Database for ITk Pixel Module

Serial Number	20UPGM23211410
ProdDB ID	7cdbe0…ca1002
LocalDB ID	6824678b9f4d7e6edeb37146
Component Type	MODULE
Parents	No match.
Children	20UPGB43200264 Bare Module 20UPGPQ4211410 PCB 20UPGFC0147514 FE Chip 20UPGFC0147643 FE Chip 20UPGFC0147828 FE Chip 20UPGFC0147810 FE Chip
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Alternative ID	Si030
Wirebond protection roof presence	None
Rank	None
Is preproduction module	None

Key	Data
component id	6824678b9f4d7e6edeb37146
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f005b4
user	NoahSiegemund

Key	Data
properties	{'ANALYSIS_VERSION': '2.6.2', 'INSTRUMENT': 'LT100', 'MEASUREMENT_DATE': '2025-06-13T12:01:21.000+00:00', 'MEASUREMENT_DURATION': -1, 'OPERATOR_IDENTITY': 'JM'} g
BOND_PEEL	0 g
DATA_UNAVAILABLE	False g
HEEL_BREAKS_ON_FE_CHIP	100 g
HEEL_BREAKS_ON_PCB	0 g
LIFT_OFFS_LESS_THAN_7G	0 g
PULL_STRENGTH	8.024 g
PULL_STRENGTH_DATA	[[[8.2, 2, 1]], [[8.8, 2, 1]], [[8.7, 2, 1]], [[8.2, 2, 1]], [[8.4, 2, 1]], [[8, 2, 1]], [[8.3, 2, 1]], [[7.9, 2, 1]], [[7.8, 2, 1]], [[8.5, 2, 1]], [[7.3, 2, 2]], [[7.5, 2, 2]], [[7.7, 2, 2]], [[7.3, 2, 2]], [[8.2, 2, 2]], [[8.8, 2, 3]], [[8.5, 2, 3]], [[7.1, 2, 3]], [[7.9, 2, 3]], [[7.7, 2, 3]], [[8.8, 2, 3]], [[7.9, 2, 3]], [[7.6, 2, 3]], [[7.3, 2, 3]], [[8.2, 2, 3]]] g
PULL_STRENGTH_ERROR	0.5101307022061439 g
PULL_STRENGTH_MAX	8.8 g
PULL_STRENGTH_MIN	7.1 g
WIRE_BREAKS_5G	0 g
WIRE_PULLS	25 g

_id

684c13b2af6ec578d8e5c114

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGM23211410

WIREBOND_PULL_TEST

property

INSTRUMENT	LT100
ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	JM
WIREBOND_PULL_TEST_MEASUREMENT_VERSION	0.1.1.dev7

comment

Metadata

QCHELPER_VERSION

0.1.1.dev7

ModuleSN

20UPGM23211410

TimeStart

1749816081

pull_data

strength	break_mode
8.2	Heel break on chip
8.8	Heel break on chip
8.7	Heel break on chip
8.2	Heel break on chip
8.4	Heel break on chip
8.0	Heel break on chip
8.3	Heel break on chip
7.9	Heel break on chip
7.8	Heel break on chip
8.5	Heel break on chip
7.3	Heel break on chip
7.5	Heel break on chip
7.7	Heel break on chip
7.3	Heel break on chip
8.2	Heel break on chip
8.8	Heel break on chip
8.5	Heel break on chip
7.1	Heel break on chip
7.9	Heel break on chip
7.7	Heel break on chip
8.8	Heel break on chip
7.9	Heel break on chip
7.6	Heel break on chip
7.3	Heel break on chip
8.2	Heel break on chip

Measurements

WIRE_PULLS

None

PULL_STRENGTH

None

PULL_STRENGTH_ERROR

None

WIRE_BREAKS_5G

None

PULL_STRENGTH_MIN

None

PULL_STRENGTH_MAX

None

HEEL_BREAKS_ON_FE_CHIP

None

HEEL_BREAKS_ON_PCB

None

BOND_PEEL

None

LIFT_OFFS_LESS_THAN_7G

None

DATA_UNAVAILABLE

None

PULL_STRENGTH_DATA

None

MODULE/WIREBONDING

6824678b9f4d7e6edeb37146

1.01

64657cef8d79bac1f3f005b4

mts	2025-06-13 12:04:02.860000
cts	2025-06-13 12:04:02.860000
rev	0

rawHash

8b476a51f02b5e9ac9a901952b0b30b3

stage

MODULE/WIREBONDING

ProductionDB Record

Expand ProductionDB Record

686f6f88207cb99648b9fa88

state

ready

stateTs

2025-07-10T07:45:12.313Z

stateUserIdentity

9513-4539-1

date

2025-06-13T12:04:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5ecf2e4593e5ee000a0e5b19
code	SIEGEN
name	Universitaet Siegen

