Database for ITk Pixel Module

Serial Number	20UPGM24210397
ProdDB ID	9ddb33…98b09b
LocalDB ID	689ce4b9328b0ce1c7159578
Component Type	MODULE
Parents	No match.
Children	20UPGB43200228 Bare Module 20UPGFC0141607 FE Chip 20UPGFC0141593 FE Chip 20UPGFC0141676 FE Chip 20UPGFC0141722 FE Chip 20UPGPQ4210397 PCB
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	False
Alternative ID	ANL_ITkPix_124
Wirebond protection roof presence	None
Rank	None
Is preproduction module	None

Key	Data
component id	689ce4b9328b0ce1c7159578
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f00578
user	Simpson,Liana Rae

Key	Data
properties	{'ANALYSIS_VERSION': 'in webApp', 'INSTRUMENT': 'Dage', 'MEASUREMENT_DATE': '2025-08-25T09:16Z', 'OPERATOR_IDENTITY': 'Tim Cundiff'} g
BOND_PEEL	0 g
DATA_UNAVAILABLE	False g
HEEL_BREAKS_ON_FE_CHIP	100 g
HEEL_BREAKS_ON_PCB	0 g
LIFT_OFFS_LESS_THAN_7G	0 g
PULL_STRENGTH	9.498283999999998 g
PULL_STRENGTH_DATA	[[[10.176, 2, 1], [9.5618, 2, 1], [10.935, 2, 1], [9.5906, 2, 1], [8.8524, 2, 1], [9.6009, 2, 1], [9.0765, 2, 1], [8.7153, 2, 1], [8.9825, 2, 1], [10.091, 2, 1], [9.079, 2, 2], [9.5186, 2, 2], [10.649, 2, 2], [10.397, 2, 2], [11.387, 2, 2], [9.6361, 2, 3], [9.469, 2, 3], [9.1986, 2, 3], [9.0977, 2, 3], [8.6602, 2, 3], [8.8948, 2, 3], [9.2145, 2, 3], [9.3826, 2, 3], [8.6952, 2, 3], [8.5958, 2, 3]]] g
PULL_STRENGTH_ERROR	0.7398580194199426 g
PULL_STRENGTH_MAX	11.387 g
PULL_STRENGTH_MIN	8.5958 g
WIRE_BREAKS_5G	0 g
WIRE_PULLS	25 g

Expand ProductionDB Record

68b71e6faade37d6b78b4c42

state

ready

stateTs

2025-09-02T16:42:23.956Z

stateUserIdentity

1294-8027-1

date

2025-08-25T09:16:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

...

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	in webApp	None	None
INSTRUMENT	Instrument	string	single	False	Dage	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-08-25T09:16Z	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	Tim Cundiff	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 100
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.498283999999998
associateChild None

code	PULL_STRENGTH_DATA
name	Pull strength data
order	1
dataType	float
valueType	array
arrayDimensions	3
additional	False
rangeMin	None
rangeMax	None
value	10.176 2 1 9.5618 2 1 10.935 2 1 9.5906 2 1 8.8524 2 1 9.6009 2 1 9.0765 2 1 8.7153 2 1 8.9825 2 1 10.091 2 1 9.079 2 2 9.5186 2 2 10.649 2 2 10.397 2 2 11.387 2 2 9.6361 2 3 9.469 2 3 9.1986 2 3 9.0977 2 3 8.6602 2 3 8.8948 2 3 9.2145 2 3 9.3826 2 3 8.6952 2 3 8.5958 2 3
associateChild	None

code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.7398580194199426
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 11.387
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.5958
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 25
associateChild None

cts

2025-09-02T16:42:23.956Z

sys

cts	2025-09-02T16:42:23.956Z
mts	2025-09-02T16:42:23.956Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

689ce4b9328b0ce1c7159578

9ddb338f32be061086c9ab473698b09b

ready

2025-08-13T19:17:13.185Z

1294-8027-1

False

None

False

None

20UPGM24210397

ANL_ITkPix_124

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value ANL_ITkPix_124

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	ANL
name	Argonne National Laboratory

Test Type	Local Result
IV measurement (IV_MEASURE)	No TestRun!
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	TestRun Present

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
68b71e…8b4c42	WIREBOND_PULL_TEST	Pass	Simpson,Liana Rae	N/A	3 months ago	in webApp	No tags	Selected
68b71b…79175b	WIREBONDING	Pass	Simpson,Liana Rae	N/A	3 months ago		No tags	Selected
68b209…335772	VISUAL_INSPECTION	Pass	Simpson,Liana Rae	4 months ago	4 months ago	2.6.4	No tags	Selected

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
692e2f…971c51	MODULE/QC_CROSSCHECK	VISUAL_INSPECTION	None	2 weeks ago	2 weeks ago	No tags	Selected
6904e7…bad5a3	MODULE/POST_PARYLENE_WARM	IV_MEASURE	Simpson,Liana Rae	a month ago	a month ago	No tags	Selected
691b9a…aeff74	MODULE/POST_PARYLENE_WARM	E_SUMMARY	Simpson,Liana Rae	N/A	a month ago	No tags	Selected
68fa60…ba940c	MODULE/PARYLENE_UNMASKING	DE_MASKING	DanielAceves	2 months ago	a month ago	No tags	Selected
68fa61…ba940f	MODULE/PARYLENE_UNMASKING	VISUAL_INSPECTION	DanielAceves	a month ago	a month ago	No tags	Selected
68fa60…ba93d0	MODULE/PARYLENE_COATING	VISUAL_INSPECTION	DanielAceves	a month ago	a month ago	No tags	Selected
68fa5f…ba93cd	MODULE/PARYLENE_COATING	PARYLENE	DanielAceves	2 months ago	a month ago	No tags	Selected
68fa5e…ba938d	MODULE/PARYLENE_MASKING	DE_MASKING	DanielAceves	2 months ago	a month ago	No tags	Selected
68fa5f…ba9390	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	DanielAceves	a month ago	a month ago	No tags	Selected
68ded0…9100c8	MODULE/INITIAL_WARM	IV_MEASURE	DanielAceves	2 months ago	2 months ago	No tags	Selected
68ded2…910529	MODULE/INITIAL_WARM	E_SUMMARY	DanielAceves	N/A	2 months ago	No tags	Selected
68b71e…8b4c42	MODULE/WIREBONDING	WIREBOND_PULL_TEST	Simpson,Liana Rae	N/A	3 months ago	No tags	Selected
68b71b…79175b	MODULE/WIREBONDING	WIREBONDING	Simpson,Liana Rae	N/A	3 months ago	No tags	Selected
68b71a…dfe0d5	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	Simpson,Liana Rae	N/A	3 months ago	No tags	Selected
68b718…7908a6	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	Simpson,Liana Rae	N/A	3 months ago	No tags	Selected
68b717…7903f0	MODULE/ASSEMBLY	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	3 months ago	No tags	Selected
68b209…335772	MODULE/WIREBONDING	VISUAL_INSPECTION	Simpson,Liana Rae	4 months ago	4 months ago	No tags	Selected
68b0b0…3356a2	MODULE/ASSEMBLY	VISUAL_INSPECTION	Simpson,Liana Rae	4 months ago	4 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24210397 (ANL_ITkPix_124)

MODULE/QC_CROSSCHECK

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

ProductionDB Record

Current Stage: QC cross-check (module swapping)

Candidate TestRuns of this Stage

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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