Database for ITk Pixel Module

Serial Number	20UPIM54304211
ProdDB ID	c503b2…d98824
LocalDB ID	68c93702e4b1b16d3fee07c5
Component Type	MODULE
Parents	No match.
Children	20UPGB13200048 Bare Module 20UPGFC0145302 FE Chip 20UPGB13200055 Bare Module 20UPGFC0145236 FE Chip 20UPGB13200054 Bare Module 20UPGFC0145251 FE Chip 20UPIP55264211 PCB
Flags	• Problematic core column (can't be masked with current tool)

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
component id	68c93702e4b1b16d3fee07c5
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f00581
user	RiccardoZanzottera

Key	Data
properties	{'ANALYSIS_VERSION': None, 'INSTRUMENT': None, 'MEASUREMENT_DATE': None, 'MEASUREMENT_DURATION': None, 'OPERATOR_IDENTITY': None} g
BOND_PEEL	0 g
DATA_UNAVAILABLE	False g
HEEL_BREAKS_ON_FE_CHIP	12 g
HEEL_BREAKS_ON_PCB	6 g
LIFT_OFFS_LESS_THAN_7G	0 g
PULL_STRENGTH	8.5 g
PULL_STRENGTH_DATA	[] g
PULL_STRENGTH_ERROR	0.6 g
PULL_STRENGTH_MAX	9.9 g
PULL_STRENGTH_MIN	7.3 g
WIRE_BREAKS_5G	0 g
WIRE_PULLS	18 g

Expand ProductionDB Record

68c99a00e4b1b16d3ff0704a

state

ready

stateTs

2025-09-16T17:10:24.136Z

stateUserIdentity

1237-9341-1

date

2025-09-16T12:55:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5d41d8ddf6e07b000a559aee
code	INFN_MILANO
name	INFN Milano

user

id	64b11615df91d20042b5df92
userIdentity	1237-9341-1
firstName	Riccardo
middleName
lastName	Zanzottera

runNumber

68c95e58e4b1b16d3feea9f4

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	None	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	None	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 12
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 6
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.5
associateChild None
code PULL_STRENGTH_DATA
name Pull strength data
order 1
dataType float
valueType array
arrayDimensions 3
additional False
rangeMin None
rangeMax None
value
associateChild None
code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.6
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.9
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.3
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 18
associateChild None

cts

2025-09-16T17:10:24.136Z

sys

cts	2025-09-16T17:10:24.136Z
mts	2025-09-16T17:10:24.136Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68c93702e4b1b16d3fee07c5

c503b24295143be20304e4f524d98824

ready

2025-09-16T10:08:02.519Z

4348-9718-1

False

None

False

None

20UPIM54304211

None

code	P
name	Pixels

code	PI
name	Inner pixels

code	MODULE
name	Module

code	TRIPLET_L0_RING0.5_MODULE
name	Triplet L0 Ring0.5 module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	INFN_MILANO
name	INFN Milano

Test Type	Local Result
IV measurement (IV_MEASURE)	No TestRun!
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
68c95e…eea9f4	WIREBOND_PULL_TEST	Pass	RiccardoZanzottera	N/A	3 months ago	None	No tags	Selected

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	No result	N/A

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	No result	N/A
Triplet Module Metrology (TRIPLET_METROLOGY)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68ff46…7bdbcf	MODULE/THERMAL_CYCLES	IV_MEASURE	CarlaSbarra	a month ago	a month ago	No tags	Selected
68ff3c…7bdbc2	MODULE/THERMAL_CYCLES	THERMAL_CYCLING	CarlaSbarra	a month ago	a month ago	No tags	Selected
68ff8b…7bdd3b	MODULE/THERMAL_CYCLES	E_SUMMARY	CarlaSbarra	N/A	a month ago	No tags	Selected
68ca83…85bae9	MODULE/INITIAL_WARM	IV_MEASURE	AnnaRaquel Petri	3 months ago	2 months ago	No tags	Selected
68d51e…85cfb8	MODULE/INITIAL_WARM	E_SUMMARY	AnnaRaquel Petri	N/A	2 months ago	No tags	Selected
68c95e…eea9f4	MODULE/WIREBONDING	WIREBOND_PULL_TEST	RiccardoZanzottera	N/A	3 months ago	No tags	Selected
68c95d…30e5c2	MODULE/ASSEMBLY	MASS_MEASUREMENT	RiccardoZanzottera	N/A	3 months ago	No tags	Selected
68c95c…30e1f7	MODULE/ASSEMBLY	TRIPLET_METROLOGY	RiccardoZanzottera	N/A	3 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIM54304211

MODULE/QC_CROSSCHECK

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

ProductionDB Record

Current Stage: QC cross-check (module swapping)

Candidate TestRuns of this Stage

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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