20UPGPQ4810889

PCB_RECEPTION_MODULE_SITE

Component Information

Serial Number 20UPGPQ4810889
ProdDB ID  1f7a67…b9fc19
LocalDB ID 6814e9cca61e7625af23a4e5
Component Type MODULE_PCB
Parents 20UPGM24810889
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer Tecnomec
PCB design version readonly 4
PCB vendor technology readonly 8
SMD population vendor Norbit EMS AS
PCB BOM version 22

 Comments


Test: LAYER_THICKNESS QC Passed

(Stage: PCB_RECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 10 months ago
component ObjectId 6814e9cca61e7625af23a4e5
Stage PCB_RECEPTION
Test Type LAYER_THICKNESS
Institute ObjectId
User Name SnehaAmogh Naik
ObjectId of this record 684983826945881eaaf9fc52
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat v1.0
INSTRUMENT Mitutoyo Linear Gauge LG-130E
OPERATOR C. Lickley
BOTTOM_LAYER_THICKNESS 27
COVERLAY_WITH_ADHESIVE_THICKNESS 48
CU_THICKNESS 21.5
DIELECTRIC_THICKNESS 103
INNER_LAYER_THICKNESS 7
THICKNESS 247
TOP_LAYER_THICKNESS 25

ProductionDB Record

id684983826945881eaaf9fc52
stateready
stateTs2025-06-11T13:24:18.493Z
stateUserIdentity7680-5063-1
date2025-05-26T00:00:00.000Z
testType
id63ef3b1919aead0036ceca12
codeLAYER_THICKNESS
nameLayer thickness measurement
stateactive
institution
id59d60ee4ed67730005160cd9
codeGL
nameGlasgow University
user
id61ba17b23be1da000a981c71
userIdentity7680-5063-1
firstNameSneha
middleName
lastNameAmogh Naik
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvalue
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0
INSTRUMENTInstrumentstringsingleFalseMitutoyo Linear Gauge LG-130E
OPERATOROperatorstringsingleFalseC. Lickley
results
  • codeBOTTOM_LAYER_THICKNESS
    nameBottom layer thickness (including ENIG) [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value27
    associateChildNone
  • codeCOVERLAY_WITH_ADHESIVE_THICKNESS
    nameCoverlay with Adhesive thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value48
    associateChildNone
  • codeCU_THICKNESS
    nameEffective Cu thickness [µm]
    order1
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value21.5
    associateChildNone
  • codeDIELECTRIC_THICKNESS
    nameDielectric thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value103
    associateChildNone
  • codeINNER_LAYER_THICKNESS
    nameInner layer thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value7
    associateChildNone
  • codeTHICKNESS
    nameTotal PCB thickness [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value247
    associateChildNone
  • codeTOP_LAYER_THICKNESS
    nameTop layer thickness (including ENIG) [µm]
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value25
    associateChildNone
cts2025-06-11T13:24:18.493Z
sys
cts2025-06-11T13:24:18.493Z
mts2025-06-11T13:24:18.493Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6814e9cca61e7625af23a4e51f7a6737ab6591771011b2e0b1b9fc19ready2025-05-02T15:50:36.645Z7680-5063-1FalseFalseNoneNoneFalseNoneNone20UPGPQ4810889None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueTecnomec
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueProduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueTecnomec (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueNorbit EMS AS
  • codePCB_BOM_VERSION
    namePCB BOM version
    dataTypecodeTable
    requiredFalse
    defaultFalse
    valueV2 L2
    codeTable
    codevalue
    10V1.1 L0
    11V1.1 L1
    12V1.1 L2
    20V2 L0
    21V2 L1
    22V2 L2
codePCB_RECEPTION
nameReception
order1
initialFalse
finalFalse
codeGL
nameGlasgow University

 Current Stage: PCB Reception at module site

Test Type Local Result
Visual Inspection
(VISUAL_INSPECTION)
No TestRun!
Mass
(MASS)
No TestRun!
Metrology
(METROLOGY)
No TestRun!
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No TestRun!
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No TestRun!

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
684983…f9fc52 LAYER_THICKNESS Pass SnehaAmogh Naik N/A 10 months ago 1.0 No tags Selected
682e59…f457e3 DOWEL_TOLERANCE_CHECK Pass SnehaAmogh Naik N/A 11 months ago No tags Selected

Past QC Stages and Results

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result N/A
LV and HV Test
(HV_LV_TEST)
Registered Registered
Tab cutting and gross defect inspection
(QUICK_TAB_CUTTING_INSPECTION)
Registered Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result N/A
Metrology
(METROLOGY)
No result N/A
NTC Verification
(NTC_VERIFICATION)
No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)
No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)
No result N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result N/A
NTC Verification
(NTC_VERIFICATION)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)
No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result N/A
Metrology
(METROLOGY)
No result N/A
NTC Verification
(NTC_VERIFICATION)
No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)
No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)
No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
Registered Registered
Image capture test
(IMAGE_CAPTURE_TEST)
No result N/A
Layer thickness measurement
(LAYER_THICKNESS)
Registered Registered
Metrology
(METROLOGY)
No result N/A
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)
No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)
No result N/A
Via resistance
(VIA_RESISTANCE)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
696664…2661ed PCB_QC QUICK_TAB_CUTTING_INSPECTION FuatUstuner N/A 3 months ago No tags Selected
69455f…dc1c30 PCB_QC HV_LV_TEST FuatUstuner N/A 4 months ago No tags Selected
684983…f9fc52 PCB_RECEPTION LAYER_THICKNESS SnehaAmogh Naik N/A 10 months ago No tags Selected
682e59…f457e3 PCB_RECEPTION DOWEL_TOLERANCE_CHECK SnehaAmogh Naik N/A 11 months ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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