20UPGB43200440

MODULE/POST_PARYLENE_COLD

Component Information

Serial Number 20UPGB43200440
ProdDB ID  08ee8f…56d406
LocalDB ID 683ecb8a6945881eaa97e1cf
Component Type BARE_MODULE
Parents 20UPGM24211640
Children 20UPGFC0146083 FE Chip 20UPGFC0146085 FE Chip 20UPGFC0146073 FE Chip 20UPGFC0146087 FE Chip 20UPGS33305160 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 2
Thickness of FE chips (RD53A) None

 Comments


Test: QUAD_BARE_MODULE_METROLOGY QC Failed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed False
Date 9 months ago
component ObjectId 683ecb8a6945881eaa97e1cf
Stage BAREMODULERECEPTION
Test Type QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name ElizaHoward
ObjectId of this record 688bd1940f647c459c7738a6
ObjectId of RAW record None
Tags No tags

Results

Key Data
BARE_MODULE_THICKNESS 348.1
BARE_MODULE_THICKNESS_STD_DEVIATION 2.6
FECHIPS_X 42.26176
FECHIPS_Y 40.30318
FECHIP_THICKNESS 169
FECHIP_THICKNESS_STD_DEVIATION 2
SENSOR_X 39.53351
SENSOR_Y 41.11865

ProductionDB Record

id688bd1940f647c459c7738a6
stateready
stateTs2025-07-31T20:27:00.592Z
stateUserIdentity4561-2270-1
date2025-07-09T11:29:16.000Z
testType
id5f87e63950d75e000a335aac
codeQUAD_BARE_MODULE_METROLOGY
name Quad Bare Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id68755ce03942dab85ad88269
userIdentity4561-2270-1
firstNameEliza
middleName
lastNameHoward
runNumber1
passedFalse
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
BARE_MODULE_THICKNESSAverage bare module thickness [µm]floatsingleNoneFalse348.1None
BARE_MODULE_THICKNESS_STD_DEVIATIONStd deviation of bare module thickness [µm]floatsingleNoneFalse2.6None
FECHIPS_XFE chips x dimension [mm]floatsingle1False42.26176None
FECHIPS_YFE chips y dimension [mm]floatsingle1False40.30318None
FECHIP_THICKNESSAverage FE chip thickness [µm]floatsingleNoneFalse169None
FECHIP_THICKNESS_STD_DEVIATIONStd deviation of FE chip thickness [µm]floatsingleNoneFalse2None
SENSOR_XSensor dimension in x [mm]floatsingleNoneFalse39.53351None
SENSOR_YSensor dimension in y [mm]floatsingleNoneFalse41.11865None
cts2025-07-31T20:27:00.593Z
sys
cts2025-07-31T20:27:00.593Z
mts2025-07-31T20:27:00.593Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
683ecb8a6945881eaa97e1cf08ee8f2e83f7b663c4591c7a4e56d406ready2025-06-03T10:16:42.834Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB43200440None
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v2
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseIZM
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeIZM
nameFraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

 Current Stage: Post-Parylene Cold

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Registered
Flatness
(FLATNESS)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
68afdc…489b6c BAREMODULERECEPTION MASS_MEASUREMENT Simpson,Liana Rae N/A 8 months ago No tags Selected
688bd1…7738a6 BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY ElizaHoward N/A 9 months ago No tags Selected
6887e7…f9eaf8 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV Simpson,Liana Rae N/A 9 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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