Database for ITk Pixel Module

Serial Number	20UPGM23210331
ProdDB ID	2858f4…ff3fcb
LocalDB ID	68507c89e85f5d0f12b32eec
Component Type	MODULE
Parents	No match.
Children	20UPGB43200163 Bare Module 20UPGPQ2210331 PCB 20UPGFC0142154 FE Chip 20UPGFC0142187 FE Chip 20UPGFC0142182 FE Chip 20UPGFC0142220 FE Chip 20UPGB43200163 Bare Module 20UPGFC0142154 FE Chip 20UPGPQ2210331 PCB 20UPGFC0142187 FE Chip 20UPGFC0142182 FE Chip 20UPGFC0142220 FE Chip
Flags	• FE chip 3 – no communication • FE chip 4 – no communication • Problematic core column (can't be masked with current tool)

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Is preproduction module	True
Alternative ID	ANL_ITkPix_88
Wirebond protection roof presence	None
Rank	None

Key	Data
component id	68507c89e85f5d0f12b32eec
Stage	MODULE/WIREBONDING
test Type	WIREBONDING
institute	64657cef8d79bac1f3f00578
user	DanielAceves

Key	Data
properties	{'BONDING_JIG': None, 'BOND_PROGRAM': 'BJ855-0082', 'BOND_WIRE_BATCH': '117110001692494', 'MACHINE': 'Hesse Mechatronics Bondjet BJ856', 'MEASUREMENT_DATE': '2025-06-18T19:10:00Z', 'OPERATOR_IDENTITY': 'Tim Cundiff'}
HUMIDITY	51
IREF_TRIM_BIT_1	6
IREF_TRIM_BIT_2	10
IREF_TRIM_BIT_3	6
IREF_TRIM_BIT_4	10
REWORKED_WIRE_BONDS	1
TEMPERATURE	20

Expand ProductionDB Record

688a44cf0f647c459c6a615d

state

ready

stateTs

2025-07-30T16:14:07.192Z

stateUserIdentity

4728-7541-1

date

2025-07-15T16:49:00.000Z

testType

id	5d13255102c38f00090aab47
code	WIREBONDING
name	Wirebonding Information
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6526ef19d2e4250042313864
userIdentity	4728-7541-1
firstName	Daniel
middleName
lastName	Aceves

runNumber

687686963942dab85ae2faf7

passed

True

problems

False

properties

code BONDING_JIG
name Bonding Jig
dataType string
valueType single
required False
value None
code BOND_PROGRAM
name Bond Program
dataType string
valueType single
required False
value BJ855-0082
code BOND_WIRE_BATCH
name Bond wire batch
dataType string
valueType single
required False
value 117110001692494
code MACHINE
name Machine Used
dataType string
valueType single
required False
value Hesse Mechatronics Bondjet BJ856
rangeMin None
rangeMax None
code MEASUREMENT_DATE
name Date wirebonding performed
dataType datetime
valueType None
required False
value 2025-06-18T19:10:00Z
rangeMin None
rangeMax None
code OPERATOR_IDENTITY
name Operator Name
dataType string
valueType single
required False
value Tim Cundiff
rangeMin None
rangeMax None

results

code HUMIDITY
name Humidity (%)
dataType float
valueType single
arrayDimensions None
additional False
value 51
associateChild None
code IREF_TRIM_BIT_1
name IREF Trim Bit FE1 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 6
associateChild None
code IREF_TRIM_BIT_2
name IREF Trim Bit FE2 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 10
associateChild None
code IREF_TRIM_BIT_3
name IREF Trim Bit FE3 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 6
associateChild None
code IREF_TRIM_BIT_4
name IREF Trim Bit FE4 (as bonded)
dataType integer
valueType single
arrayDimensions None
additional False
value 10
associateChild None
code REWORKED_WIRE_BONDS
name Number of reworked wirebonds
dataType codeTable
valueType single
arrayDimensions None
additional False
value 1
associateChild None
codeTable
code value
1 none
2 few (1-5)
3 many (>5)
code TEMPERATURE
name Temperature (degC)
dataType float
valueType single
arrayDimensions None
additional False
value 20
associateChild None

cts

2025-07-30T16:14:07.192Z

sys

cts	2025-07-30T16:14:07.192Z
mts	2025-07-30T16:14:07.192Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

