20UPGB13200055

MODULE/QC_CROSSCHECK

Component Information

Serial Number	20UPGB13200055
ProdDB ID	c0853c…b9dd2e
LocalDB ID	683ef91c9f4d7e6ede6db148
Component Type	BARE_MODULE
Parents	20UPIM54304211
Children	20UPGFC0145236 FE Chip 20UPIS17100345 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	2
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: SINGLE_BARE_MODULE_METROLOGY QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	3 months ago
component ObjectId	683ef91c9f4d7e6ede6db148
Stage	BAREMODULERECEPTION
Test Type	SINGLE_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	RiccardoZanzottera
ObjectId of this record	68c7e2ec1a8dab767bfcee82
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
BARE_MODULE_HEIGHT	21.199
BARE_MODULE_THICKNESS	0.43804
BARE_MODULE_THICKNESS_RANGE	[0.4329, 0.4474]
FECHIP_THICKNESS	0.15944999999999998
FECHIP_THICKNESS_RANGE	[0.1578, 0.1611]
FM_TO_FE_LEFTEDGE	0.101
FM_TO_FE_RIGHTEDGE	0.105
FM_TO_SENSOR_LEFTEDGE	0.246
FM_TO_SENSOR_RIGHTEDGE	0.218
LENGTH_PRECISION	0.001
SENSOR_X	20.353
SENSOR_Y	19.566

ProductionDB Record

Expand ProductionDB Record

68c7e2ec1a8dab767bfcee82

state

ready

stateTs

2025-09-15T09:57:00.289Z

stateUserIdentity

1237-9341-1

date

2025-09-12T10:42:32.394Z

testType

id	65ef2e1657a6a40035a71465
code	SINGLE_BARE_MODULE_METROLOGY
name	Single Bare Module Metrology
state	active

institution

id	5d41d8ddf6e07b000a559aee
code	INFN_MILANO
name	INFN Milano

user

id	64b11615df91d20042b5df92
userIdentity	1237-9341-1
firstName	Riccardo
middleName
lastName	Zanzottera

runNumber

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	rangeMin	rangeMax	value	associateChild
BARE_MODULE_HEIGHT	Max bare module height [mm]	float	single	None	False	-1	31.215	21.199	None
BARE_MODULE_THICKNESS	Average bare module thickness [mm]	float	single	None	False	None	None	0.43804	None
BARE_MODULE_THICKNESS_RANGE	Range of bare module thickness [mm]	float	array	1	False	None	None	0.4329 0.4474	None
FECHIP_THICKNESS	Average FE chip thickness [mm]	float	single	None	False	-1	1	0.15944999999999998	None
FECHIP_THICKNESS_RANGE	Range of FE chip thickness [mm]	float	array	1	False	None	None	0.1578 0.1611	None
FM_TO_FE_LEFTEDGE	FM to FE left edge [mm]	float	single	None	False	0.01	0.22	0.101	None
FM_TO_FE_RIGHTEDGE	FM to FE right edge [mm]	float	single	None	False	None	None	0.105	None
FM_TO_SENSOR_LEFTEDGE	FM to Sensor left edge [mm]	float	single	None	False	None	None	0.246	None
FM_TO_SENSOR_RIGHTEDGE	FM to Sensor right edge [mm]	float	single	None	False	None	None	0.218	None
LENGTH_PRECISION	Length Precision [mm]	float	single	None	False	None	None	0.001	None
SENSOR_X	Max Sensor X [mm]	float	single	None	False	-1	30	20.353	None
SENSOR_Y	Max Sensor Y [mm]	float	single	None	False	-1	30	19.566	None

cts

2025-09-15T09:57:00.290Z

sys

cts	2025-09-15T09:57:00.290Z
mts	2025-09-15T09:57:00.290Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

683ef91c9f4d7e6ede6db148

c0853cd7d87683e4320e0951d5b9dd2e

ready

2025-06-03T13:31:08.643Z

23-6780-1

False

None

False

None

20UPGB13200055

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	SINGLE_BARE_MODULE
name	Single bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

L0 inner pixel 3D sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: QC cross-check (module swapping)

No tests are allocated for this stage.

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	No result	N/A
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68c7e2…fcee82	BAREMODULERECEPTION	SINGLE_BARE_MODULE_METROLOGY	RiccardoZanzottera	N/A	3 months ago	No tags	Selected
6888fe…0568f0	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	AnnaRaquel Petri	N/A	5 months ago	No tags
686ce5…a346df	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	ClaudiaGemme	N/A	5 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB13200055

MODULE/QC_CROSSCHECK

Component Information

Distribution of chips on wafer

Properties

Comments

Test: SINGLE_BARE_MODULE_METROLOGY QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: QC cross-check (module swapping)

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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