20UPGM24210028 (ANL_ITkPix_123)

MODULE/QC_CROSSCHECK

Component Information

Serial Number 20UPGM24210028
ProdDB ID  a776e4…7598fb
LocalDB ID 689ce47b4352ea8e9ff63ef3
Component Type MODULE
Parents No match.
Children 20UPGB43200226 Bare Module 20UPGFC0141766 FE Chip 20UPGFC0141752 FE Chip 20UPGFC0141644 FE Chip 20UPGFC0141658 FE Chip 20UPGPQ4210028 PCB
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal False
Alternative ID ANL_ITkPix_123
Wirebond protection roof presence None
Rank None
Is preproduction module None

 Comments


Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 3 months ago
component ObjectId 689ce47b4352ea8e9ff63ef3
Stage MODULE/ASSEMBLY
Test Type QUAD_MODULE_METROLOGY
Institute ObjectId
User Name Simpson,Liana Rae
ObjectId of this record 68b719c3aade37d6b78b403a
ObjectId of RAW record None
Tags No tags

Results

Key Data
AVERAGE_THICKNESS [647, 648, 651, 648]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT [2246.03, 746.33]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT [2155.31, 736.21]
HV_CAPACITOR_THICKNESS 2384
STD_DEVIATION_THICKNESS [1, 5, 5, 1]
THICKNESS_INCLUDING_POWER_CONNECTOR 1969
THICKNESS_VARIATION_PICKUP_AREA 1

ProductionDB Record

id68b719c3aade37d6b78b403a
stateready
stateTs2025-09-02T16:22:27.622Z
stateUserIdentity1294-8027-1
date2025-08-15T10:29:42.000Z
testType
id627a356dba163f000ab63233
codeQUAD_MODULE_METROLOGY
nameQuad Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id6797ca0f2ffbf908f24868f9
userIdentity1294-8027-1
firstNameSimpson,
middleName
lastNameLiana Rae
runNumber1
passedTrue
problemsFalse
properties
results
  • codeAVERAGE_THICKNESS
    nameAverage module thickness at FE chip pick-up areas, 1 per FE [μm]
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 647
    • 648
    • 651
    • 648
    associateChildNone
  • codeDISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
    nameDistance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
    • 2246.03
    • 746.33
    associateChildNone
  • codeDISTANCE_PCB_BARE_MODULE_TOP_LEFT
    nameDistance of PCB fiducial to bare module fiducial top left (x and y) [µm]
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
    • 2155.31
    • 736.21
    associateChildNone
  • codeHV_CAPACITOR_THICKNESS
    nameHV capacitor thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2384
    associateChildNone
  • codeSTD_DEVIATION_THICKNESS
    nameStd deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 1
    • 5
    • 5
    • 1
    associateChildNone
  • codeTHICKNESS_INCLUDING_POWER_CONNECTOR
    nameThickness including the black body of power connector (excluding pins) [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1969
    associateChildNone
  • codeTHICKNESS_VARIATION_PICKUP_AREA
    nameThickness variation of the 4 pick-up areas [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
cts2025-09-02T16:22:27.622Z
sys
cts2025-09-02T16:22:27.622Z
mts2025-09-02T16:22:27.622Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
689ce47b4352ea8e9ff63ef3a776e459c05ca8d554c3f592f47598fbready2025-08-13T19:16:11.195Z1294-8027-1FalseFalseNoneNoneFalseNoneNone20UPGM24210028ANL_ITkPix_123
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueFalse
  • codeALTERNATIVE_IDENTIFIER
    nameAlternative ID
    dataTypestring
    requiredFalse
    defaultTrue
    valueANL_ITkPix_123
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
order1
initialFalse
finalFalse
codeANL
nameArgonne National Laboratory

 Current Stage: QC cross-check (module swapping)

Test Type Local Result
IV measurement
(IV_MEASURE)
No TestRun!
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun!
Visual Inspection
(VISUAL_INSPECTION)
TestRun Present

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
68b719…8b403a QUAD_MODULE_METROLOGY Pass Simpson,Liana Rae N/A 3 months ago No tags Selected
68b718…dfd9ab GLUE_MODULE_FLEX_ATTACH Pass Simpson,Liana Rae N/A 3 months ago No tags Selected
68b717…dfd59a MASS_MEASUREMENT Pass Simpson,Liana Rae N/A 3 months ago in webApp No tags Selected
68b0af…3356a0 VISUAL_INSPECTION Pass Simpson,Liana Rae 4 months ago 4 months ago 2.6.4 No tags Selected

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Registered
Wirebonding Information
(WIREBONDING)
Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Registered
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
692e2f…8ce287 MODULE/QC_CROSSCHECK VISUAL_INSPECTION None 2 weeks ago 2 weeks ago No tags Selected
6904dd…bad49a MODULE/POST_PARYLENE_WARM IV_MEASURE Simpson,Liana Rae a month ago 4 weeks ago No tags Selected
691b81…aefce1 MODULE/POST_PARYLENE_WARM E_SUMMARY Simpson,Liana Rae N/A 4 weeks ago No tags Selected
68fa5d…ba9325 MODULE/PARYLENE_UNMASKING DE_MASKING DanielAceves 2 months ago a month ago No tags Selected
68fa5d…ba9351 MODULE/PARYLENE_UNMASKING VISUAL_INSPECTION DanielAceves a month ago a month ago No tags Selected
68fa5c…ba9310 MODULE/PARYLENE_COATING VISUAL_INSPECTION DanielAceves a month ago a month ago No tags Selected
68fa5c…ba92f0 MODULE/PARYLENE_COATING PARYLENE DanielAceves 2 months ago a month ago No tags Selected
68fa5b…ba92ce MODULE/PARYLENE_MASKING DE_MASKING DanielAceves 2 months ago a month ago No tags Selected
68fa5c…ba92d1 MODULE/PARYLENE_MASKING VISUAL_INSPECTION DanielAceves a month ago a month ago No tags Selected
68dea4…90f8de MODULE/INITIAL_WARM IV_MEASURE DanielAceves 2 months ago 2 months ago No tags Selected
68debe…90fe24 MODULE/INITIAL_WARM E_SUMMARY DanielAceves N/A 2 months ago No tags Selected
68b71d…dfea8c MODULE/WIREBONDING WIREBOND_PULL_TEST Simpson,Liana Rae N/A 3 months ago No tags Selected
68b71b…791746 MODULE/WIREBONDING WIREBONDING Simpson,Liana Rae N/A 3 months ago No tags Selected
68b719…8b403a MODULE/ASSEMBLY QUAD_MODULE_METROLOGY Simpson,Liana Rae N/A 3 months ago No tags Selected
68b718…dfd9ab MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH Simpson,Liana Rae N/A 3 months ago No tags Selected
68b717…dfd59a MODULE/ASSEMBLY MASS_MEASUREMENT Simpson,Liana Rae N/A 3 months ago No tags Selected
68b207…33576a MODULE/WIREBONDING VISUAL_INSPECTION Simpson,Liana Rae 4 months ago 4 months ago No tags Selected
68b0af…3356a0 MODULE/ASSEMBLY VISUAL_INSPECTION Simpson,Liana Rae 4 months ago 4 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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