20UPGM24211042 (ANL_ITkPix_118)

MODULE/UNHAPPY

Component Information

Serial Number 20UPGM24211042
ProdDB ID  7885f2…de6d0f
LocalDB ID 689254450f647c459cade092
Component Type MODULE
Parents No match.
Children 20UPGB43200221 Bare Module 20UPGFC0141686 FE Chip 20UPGFC0141656 FE Chip 20UPGFC0141707 FE Chip 20UPGFC0141769 FE Chip 20UPGPQ4211042 PCB
Flags •  BAD_FECHIP1_DISABLED
•  BAD_FECHIP2_DISABLED
•  BAD_FECHIP3_DISABLED
•  BAD_FECHIP4_DISABLED
•  INFO_CORE_COLUMN
•  PROBLEMATIC_CORE_COLUMN
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal False
Alternative ID ANL_ITkPix_118
Wirebond protection roof presence None
Rank None
Is preproduction module None

 Comments


Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)


Result of Wirebond Pull Test

Scan

Key Data
component id 689254450f647c459cade092
Stage MODULE/WIREBONDING
test Type WIREBOND_PULL_TEST
institute 64657cef8d79bac1f3f00578
user Simpson,Liana Rae

Result

Key Data
properties {'OPERATOR_IDENTITY': 'Tim Cundiff', 'INSTRUMENT': 'Dage', 'ANALYSIS_VERSION': 'in webApp', 'MEASUREMENT_DATE': '2025-08-18T08:39Z'} g
WIRE_PULLS 25 g
PULL_STRENGTH 9.68604 g
PULL_STRENGTH_ERROR 0.7986725752772533 g
WIRE_BREAKS_5G 0 g
PULL_STRENGTH_MIN 7.4129 g
PULL_STRENGTH_MAX 11.081 g
HEEL_BREAKS_ON_FE_CHIP 100 g
HEEL_BREAKS_ON_PCB 0 g
BOND_PEEL 0 g
LIFT_OFFS_LESS_THAN_7G 0 g
PULL_STRENGTH_DATA [[[9.7466, 2, 1], [10.253, 2, 1], [9.9827, 2, 1], [9.9821, 2, 1], [10.285, 2, 1], [9.7807, 2, 1], [10.775, 2, 1], [9.9709, 2, 1], [9.7539, 2, 1], [11.081, 2, 1], [9.9209, 2, 2], [10.253, 2, 2], [10.001, 2, 2], [9.1272, 2, 2], [11.008, 2, 2], [8.982, 2, 3], [8.8755, 2, 3], [9.2706, 2, 3], [7.4129, 2, 3], [8.9016, 2, 3], [8.515, 2, 3], [9.6067, 2, 3], [9.3224, 2, 3], [9.8579, 2, 3], [9.4854, 2, 3]]] g
DATA_UNAVAILABLE False g

ProductionDB Record

id68b71e2daade37d6b78b4bba
stateready
stateTs2025-09-02T16:41:17.532Z
stateUserIdentity1294-8027-1
date2025-08-18T08:39:00.000Z
testType
id63fb635d4069b50036d3faac
codeWIREBOND_PULL_TEST
nameWirebond pull test
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id6797ca0f2ffbf908f24868f9
userIdentity1294-8027-1
firstNameSimpson,
middleName
lastNameLiana Rae
runNumber...
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
OPERATOR_IDENTITYOperator NamestringsingleFalseTim CundiffNoneNone
INSTRUMENTInstrumentstringsingleFalseDageNoneNone
ANALYSIS_VERSIONAnalysis VersionstringsingleFalsein webAppNoneNone
MEASUREMENT_DATEDate measurement performeddatetimeNoneFalse2025-08-18T08:39ZNoneNone
results
  • codeWIRE_PULLS
    nameNumber of wires pulled
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value25
    associateChildNone
  • codePULL_STRENGTH
    nameMean pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value9.68604
    associateChildNone
  • codePULL_STRENGTH_ERROR
    nameStd deviation of pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0.7986725752772533
    associateChildNone
  • codeWIRE_BREAKS_5G
    nameNumber of wires breaking before 5g
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codePULL_STRENGTH_MIN
    nameMinimum pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value7.4129
    associateChildNone
  • codePULL_STRENGTH_MAX
    nameMaximum pull strength [g]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value11.081
    associateChildNone
  • codeHEEL_BREAKS_ON_FE_CHIP
    namePercentage of heel breaks on FE chips [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value100
    associateChildNone
  • codeHEEL_BREAKS_ON_PCB
    namePercentage of heel breaks on PCB [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codeBOND_PEEL
    namePercentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codeLIFT_OFFS_LESS_THAN_7G
    namePercentage of liftoffs < 7g [%]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value0
    associateChildNone
  • codePULL_STRENGTH_DATA
    namePull strength data
    order1
    dataTypefloat
    valueTypearray
    arrayDimensions3
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value
        • 9.7466
        • 2
        • 1
        • 10.253
        • 2
        • 1
        • 9.9827
        • 2
        • 1
        • 9.9821
        • 2
        • 1
        • 10.285
        • 2
        • 1
        • 9.7807
        • 2
        • 1
        • 10.775
        • 2
        • 1
        • 9.9709
        • 2
        • 1
        • 9.7539
        • 2
        • 1
        • 11.081
        • 2
        • 1
        • 9.9209
        • 2
        • 2
        • 10.253
        • 2
        • 2
        • 10.001
        • 2
        • 2
        • 9.1272
        • 2
        • 2
        • 11.008
        • 2
        • 2
        • 8.982
        • 2
        • 3
        • 8.8755
        • 2
        • 3
        • 9.2706
        • 2
        • 3
        • 7.4129
        • 2
        • 3
        • 8.9016
        • 2
        • 3
        • 8.515
        • 2
        • 3
        • 9.6067
        • 2
        • 3
        • 9.3224
        • 2
        • 3
        • 9.8579
        • 2
        • 3
        • 9.4854
        • 2
        • 3
    associateChildNone
  • codeDATA_UNAVAILABLE
    nameData unavailable
    dataTypeboolean
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueFalse
    associateChildNone
cts2025-09-02T16:41:17.533Z
sys
cts2025-09-02T16:41:17.533Z
mts2025-09-02T16:41:17.533Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
689254450f647c459cade0927885f204b0a397d89ed277f5bdde6d0fready2025-08-05T18:58:13.346Z1294-8027-1FalseFalseNoneNoneFalseNoneNone20UPGM24211042ANL_ITkPix_118
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueFalse
  • codeALTERNATIVE_IDENTIFIER
    nameAlternative ID
    dataTypestring
    requiredFalse
    defaultTrue
    valueANL_ITkPix_118
codeMODULE/WIREBONDING
nameWire Bonding
order2
initialFalse
finalFalse
codeANL
nameArgonne National Laboratory

