20UPGPQ4810360

MODULE/GRAVEYARD

Component Information

Serial Number	20UPGPQ4810360
ProdDB ID	0e9e46…dd9ad5
LocalDB ID	6814e9c7d10b377693beec68
Component Type	MODULE_PCB
Parents	20UPGM24810360
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Tecnomec
PCB design version readonly	4
PCB vendor technology readonly	8
PCB BOM version	22
SMD population vendor	Norbit EMS AS

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a month ago
component ObjectId	6814e9c7d10b377693beec68
Stage	PCB_RECEPTION_MODULE_SITE
Test Type	METROLOGY
Institute ObjectId
User Name	ThomasNaquin
ObjectId of this record	6992fb3c5b4dd8f5d2965515
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR	None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.225
AVERAGE_THICKNESS_POWER_CONNECTOR	1.571
DIAMETER_DOWEL_HOLE_A	N/A
HV_CAPACITOR_THICKNESS	1.879
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	False
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.006
WIDTH_DOWEL_SLOT_B	N/A
X-Y_DIMENSION_WITHIN_ENVELOP	False
X_DIMENSION	39.513
Y_DIMENSION	40.56

ProductionDB Record

Expand ProductionDB Record

6992fb3c5b4dd8f5d2965515

state

ready

stateTs

2026-02-16T11:10:52.056Z

stateUserIdentity

8769-4020-1

date

2026-02-16T11:09:00.000Z

testType

id	60255faf86dec3000ad0330d
code	METROLOGY
name	Metrology
state	active

institution

id	5d372a3becb4750009835557
code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

user

id	66e9329c0fc5b30042e7f088
userIdentity	8769-4020-1
firstName	Thomas
middleName
lastName	Naquin

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	None	None	None

results

code AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS
name Average thickness of all pick-up areas [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.225
associateChild None

code	AVERAGE_THICKNESS_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [mm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1.571
associateChild	None

code DIAMETER_DOWEL_HOLE_A
name Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value None
associateChild None
code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 1.879
associateChild None
code HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP
name HV capacitor thickness within envelop
dataType boolean
valueType single
arrayDimensions None
additional False
value False
associateChild None
code STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS
name Std deviation of thickness of all pick-up area [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.006
associateChild None
code WIDTH_DOWEL_SLOT_B
name Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value None
associateChild None
code X-Y_DIMENSION_WITHIN_ENVELOP
name X-Y dimension within envelope
order 1
dataType boolean
valueType single
arrayDimensions None
additional False
value False
associateChild None
code X_DIMENSION
name X dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 39.513
associateChild None
code Y_DIMENSION
name Y dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 40.56
associateChild None

cts

2026-02-16T11:10:52.056Z

sys

cts	2026-02-16T11:10:52.056Z
mts	2026-02-16T11:10:52.056Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6814e9c7d10b377693beec68

0e9e462377ce7e2a78d7c4801fdd9ad5

ready

2025-05-02T15:50:31.605Z

7680-5063-1

False

None

False

None

20UPGPQ4810360

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Tecnomec

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Tecnomec (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2
code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Norbit EMS AS

code	PCB_RECEPTION_MODULE_SITE
name	PCB Reception at module site
order	13
initial	False
final	False

code	GL
name	Glasgow University

Current Stage: Modules damaged, impossible to recover

No tests are allocated for this stage.

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	Registered	Registered
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	Registered	Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	Registered	Registered
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6992fb…965515	PCB_RECEPTION_MODULE_SITE	METROLOGY	ThomasNaquin	N/A	a month ago	No tags	Selected
6992fa…2439a9	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	ThomasNaquin	N/A	a month ago	No tags	Selected
6992fa…9d92ef	PCB_RECEPTION_MODULE_SITE	MASS	ThomasNaquin	N/A	a month ago	No tags	Selected
684983…cedfec	PCB_RECEPTION	LAYER_THICKNESS	SnehaAmogh Naik	N/A	10 months ago	No tags	Selected
68481d…ab043d	PCB_RECEPTION	DOWEL_TOLERANCE_CHECK	SnehaAmogh Naik	N/A	10 months ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4810360

MODULE/GRAVEYARD

Component Information

Properties

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Modules damaged, impossible to recover

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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