68507c89e85f5d0f12b32eec

2858f400b6c130523e6e0d4bb9ff3fcb

ready

2025-06-16T20:20:25.603Z

4728-7541-1

False

None

False

None

20UPGM23210331

ANL_ITkPix_88

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code IS_PREPRODUCTION_MODULE
name Is preproduction module
dataType boolean
required False
default False
value True
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value ANL_ITkPix_88

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	ANL
name	Argonne National Laboratory

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	TestRun Present
Visual Inspection (VISUAL_INSPECTION)	TestRun Present

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
687818…258ede	VISUAL_INSPECTION	Pass	DanielAceves	5 months ago	5 months ago	2.6.3	No tags	Selected
6876b9…4d1f2e	WIREBOND_PULL_TEST	Pass	DanielAceves	N/A	5 months ago	in webApp	No tags	Selected
687686…e2faf7	WIREBONDING	Pass	DanielAceves	N/A	5 months ago		No tags	Selected

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
693caf…5f36be	MODULE/POST_PARYLENE_WARM	IV_MEASURE	None	3 days ago	3 days ago	ganymede_4	Selected
693ca4…5f36b4	MODULE/POST_PARYLENE_WARM	IV_MEASURE	None	3 days ago	3 days ago	ganymede_4
692e3a…a2cec2	MODULE/POST_PARYLENE_WARM	IV_MEASURE	None	2 weeks ago	2 weeks ago	ganymede_4
68dafa…d41b28	MODULE/POST_PARYLENE_WARM	VISUAL_INSPECTION	None	3 months ago	3 months ago	No tags	Selected
68c9cd…6c48b6	MODULE/PARYLENE_UNMASKING	VISUAL_INSPECTION	Simpson,Liana Rae	3 months ago	3 months ago	No tags	Selected
68c9bd…6c4605	MODULE/PARYLENE_COATING	VISUAL_INSPECTION	Simpson,Liana Rae	3 months ago	3 months ago	No tags	Selected
68c9b2…6c4557	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	Simpson,Liana Rae	3 months ago	3 months ago	No tags	Selected
688a49…7d161f	MODULE/INITIAL_WARM	IV_MEASURE	DanielAceves	5 months ago	5 months ago	No tags	Selected
688bac…7d1fa0	MODULE/INITIAL_WARM	E_SUMMARY	DanielAceves	N/A	5 months ago	No tags	Selected
687818…258ede	MODULE/WIREBONDING	VISUAL_INSPECTION	DanielAceves	5 months ago	5 months ago	No tags	Selected
6876b9…4d1f2e	MODULE/WIREBONDING	WIREBOND_PULL_TEST	DanielAceves	N/A	5 months ago	No tags	Selected
687686…e2faf7	MODULE/WIREBONDING	WIREBONDING	DanielAceves	N/A	5 months ago	No tags	Selected
686c17…fa5747	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	DanielAceves	N/A	5 months ago	No tags	Selected
6866f4…05c24f	MODULE/ASSEMBLY	VISUAL_INSPECTION	DanielAceves	5 months ago	5 months ago	No tags	Selected
6866fc…67c4c9	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	DanielAceves	N/A	5 months ago	No tags	Selected
68657f…05be16	MODULE/ASSEMBLY	MASS_MEASUREMENT	DanielAceves	6 months ago	5 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23210331 (ANL_ITkPix_88)

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBONDING QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebonding Information

Scan

Result

Property

ProductionDB Record

Current Stage: Post-Parylene Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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