 Current Stage: Module unhappy - failed test, needs investigation

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
TestRun Present
IV measurement
(IV_MEASURE)
No TestRun!

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
68b71e…8b4bba WIREBOND_PULL_TEST Pass Simpson,Liana Rae N/A 9 months ago in webApp No tags Selected
68b71b…7916ff WIREBONDING Pass Simpson,Liana Rae N/A 9 months ago No tags Selected
68b71b…8b48ea WIREBONDING Pass Simpson,Liana Rae N/A 9 months ago No tags
68b200…335748 VISUAL_INSPECTION Pass Simpson,Liana Rae 10 months ago 10 months ago 2.6.4 No tags Selected

Past QC Stages and Results

Ranking of the module (MODULE/QC_STATUS)

Test Local Result ProdDB Record
Module ranking
(RANKING)
No result N/A

Final flatness measurement (MODULE/FINAL_METROLOGY)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Final Cold (MODULE/FINAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Final Warm (MODULE/FINAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Longterm stability DCS
(LONG_TERM_STABILITY_DCS)
No result N/A

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Thermal Cycling
(THERMAL_CYCLING)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A
Wire bonding protection roof envelope
(WP_ENVELOPE)
No result N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test Local Result ProdDB Record
Parylene (de-)masking
(DE_MASKING)
No result N/A
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
Flatness
(FLATNESS)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test Local Result ProdDB Record
Parylene Properties
(PARYLENE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test Local Result ProdDB Record
Parylene (de-)masking
(DE_MASKING)
No result N/A
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial Cold (MODULE/INITIAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Registered
Wirebonding Information
(WIREBONDING)
Registered Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Registered
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
69a214…d9d1c0 MODULE/UNHAPPY E_SUMMARY DavidJiang N/A 3 months ago No tags Selected
69b977…623639 MODULE/INITIAL_WARM IV_MEASURE DavidJiang 4 months ago 3 months ago No tags Selected
699f79…793a51 MODULE/INITIAL_WARM E_SUMMARY DavidJiang N/A 3 months ago No tags Selected
68b71e…8b4bba MODULE/WIREBONDING WIREBOND_PULL_TEST Simpson,Liana Rae N/A 9 months ago No tags Selected
68b71b…7916ff MODULE/WIREBONDING WIREBONDING Simpson,Liana Rae N/A 9 months ago No tags Selected
68b71b…8b48ea MODULE/WIREBONDING WIREBONDING Simpson,Liana Rae N/A 9 months ago No tags
68b71a…791216 MODULE/ASSEMBLY QUAD_MODULE_METROLOGY Simpson,Liana Rae N/A 9 months ago No tags Selected
68b718…79085d MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH Simpson,Liana Rae N/A 9 months ago No tags Selected
68b717…790363 MODULE/ASSEMBLY MASS_MEASUREMENT Simpson,Liana Rae N/A 9 months ago No tags Selected
68b200…335748 MODULE/WIREBONDING VISUAL_INSPECTION Simpson,Liana Rae 10 months ago 10 months ago No tags Selected
68b0ad…335696 MODULE/ASSEMBLY VISUAL_INSPECTION Simpson,Liana Rae 10 months ago 10 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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