user

id	640b25d381d7d60036126913
userIdentity	9513-4539-1
firstName	Noah
middleName
lastName	Siegemund

runNumber

686f6f1ccc80786e5184e215

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.6.2	None	None
INSTRUMENT	Instrument	string	single	False	LT100	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-06-13T12:01:21.000+00:00	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	-1	None	None
OPERATOR_IDENTITY	Operator Name	string	single	False	JM	None	None

results

code BOND_PEEL
name Percentage of Lift Offs (i.e. bond peel) on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code DATA_UNAVAILABLE
name Data unavailable
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 100
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code LIFT_OFFS_LESS_THAN_7G
name Percentage of liftoffs < 7g [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.024
associateChild None

code	PULL_STRENGTH_DATA
name	Pull strength data
order	1
dataType	float
valueType	array
arrayDimensions	3
additional	False
rangeMin	None
rangeMax	None
value	8.2 2 1 8.8 2 1 8.7 2 1 8.2 2 1 8.4 2 1 8 2 1 8.3 2 1 7.9 2 1 7.8 2 1 8.5 2 1 7.3 2 2 7.5 2 2 7.7 2 2 7.3 2 2 8.2 2 2 8.8 2 3 8.5 2 3 7.1 2 3 7.9 2 3 7.7 2 3 8.8 2 3 7.9 2 3 7.6 2 3 7.3 2 3 8.2 2 3
associateChild	None

code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.5101307022061439
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.8
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.1
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 25
associateChild None

cts

2025-07-10T07:45:12.313Z

sys

cts	2025-07-10T07:45:12.313Z
mts	2025-07-10T07:45:13.165Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

0e73072235633dae82bac5ce07ceec7d

2025-07-10T07:45:12.472Z

RAW

text/plain

file

True

data

id	640b25d381d7d60036126913
userIdentity	9513-4539-1
firstName	Noah
middleName
lastName	Siegemund

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6824678b9f4d7e6edeb37146

7cdbe066845e4598fe7dbd98ecca1002

ready

2025-05-14T09:51:07.481Z

6253-1808-1

False

None

False

None

20UPGM23211410

Si030

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value Si030

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	SIEGEN
name	Universitaet Siegen

Test Type	Local Result
Parylene Properties (PARYLENE)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
683421…b3b569	VISUAL_INSPECTION	Pass	NoahSiegemund	7 months ago	5 months ago	2.4.1	No tags	Selected
686f6f…84e215	WIREBOND_PULL_TEST	Pass	NoahSiegemund	6 months ago	5 months ago	2.6.2	No tags	Selected

Past QC Stages and Results

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	No result	N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	Registered	Registered
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68b6a2…d5d3c2	MODULE/PARYLENE_MASKING	VISUAL_INSPECTION	OlivierFox	3 months ago	3 months ago	No tags	Selected
686ba6…398b68	MODULE/INITIAL_COLD	IV_MEASURE	WolfgangWalkowiak	6 months ago	5 months ago	No tags	Selected
686e39…84dd5b	MODULE/INITIAL_COLD	E_SUMMARY	WolfgangWalkowiak	N/A	5 months ago	No tags	Selected
686f86…6d5e91	MODULE/INITIAL_WARM	IV_MEASURE	LeonieKrippendorf	5 months ago	5 months ago	No tags	Selected
686e33…84d783	MODULE/INITIAL_WARM	E_SUMMARY	LeonieKrippendorf	N/A	5 months ago	No tags	Selected
683421…b3b569	MODULE/WIREBONDING	VISUAL_INSPECTION	NoahSiegemund	7 months ago	5 months ago	No tags	Selected
686f6f…84e215	MODULE/WIREBONDING	WIREBOND_PULL_TEST	NoahSiegemund	6 months ago	5 months ago	No tags	Selected
68419d…73e376	MODULE/ASSEMBLY	MASS_MEASUREMENT	AlessiaZuev	N/A	6 months ago	No tags	Selected
683d98…8e25ee	MODULE/ASSEMBLY	FLATNESS	AlessiaZuev	N/A	6 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23211410 (Si030)

MODULE/PARYLENE_COATING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

RAW Results Record

ProductionDB Record

Current Stage: Parylene Coating

Candidate TestRuns of this Stage

Past QC Stages and Results

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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