Database for ITk Pixel Module

Serial Number	20UPGM24210274
ProdDB ID	c3c087…a290e4
LocalDB ID	68924f650f647c459cadd935
Component Type	MODULE
Parents	No match.
Children	20UPGB43200213 Bare Module 20UPGFC0141730 FE Chip 20UPGFC0141731 FE Chip 20UPGFC0141669 FE Chip 20UPGFC0141700 FE Chip 20UPGPQ4210274 PCB
Flags	• ANOMALOUS_IV • BAD_FECHIP1_COM_LPMODE • BAD_FECHIP1_COMMUNICATION • BAD_FECHIP1_DISABLED • BAD_FECHIP2_COM_LPMODE • BAD_FECHIP2_COMMUNICATION • BAD_FECHIP2_DISABLED • BAD_FECHIP3_COM_LPMODE • BAD_FECHIP3_COMMUNICATION • BAD_FECHIP3_DISABLED • BAD_FECHIP4_COM_LPMODE • BAD_FECHIP4_COMMUNICATION • BAD_FECHIP4_DISABLED • PROBLEMATIC_CORE_COLUMN

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Alternative ID	ANL_ITkPix_110
Wirebond protection roof presence	None
Rank	None
Is preproduction module	None

Key	Data
QC Passed	True
Date	9 months ago
component ObjectId	68924f650f647c459cadd935
Stage	MODULE/ASSEMBLY
Test Type	QUAD_MODULE_METROLOGY
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	68b719f7f8f574b1b5dfdfcc
ObjectId of RAW record	None
Tags	No tags

Key	Data
DISTANCE_PCB_BARE_MODULE_TOP_LEFT	[2118.98, 717.05]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT	[2271.46, 778.1700000000001]
AVERAGE_THICKNESS	[656, 643, 649, 656]
STD_DEVIATION_THICKNESS	[1, 6, 6, 1]
THICKNESS_VARIATION_PICKUP_AREA	5
THICKNESS_INCLUDING_POWER_CONNECTOR	1960
HV_CAPACITOR_THICKNESS	2266

Expand ProductionDB Record

68b719f7f8f574b1b5dfdfcc

state

ready

stateTs

2025-09-02T16:23:19.205Z

stateUserIdentity

1294-8027-1

date

2025-08-11T09:06:24.000Z

testType

id	627a356dba163f000ab63233
code	QUAD_MODULE_METROLOGY
name	Quad Module Metrology
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

passed

True

problems

False

properties

results

code	DISTANCE_PCB_BARE_MODULE_TOP_LEFT
name	Distance of PCB fiducial to bare module fiducial top left (x and y) [µm]
order	1
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2118.98 717.05
associateChild	None

code	DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
name	Distance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
order	1
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2271.46 778.1700000000001
associateChild	None

code AVERAGE_THICKNESS
name Average module thickness at FE chip pick-up areas, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
656
643
649
656
associateChild None
code STD_DEVIATION_THICKNESS
name Std deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
1
6
6
1
associateChild None
code THICKNESS_VARIATION_PICKUP_AREA
name Thickness variation of the 4 pick-up areas [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 5
associateChild None

code	THICKNESS_INCLUDING_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [µm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1960
associateChild	None

code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 2266
associateChild None

cts

2025-09-02T16:23:19.205Z

sys

cts	2025-09-02T16:23:19.205Z
mts	2025-09-02T16:23:19.205Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68924f650f647c459cadd935

c3c087e9b064300849b13158e6a290e4

ready

2025-08-05T18:37:25.360Z

1294-8027-1

False

None

False

None

20UPGM24210274

ANL_ITkPix_110

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value ANL_ITkPix_110

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	ANL
name	Argonne National Laboratory

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	TestRun Present
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
68b719…dfdfcc	QUAD_MODULE_METROLOGY	Pass	Simpson,Liana Rae	N/A	9 months ago		No tags	Selected
68b718…8b3aaf	GLUE_MODULE_FLEX_ATTACH	Pass	Simpson,Liana Rae	N/A	9 months ago		No tags	Selected
68b716…8b33f0	MASS_MEASUREMENT	Pass	Simpson,Liana Rae	N/A	9 months ago	in webApp	No tags	Selected
68b0c3…acc074	QUAD_MODULE_METROLOGY	Pass	Simpson,Liana Rae	N/A	10 months ago		No tags
68b0c2…582ffe	MASS_MEASUREMENT	Pass	Simpson,Liana Rae	N/A	10 months ago	in webApp	No tags
68b0a6…335686	VISUAL_INSPECTION	Pass	Simpson,Liana Rae	10 months ago	10 months ago	2.6.4	No tags	Selected
68b0c0…582cf7	GLUE_MODULE_FLEX_ATTACH	Pass	Simpson,Liana Rae	N/A	10 months ago		No tags

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	Registered	Registered
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	Registered	Registered
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68f7e0…ba898b	MODULE/PARYLENE_UNMASKING	DE_MASKING	DavidJiang	8 months ago	3 months ago	No tags	Selected
68f7e1…ba899c	MODULE/PARYLENE_UNMASKING	VISUAL_INSPECTION	DavidJiang	8 months ago	3 months ago	No tags	Selected
68f7df…ba895f	MODULE/PARYLENE_COATING	PARYLENE	DavidJiang	8 months ago	3 months ago	No tags	Selected
68f7de…ba892f	MODULE/PARYLENE_MASKING	DE_MASKING	DavidJiang	8 months ago	3 months ago	No tags	Selected
68f7df…ba8932	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	DavidJiang	8 months ago	3 months ago	No tags	Selected
69b974…62347a	MODULE/INITIAL_WARM	IV_MEASURE	DavidJiang	9 months ago	3 months ago	No tags	Selected
68d6ed…87db0b	MODULE/INITIAL_WARM	E_SUMMARY	DavidJiang	N/A	3 months ago	No tags	Selected
69010a…baabd4	MODULE/POST_PARYLENE_WARM	IV_MEASURE	DanielAceves	8 months ago	5 months ago	No tags	Selected
68b71d…791975	MODULE/WIREBONDING	WIREBOND_PULL_TEST	Simpson,Liana Rae	N/A	9 months ago	No tags	Selected
68b71b…dfe74e	MODULE/WIREBONDING	WIREBONDING	Simpson,Liana Rae	N/A	9 months ago	No tags	Selected
68b719…dfdfcc	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	Simpson,Liana Rae	N/A	9 months ago	No tags	Selected
68b718…8b3aaf	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	Simpson,Liana Rae	N/A	9 months ago	No tags	Selected
68b716…8b33f0	MODULE/ASSEMBLY	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	9 months ago	No tags	Selected
68b1f6…335715	MODULE/WIREBONDING	VISUAL_INSPECTION	Simpson,Liana Rae	10 months ago	10 months ago	No tags	Selected
68b0c3…acc074	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	Simpson,Liana Rae	N/A	10 months ago	No tags
68b0c2…582ffe	MODULE/ASSEMBLY	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	10 months ago	No tags
68b0a6…335686	MODULE/ASSEMBLY	VISUAL_INSPECTION	Simpson,Liana Rae	10 months ago	10 months ago	No tags	Selected
68b0c0…582cf7	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	Simpson,Liana Rae	N/A	10 months ago	No tags

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM24210274 (ANL_ITkPix_110)

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Post-Parylene Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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