 21:44:46.339000
cts	2025-11-03 21:44:46.339000
rev	0

ProductionDB Record

Expand ProductionDB Record

690e454844c06a976341e0c9

state

ready

stateTs

2025-11-07T19:15:20.487Z

stateUserIdentity

4561-2270-1

date

2025-11-03T21:44:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

runNumber

6909224f963d030a15da24da

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.6.4	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-11-03T21:31:55.000+00:00	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2025-11-07T19:15:20.487Z

sys

cts	2025-11-07T19:15:20.487Z
mts	2025-11-07T19:21:31.654Z
rev	9

defects

code	name	description	properties
a4bf54146982a404ca2f912e	back_tile2	Yellow.Scratches_Sensor
1cf7fe633b329ba7dac29016	back_tile5	Yellow.Bond_pad_contamination_FE

comments

code

dateTime

comment

user

5fc34a5e17c212380489d1c8

2025-11-07T19:21:31.653Z

tile_comment::back_tile5 : piece of debris on the electrical pad area

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

attachments

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4369795a8c2a9a1485cec5191b4db048

dateTime

2025-11-07T19:15:20.704Z

title

RAW

description

RAW

contentType

application/json

type

file

binaryStoreg02

True

filename

data

user

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userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

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dateTime

2025-11-07T19:15:21.594Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

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urlCernbox

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4bcccff1e9a3ef57283398751988ddb9

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middleName
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dateTime

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title

back_image

description

Visual Inspection Image

contentType

None

type

eos

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urlCernbox

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a93380fab0c7e6759a3f2dfaf21cb767

user

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

code

18e628dcb2b4e0c136c74f2a61d062e9

dateTime

2025-11-07T19:21:13.721Z

title

back_tile2

description

Visual Inspection Image

contentType

None

type

eos

url

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id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

code

60380fb64a136de7f054c39a296ea98b

dateTime

2025-11-07T19:21:22.949Z

title

back_tile5

description

Visual Inspection Image

contentType

None

type

eos

url

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user

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68d2c40aecbbcc3f84460799

d6d322de7c8dabc1ed8458a204b44fb9

ready

2025-09-23T16:00:10.443Z

23-6780-1

False

None

False

None

20UPGB43000292

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	4
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Post-Parylene Cold

No tests are allocated for this stage.

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	No result	N/A
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	No result	N/A
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags
690e18…411791	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	ElizaHoward	N/A	7 months ago	No tags
69052b…5ffb2a	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	ElizaHoward	N/A	7 months ago	No tags
68fbde…ceda63	BAREMODULERECEPTION	MASS_MEASUREMENT	ElizaHoward	N/A	7 months ago	No tags
690922…da24da	BAREMODULERECEPTION	VISUAL_INSPECTION	ElizaHoward	7 months ago	7 months ago	No tags

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULE/GRAVEYARD
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43000292

MODULE/POST_PARYLENE_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Post-Parylene Cold

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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