20UPGM24210577 (ANL_ITkPix_126)

MODULE/QC_CROSSCHECK

Component Information

Serial Number 20UPGM24210577
ProdDB ID  e7fc97…86c796
LocalDB ID 689ce4f6e945399df1ed713b
Component Type MODULE
Parents No match.
Children 20UPGB43200364 Bare Module 20UPGFC0146775 FE Chip 20UPGFC0146872 FE Chip 20UPGFC0146891 FE Chip 20UPGFC0146778 FE Chip 20UPGPQ4210577 PCB
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal False
Alternative ID ANL_ITkPix_126
Wirebond protection roof presence None
Rank None
Is preproduction module None

 Comments


Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 3 months ago
component ObjectId 689ce4f6e945399df1ed713b
Stage MODULE/ASSEMBLY
Test Type QUAD_MODULE_METROLOGY
Institute ObjectId
User Name Simpson,Liana Rae
ObjectId of this record 68b71a34aade37d6b78b427a
ObjectId of RAW record None
Tags No tags

Results

Key Data
AVERAGE_THICKNESS [644, 645, 650, 646]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT [2236.34, 769.03]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT [2140.46, 750.63]
HV_CAPACITOR_THICKNESS 2380
STD_DEVIATION_THICKNESS [1, 7, 7, 1]
THICKNESS_INCLUDING_POWER_CONNECTOR 1960
THICKNESS_VARIATION_PICKUP_AREA 2

ProductionDB Record

id68b71a34aade37d6b78b427a
stateready
stateTs2025-09-02T16:24:20.961Z
stateUserIdentity1294-8027-1
date2025-08-15T10:49:24.000Z
testType
id627a356dba163f000ab63233
codeQUAD_MODULE_METROLOGY
nameQuad Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id6797ca0f2ffbf908f24868f9
userIdentity1294-8027-1
firstNameSimpson,
middleName
lastNameLiana Rae
runNumber1
passedTrue
problemsFalse
properties
results
  • codeAVERAGE_THICKNESS
    nameAverage module thickness at FE chip pick-up areas, 1 per FE [μm]
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 644
    • 645
    • 650
    • 646
    associateChildNone
  • codeDISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
    nameDistance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
    • 2236.34
    • 769.03
    associateChildNone
  • codeDISTANCE_PCB_BARE_MODULE_TOP_LEFT
    nameDistance of PCB fiducial to bare module fiducial top left (x and y) [µm]
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
    • 2140.46
    • 750.63
    associateChildNone
  • codeHV_CAPACITOR_THICKNESS
    nameHV capacitor thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2380
    associateChildNone
  • codeSTD_DEVIATION_THICKNESS
    nameStd deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 1
    • 7
    • 7
    • 1
    associateChildNone
  • codeTHICKNESS_INCLUDING_POWER_CONNECTOR
    nameThickness including the black body of power connector (excluding pins) [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1960
    associateChildNone
  • codeTHICKNESS_VARIATION_PICKUP_AREA
    nameThickness variation of the 4 pick-up areas [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2
    associateChildNone
cts2025-09-02T16:24:20.961Z
sys
cts2025-09-02T16:24:20.961Z
mts2025-09-02T16:24:20.961Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
689ce4f6e945399df1ed713be7fc973881c738c84c94246a4286c796ready2025-08-13T19:18:14.270Z1294-8027-1FalseFalseNoneNoneFalseNoneNone20UPGM24210577ANL_ITkPix_126
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueFalse
  • codeALTERNATIVE_IDENTIFIER
    nameAlternative ID
    dataTypestring
    requiredFalse
    defaultTrue
    valueANL_ITkPix_126
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
order1
initialFalse
finalFalse
codeANL
nameArgonne National Laboratory

 Current Stage: QC cross-check (module swapping)

Test Type Local Result
IV measurement
(IV_MEASURE)
No TestRun!
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun!
Visual Inspection
(VISUAL_INSPECTION)
TestRun Present

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
68b71a…8b427a QUAD_MODULE_METROLOGY Pass Simpson,Liana Rae N/A 3 months ago No tags Selected
68b718…dfd9d0 GLUE_MODULE_FLEX_ATTACH Pass Simpson,Liana Rae N/A 3 months ago No tags Selected
68b717…8b36d6 MASS_MEASUREMENT Pass Simpson,Liana Rae N/A 3 months ago in webApp No tags Selected
68b0b0…3356a5 VISUAL_INSPECTION Pass Simpson,Liana Rae 4 months ago 4 months ago 2.6.4 No tags Selected

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Registered
Wirebonding Information
(WIREBONDING)
Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Registered
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
692e2f…6b1f26 MODULE/QC_CROSSCHECK VISUAL_INSPECTION None 2 weeks ago 2 weeks ago No tags Selected
690509…bada01 MODULE/POST_PARYLENE_WARM IV_MEASURE ElizaHoward a month ago a month ago No tags Selected
690525…bae1da MODULE/POST_PARYLENE_WARM E_SUMMARY ElizaHoward N/A a month ago No tags Selected
68fa65…ba94ad MODULE/PARYLENE_UNMASKING DE_MASKING DanielAceves a month ago a month ago No tags Selected
68fa65…ba94ca MODULE/PARYLENE_UNMASKING VISUAL_INSPECTION DanielAceves a month ago a month ago No tags Selected
68fa62…ba948b MODULE/PARYLENE_COATING PARYLENE DanielAceves a month ago a month ago No tags Selected
68fa61…ba944c MODULE/PARYLENE_MASKING DE_MASKING DanielAceves a month ago a month ago No tags Selected
68fa62…ba944f MODULE/PARYLENE_MASKING VISUAL_INSPECTION DanielAceves a month ago a month ago No tags Selected
68debc…90fbe1 MODULE/INITIAL_WARM IV_MEASURE DanielAceves 2 months ago 2 months ago No tags Selected
68ded6…910827 MODULE/INITIAL_WARM E_SUMMARY DanielAceves N/A 2 months ago No tags Selected
68b71d…791991 MODULE/WIREBONDING WIREBOND_PULL_TEST Simpson,Liana Rae N/A 3 months ago No tags Selected
68b71b…8b490d MODULE/WIREBONDING WIREBONDING Simpson,Liana Rae N/A 3 months ago No tags Selected
68b71a…8b427a MODULE/ASSEMBLY QUAD_MODULE_METROLOGY Simpson,Liana Rae N/A 3 months ago No tags Selected
68b718…dfd9d0 MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH Simpson,Liana Rae N/A 3 months ago No tags Selected
68b717…8b36d6 MODULE/ASSEMBLY MASS_MEASUREMENT Simpson,Liana Rae N/A 3 months ago No tags Selected
68b20a…335778 MODULE/WIREBONDING VISUAL_INSPECTION Simpson,Liana Rae 4 months ago 4 months ago No tags Selected
68b0b0…3356a5 MODULE/ASSEMBLY VISUAL_INSPECTION Simpson,Liana Rae 4 months ago 4 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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