20UPGB43000293

MODULE/POST_PARYLENE_COLD

Component Information

Serial Number	20UPGB43000293
ProdDB ID	0ebf71…b25266
LocalDB ID	68d2c40ab5f1d1f55a7bf85c
Component Type	BARE_MODULE
Parents	20UPGM24830014
Children	20UPGFC0223190 FE Chip 20UPGFC0223192 FE Chip 20UPGFC0223172 FE Chip 20UPGFC0223193 FE Chip 20UPGS33304328 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	0
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	7 months ago
component ObjectId	68d2c40ab5f1d1f55a7bf85c
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ElizaHoward
ObjectId of this record	690923e5963d030a15da24dc
ObjectId of RAW record	690923e4963d030a15da24db
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.6.4
MEASUREMENT_DATE	2025-11-03T21:45:32.000+00:00
FE_CHIP_CONDITION_PASSED_QC	1
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
back_tile1 Download back_tile1		Scratches_Sensor
back_tile3 Download back_tile3		Scratches_Sensor
back_tile4 Download back_tile4		Contamination_Sensor

RAW Results Record

Download RAW

serialNumber

20UPGB43000293

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGB43000293

TimeStart

1762206332

front_defects

front_comments

0
1
2
3
4
5
6
7
8

front_image

69092320d13d01d9d7879bf0

front_defect_images

back_defects

1	Yellow.Scratches_Sensor
3	Yellow.Scratches_Sensor
4	Yellow.Contamination_Sensor

back_comments

0
1
2
3
4
5
6
7
8

back_image

690923bad13d01d9d7879fa6

back_defect_images

1	6a15daf308544d4de2d8c5cc
3	6a15dad108544d4de2d8c52d
4	6a15db5f08544d4de2d8ca5b

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

OBWBP_ASSEMBLY_PASSED_QC

None

STRAIN_RELIEF_PASSED_QC

None

stage

BAREMODULERECEPTION

component

68d2c40ab5f1d1f55a7bf85c

dbVersion

1.01

address

64657cef8d79bac1f3f00578

sys

mts	2025-11-03 21:51:32.178000
cts	2025-11-03 21:51:32.178000
rev	0

ProductionDB Record

Expand ProductionDB Record

690e475107e8852b9293b8ff

state

ready

stateTs

2025-11-07T19:24:01.179Z

stateUserIdentity

4561-2270-1

date

2025-11-03T21:51:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

runNumber

690923e5963d030a15da24dc

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.6.4	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-11-03T21:45:32.000+00:00	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2025-11-07T19:24:01.179Z

sys

cts	2025-11-07T19:24:01.179Z
mts	2025-11-07T19:29:43.338Z
rev	11

defects

code	name	description
3786280e1daea46036235da8	back_tile1	Yellow.Scratches_Sensor
6abe17e254e5b3191e502a9e	back_tile3	Yellow.Scratches_Sensor
bd0599e39d18b194859019b2	back_tile4	Yellow.Contamination_Sensor

comments

None

attachments

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26d4101953609d2322b2fee965b797e5

dateTime

2025-11-07T19:24:01.423Z

title

RAW

description

RAW

contentType

application/json

type

file

binaryStoreg02

True

filename

data

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userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

code

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dateTime

2025-11-07T19:24:02.460Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

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dateTime

2025-11-07T19:28:06.233Z

title

back_image

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Visual Inspection Image

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dateTime

2025-11-07T19:29:02.336Z

title

back_tile1

description

Visual Inspection Image

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None

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eos

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middleName
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c1952865f726f06326d14b591233d04b

dateTime

2025-11-07T19:29:16.521Z

title

back_tile3

description

Visual Inspection Image

contentType

None

type

eos

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id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

code

14d11c9962ecf3daa9135c03dc3c218d

dateTime

2025-11-07T19:29:31.999Z

title

back_tile4

description

Visual Inspection Image

contentType

None

type

eos

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user

id	68755ce03942dab85ad88269
userIdentity	4561-2270-1
firstName	Eliza
middleName
lastName	Howard

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68d2c40ab5f1d1f55a7bf85c

0ebf71bfccac6a44d90d68c0edb25266

ready

2025-09-23T16:00:10.562Z

23-6780-1

False

None

False

None

20UPGB43000293

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	4
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Post-Parylene Cold

No tests are allocated for this stage.

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	No result	N/A
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	No result	N/A
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags
690e18…92f249	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	ElizaHoward	N/A	7 months ago	No tags
69092a…8594bc	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	ElizaHoward	N/A	7 months ago	No tags
68fbde…04be54	BAREMODULERECEPTION	MASS_MEASUREMENT	ElizaHoward	N/A	7 months ago	No tags
690923…da24dc	BAREMODULERECEPTION	VISUAL_INSPECTION	ElizaHoward	7 months ago	7 months ago	No tags

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULE/GRAVEYARD
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43000293

MODULE/POST_PARYLENE_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Post-Parylene Cold

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

GRAVEYARD - (unassembled) Bare Module impossible to recover (BAREMODULE/GRAVEYARD)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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